Patents by Inventor Xiu-Zhong Yin

Xiu-Zhong Yin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9219258
    Abstract: A mounting apparatus for securing a battery module to an enclosure includes a bracket and a latching member. The bracket is secured to the enclosure and defines a receiving space for receiving the battery module. The latching member is attached to the bracket and includes a resilient portion and a blocking flange perpendicularly connected to the resilient portion. The blocking flange is engaged with the battery module to prevent the battery module from disengaging from the receiving space, and the resilient portion is resiliently deformable to disengage the blocking flange from the battery module so that the battery module is easily installed or detached from the enclosure without extra tools.
    Type: Grant
    Filed: August 2, 2013
    Date of Patent: December 22, 2015
    Assignee: ShenZhen Treasure City Technology Co., LTD.
    Inventors: Xiu-Zhong Yin, Xiu-Quan Hu
  • Publication number: 20150282378
    Abstract: An induction device includes a frame, a first conductive assembly, and a sliding assembly. The frame is configured to be secured to a rack. The first conductive assembly is located in the frame. The sliding assembly is mounted in the frame and includes a second conductive assembly. The second conductive assembly is slidable relative to the frame and electronically couples to the first conductive assembly during sliding, and the second conductive assembly is configured to electronically couple to a detection module during sliding. An electronic device with the induction device is further disclosed.
    Type: Application
    Filed: October 28, 2014
    Publication date: October 1, 2015
    Inventors: YING GAO, ZHEN-LEI LI, CHUNG-CHENG HSIEH, XIU-ZHONG YIN
  • Patent number: 8837137
    Abstract: An electronic device includes a chassis and a tray installed in the chassis. The tray includes a base plate which defines an opening. A limiting standoff protrudes from an inner surface of the chassis and extends through the opening of the base plate. A locking module includes a pivotable member pivotally attached to the base plate which rotates about an axis perpendicular to the base plate. When the pivotable member is rotated to a first position, the limiting standoff locks the pivotable member to prevent the tray from sliding out from the chassis. When the pivotable member is rotated to a second position, the limiting standoff unlocks the pivotable member to allow the tray sliding out from the chassis.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: September 16, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiu-Zhong Yin, Xiu-Quan Hu, Yu-Wei He
  • Patent number: 8824138
    Abstract: A baffle guides airflow into two heat areas in a heat dissipation system. Each of the two heat areas includes a plurality of slots. The baffle includes a main body, an interval portion, and a clasp. The interval portion is located on the main body. The clasp is located on the main body opposite to the interval portion. The clasp includes a resilient clip and a stand portion vertically located on the resilient clip. The stand portion is engaged with at least one of the slots. The interval portion extends between two of the plurality of slots.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: September 2, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiu-Zhong Yin, Xiu-Quan Hu
  • Publication number: 20140162103
    Abstract: A mounting apparatus for securing a battery module to an enclosure includes a bracket and a latching member. The bracket is secured to the enclosure and defines a receiving space for receiving the battery module. The latching member is attached to the bracket and includes a resilient portion and a blocking flange perpendicularly connected to the resilient portion. The blocking flange is engaged with the battery module to prevent the battery module from disengaging from the receiving space, and the resilient portion is resiliently deformable to disengage the blocking flange from the battery module so that the battery module is easily installed or detached from the enclosure without extra tools.
    Type: Application
    Filed: August 2, 2013
    Publication date: June 12, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: Xiu-Zhong YIN, Xiu-Quan HU
  • Patent number: 8749975
    Abstract: A computer system includes an enclosure, a printed circuit board, and an airflow guiding duct. The enclosure includes a bottom plate. The printed circuit board is mounted on the bottom plate. The printed circuit board includes a first heat generating element and a second heat generating element. The airflow guiding duct includes a top wall, a first sidewall, a second sidewall, a first mounting wall, and a second mounting wall. An input opening is surrounded by the top wall and the first and second sidewalls. A first output opening corresponds to the first heat generating element, and is surrounded by the top wall and the first and second mounting walls. A second output opening is defined in the second sidewall corresponding to the second heat generating element. An obtuse angle is defined between the second sidewall and the second mounting wall.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: June 10, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiu-Zhong Yin, Xiu-Quan Hu
  • Publication number: 20140003010
    Abstract: A power supply assembly includes an enclosure, a power supply, an adapter board, a mother board, and an adapter card. The power supply includes a power supply body and an inserting terminal. The adapter board includes an adapter board body, a connecting terminal, and a first inserting head extending from the adapter board body. The inserting terminal is inserted in the connecting terminal. The mother board includes a mother board body and a second inserting head. The mother board body is substantially parallel to the adapter board body. The adapter card includes an adapter card body and two connectors extending from the adapter card body. The two connectors are electronically connected to the first inserting head and the second inserting head. The adapter card body is substantially perpendicular to the mother board body and the adapter board body.
