Abstract: A sub-rack for converting cooling pattern of a side-to-side cooled equipment is disclosed. According to an embodiment, the sub-rack comprises a first unit, a second cover disposed at a first lateral side of the first unit and a third cover disposed at a second lateral side of the first unit. The first unit comprises a first cover, a front side wall that is disposed at a front side of the first cover and has at least one inlet vent, a rear side wall that is disposed at a rear side of the first cover and has at least one outlet vent, and an air flow guiding member capable of guiding an air flow introduced from the at least one inlet vent to one of the first lateral side and the second lateral side of the first unit. The sub-rack further comprises. At least one cover of the second cover and the third cover is disposed to be movable relative to the first unit in a lateral direction via a first moving mechanism.

Abstract: A sub-rack for converting cooling pattern of a side-to-side cooled equipment is disclosed. According to an embodiment, the sub-rack comprises a first unit, a second cover disposed at a first lateral side of the first unit and a third cover disposed at a second lateral side of the first unit. The first unit comprises a first cover, a front side wall that is disposed at a front side of the first cover and has at least one inlet vent, a rear side wall that is disposed at a rear side of the first cover and has at least one outlet vent, and an air flow guiding member capable of guiding an air flow introduced from the at least one inlet vent to one of the first lateral side and the second lateral side of the first unit. The sub-rack further comprises. At least one cover of the second cover and the third cover is disposed to be movable relative to the first unit in a lateral direction via a first moving mechanism.

Abstract: There is disclosed an electronic device having a heat-dissipating structure. The electronic device comprises a circuit board; a heat conduction plate arranged to face the circuit board, and dissipate heat generated by the circuit board only in a direction parallel to the heat conduction plate. According to the present invention, the electronic device is particular suitable for the application wherein the electronic device will be stacked up on another electronic device and requires no any forced convection arrangement such as a fan.