Abstract: A method and an apparatus for controlling a vehicle mounted game, a computer program, a storage medium, and a vehicle are provided in the present disclosure. The method is applied to the VCU. The VCU controls a vehicle to be powered at a low voltage in case that it is determined that the vehicle enters a game activation state; when the vehicle is powered at the low voltage, the VUC collects an operation signal of the vehicle, in which, the operation signal includes: an accelerator pedal position signal, a brake pedal position signal, a steering wheel angle signal, and a gear position signal of the vehicle; and the VUC sends the operation signal to a vehicle HUT to enable the vehicle HUT to control the vehicle mounted game according to the operation signal.

Abstract: An apparatus for inspecting a semiconductor substrate includes a rotatable base configured to support a substrate, and a nozzle arm includes a nozzle and a light monitoring device. The light monitoring device includes a laser transmitter and an array of light sensors arranged in the nozzle arm and facing the substrate. The light monitoring device is configured to transmit a laser pulse towards the substrate, wherein the laser pulse impinges on the substrate, receive a reflected laser pulse from the substrate, calculate whether one or more light sensors received the laser pulse, and calculate a distance between the light monitoring device and the substrate using the turnaround time for determining a process quality on the substrate.

Abstract: A semiconductor manufacturing system includes: a nozzle including a first channel that allows a fluid to flow through; a light source configured to emit light; and a light sensor configured to receive light, the light source and the light sensor being disposed within the first channel and opposite to each other. The semiconductor manufacturing system is configured to: emit light, by the light source, from within the nozzle toward a surface while the nozzle is dispensing the fluid; receive the light reflected from the surface by the light sensor, the emitted light and the reflected light adapted to be contained within the fluid; and examine a status of the reflected light. The emitted light and the reflected light propagate in a direction parallel to a longitudinal axis of the first channel.

Abstract: A semiconductor wafer defect detection system captures test images of a semiconductor wafer. The system analyzes the test images with an analysis model trained with a machine learning process. The analysis model generates simulated integrated circuit layouts based on the test images. The system detects defects in the semiconductor wafer by comparing the simulated integrated circuit layouts to reference integrated circuit layouts.

Abstract: A method of manufacturing a semiconductor device includes: receiving a workpiece on which the semiconductor device is manufactured; causing a nozzle to dispense a fluid toward a surface of the workpiece external to the nozzle, wherein the nozzle includes a first channel and a second channel that allow the fluid to flow through; emitting light, by a light source, from within the nozzle toward the surface while the nozzle is dispensing the fluid; receiving light reflected from the surface by a light sensor, the light source and the light sensor being disposed within the nozzle and opposite to each other, and the emitted light and the reflected light adapted to be contained within the fluid; and examining a status of the reflected light. The emitted light and the reflected light propagate in a direction parallel to a longitudinal axis of each of the first channel and the second channel.

Abstract: An apparatus for inspecting a semiconductor substrate includes a rotatable base configured to support a substrate, and a nozzle arm includes a nozzle and a light monitoring device. The light monitoring device includes a laser transmitter and an array of light sensors arranged in the nozzle arm and facing the substrate. The light monitoring device is configured to transmit a laser pulse towards the substrate, wherein the laser pulse impinges on the substrate, receive a reflected laser pulse from the substrate, calculate whether one or more light sensors received the laser pulse, and calculate a distance between the light monitoring device and the substrate using the turnaround time for determining a process quality on the substrate.

Abstract: In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.

Abstract: Some implementations described herein provide techniques and apparatuses for a semiconductor processing tool including an electrostatic chuck having a voltage-regulation system to regulate an electrical potential throughout regions of a semiconductor substrate positioned above the electrostatic chuck. The voltage-regulation system may determine that an electrical potential within a region of the semiconductor substrate does not satisfy a threshold. The voltage-regulation system may, based on determining that the electrical potential throughout the region does not satisfy the threshold, position one or more electrically-conductive pins within the region. While positioned within the region, the one or more electrically-conductive pins may change the electrical potential of the region.

Abstract: A display panel, a method for manufacturing the display panel, and a display apparatus are provided. The display panel includes: a driving backboard including a substrate, a functional circuit and a first electrode electrically connected with the functional circuit; a connection structure located at a side of the driving backboard, the connection structure includes a first connection portion, and the first connection portion includes a first base material and a first connection metal. The first base material is not in contact with the first electrode, the first connection metal is at least partially located on a surface of the first base material away from the substrate, and the first connection metal is electrically connected to the first electrode.

Abstract: In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.

