Abstract: The technology of this application relates to a package substrate that includes a substrate body. Each unit region includes at least one solder ball group. The solder ball group includes a first solder ball, a second solder ball, a third solder ball, a fourth solder ball, a fifth solder ball, and a sixth solder ball that are arranged at spacings. The first solder ball, the second solder ball, the third solder ball, and the fourth solder ball are respectively located at four vertices of a parallelogram, and the second solder ball and the third solder ball each are adjacent to the first solder ball. The fifth solder ball is provided on a side of the parallelogram and is located between the first solder ball and the third solder ball. The sixth solder ball is provided on another side of the parallelogram and is located between the second solder ball and the fourth solder ball.

Abstract: A package substrate includes a substrate body and a plurality of unit regions disposed on the substrate body. The unit region includes two first solder ball structures. The first solder ball structure includes six first solder balls. The six first solder balls are arranged, with two of them in a row, to form three parallel rows of two solder balls: a first row of solder balls, a second row of solder balls, and a third row of solder balls. Four first solder balls in the first row of solder balls and the second row of solder balls are respectively located at four vertices of one parallelogram, and four first solder balls in the second row of solder balls and the third row of solder balls are respectively located at four vertices of the other parallelogram, and the two parallelograms are arranged axisymmetric about the second row of solder balls.