Abstract: An optical module includes: one or more optical ports, configured to receive an uplink optical signal or transmit a downlink optical signal; a downlink, configured to apply a downlink radio frequency signal converted by a radio frequency input signal to a photoelectric conversion and transmission unit; a control unit, configured to generate a downlink monitoring modulation signal applied to the photoelectric conversion and transmission unit; the photoelectric conversion and transmission unit, configured to modulate the downlink radio frequency signal and the downlink monitoring modulation signal onto a downlink optical signal, and the downlink optical signal is expanded into downlink split optical signals, and the downlink split optical signals are respectively provided to the one or more optical ports via one or more optical fibers; and an uplink, configured to convert an uplink optical signal into a radio frequency output signal.

Abstract: Some implementations described herein provide techniques and apparatuses for a semiconductor processing tool including an electrostatic chuck having a voltage-regulation system to regulate an electrical potential throughout regions of a semiconductor substrate positioned above the electrostatic chuck. The voltage-regulation system may determine that an electrical potential within a region of the semiconductor substrate does not satisfy a threshold. The voltage-regulation system may, based on determining that the electrical potential throughout the region does not satisfy the threshold, position one or more electrically-conductive pins within the region. While positioned within the region, the one or more electrically-conductive pins may change the electrical potential of the region.

Abstract: Methods and systems for diagnosing a semiconductor wafer are provided. A plurality of raw images are captured with a tilt angle from the semiconductor wafer according to graphic data system (GDS) information regarding a layout of a target die, by an inspection apparatus. A first image-based comparison is performed on the plurality of raw images, by a determining circuitry, to obtain a defect image in the plurality of raw images. A second image-based comparison is performed on a reference image and the defect image, so as to classify a defect type of an image difference in the defect image, by the determining circuitry. The number of the plurality of raw images is greater than 2.

Abstract: A torque control method and apparatus for a vehicle, including: determining whether a torque change request is received, during a process of performing an energy recovery function; determining whether an antilock brake system is in an active state, in case that the torque change request is not received; if so, decreasing an energy recovery torque with a first torque change gradient; determining whether the antilock brake system is transited from the activated state to a non-activated state, during a process of decreasing the energy recovery torque; if so, determining whether it is satisfied that a first current driver demand torque is greater than a first preset value and the antilock brake system is in the non-activated state for longer than a first preset time; and if satisfied, recovering the energy recovery torque to the first current driver demand torque with a second torque change gradient.

Abstract: This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.

Abstract: The present disclosure relates to the field of vehicle technology and provides an energy recovery control method, a system, and a vehicle. The method is applied in a vehicle, and the vehicle comprises a drive motor and a battery electrically connected to the drive motor; a first energy recovery torque curve with respect to the drive motor is pre-configured in the vehicle, and the first energy recovery torque curve is used to indicate a correspondence relationship between vehicle speed and energy recovery torque of the drive motor. The present disclosure performs reduction on a first energy recovery torque curve by means of utilizing a reduction ratio, allowing energy recovery in accordance with a relatively low torque strength when a usable charge power of the battery is unable to satisfy a preset power requirement corresponding to the first energy recovery torque curve.

Abstract: The present invention provides a packet forwarding system including a packet, a packet analyzer and a DMA module. The packet buffer is configured to receive a packet and store the packet. The packet analyzer is configured to read the packet from the packet buffer, and analyze the packet to extract part of content of the packet to generate specific data. The DMA module is configured to write the specific data into a first buffer of a storage device, and write the packet into a second buffer of the storage device.

Abstract: A semiconductor wafer defect detection system captures test images of a semiconductor wafer. The system analyzes the test images with an analysis model trained with a machine learning process. The analysis model generates simulated integrated circuit layouts based on the test images. The system detects defects in the semiconductor wafer by comparing the simulated integrated circuit layouts to reference integrated circuit layouts.

Abstract: A process tube device can detect the presence of any external materials that may reside within a fluid flowing in the tube. The process tube device detects the external materials in-situ which obviates the need for a separate inspection device to inspect the surface of a wafer after applying fluid on the surface of the wafer. The process tube device utilizes at least two methods of detecting the presence of external materials. The first is the direct measurement method in which a light detecting sensor is used. The second is the indirect measurement method in which a sensor utilizing the principles of Doppler shift is used. Here, contrary to the first method that at least partially used reflected or refracted light, the second method uses a Doppler shift sensor to detect the presence of the external material by measuring the velocity of the fluid flowing in the tube.

Abstract: Some implementations described herein provide techniques and apparatuses for a semiconductor processing tool including an electrostatic chuck having a voltage-regulation system to regulate an electrical potential throughout regions of a semiconductor substrate positioned above the electrostatic chuck. The voltage-regulation system may determine that an electrical potential within a region of the semiconductor substrate does not satisfy a threshold. The voltage-regulation system may, based on determining that the electrical potential throughout the region does not satisfy the threshold, position one or more electrically-conductive pins within the region. While positioned within the region, the one or more electrically-conductive pins may change the electrical potential of the region.