    Type: Application
    Filed: April 24, 2013
    Publication date: January 2, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: SHENG-HUNG LEE, LI-PING CHEN, XIU-ZHONG YIN, CHENG-HE LI, CHIA-KANG WU
  • Patent number: 8616662
    Abstract: An electronic device enclosure includes a chassis, a bracket received in the chassis, and a mounting assembly. The chassis includes a limiting protrusion and defines a sliding slot. The mounting assembly includes a resisting member, a rotating member and an operating member. The resisting member is secured to the bracket and includes an elastic deformable resisting portion. The rotating member is rotatably attached to the bracket and includes a first blocking portion and a blocking piece. The operating member is rotatably attached to the bracket and includes an installation portion and a second blocking portion. The installation portion is received between the blocking piece and the first blocking portion. The blocking piece is located between the resisting portion and the installation portion. The first and second blocking portions are received in the sliding slot. The limiting protrusion is blocked between the first and second blocking portions.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: December 31, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiu-Zhong Yin, Xiu-Quan Hu
  • Patent number: 8596472
    Abstract: An electronic device enclosure includes a chassis, a receiving tray, and a clipping assembly. The chassis includes a side plate and a blocking pin located on the side plate. The receiving tray includes a bottom panel and a side panel connected to the bottom panel. An opening is defined in the receiving tray and located between the bottom panel and the side panel, and the blocking pin is engaged in the opening. The clipping assembly includes a first pivoting member rotatably attached to the side panel. The first pivoting member extends towards the opening to abut the blocking pin, for prevent the receiving tray from moving out of the chassis, and the first pivoting member is rotatable to disengage from the blocking pin, for allowing the receiving tray from moving out of the chassis.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: December 3, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiu-Zhong Yin, Xiu-Quan Hu
  • Publication number: 20130163220
    Abstract: An electronic device includes a chassis and a protecting member. The chassis includes a side plate, a bottom plate substantially perpendicular to the side plate, a plurality of first components secured to the bottom plate, and a plurality of connectors located between the side plate and the plurality of first components. The plurality of connectors is adapted for connecting to a plurality of cables. The protecting member is secured to the side plate and includes a protecting plate. The protecting plate is substantially parallel to the bottom plate. The protecting plate and the bottom plate are adapted to receive the plurality of cables therebetween.
    Type: Application
    Filed: October 1, 2012
    Publication date: June 27, 2013
    Inventors: XIU-QUAN HU, XIU-ZHONG YIN
  • Publication number: 20130155625
    Abstract: A baffle guides airflow into two heat areas in a heat dissipation system. Each of the two heat areas includes a plurality of slots. The baffle includes a main body, an interval portion, and a clasp. The interval portion is located on the main body. The clasp is located on the main body opposite to the interval portion. The clasp includes a resilient clip and a stand portion vertically located on the resilient clip. The stand portion is engaged with at least one of the slots. The interval portion extends between two of the plurality of slots.
    Type: Application
    Filed: June 18, 2012
    Publication date: June 20, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: XIU-ZHONG YIN, XIU-QUAN HU
  • Publication number: 20130100593
    Abstract: An electronic device includes a chassis and a tray installed in the chassis. The tray includes a base plate which defines an opening. A limiting standoff protrudes from an inner surface of the chassis and extends through the opening of the base plate. A locking module includes a pivotable member pivotally attached to the base plate which rotates about an axis perpendicular to the base plate. When the pivotable member is rotated to a first position, the limiting standoff locks the pivotable member to prevent the tray from sliding out from the chassis. When the pivotable member is rotated to a second position, the limiting standoff unlocks the pivotable member to allow the tray sliding out from the chassis.
    Type: Application
    Filed: June 27, 2012
    Publication date: April 25, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: XIU-ZHONG YIN, XIU-QUAN HU, YU-WEI HE
  • Publication number: 20130100600
    Abstract: A computer system includes an enclosure, a printed circuit board, and an airflow guiding duct. The enclosure includes a bottom plate. The printed circuit board is mounted on the bottom plate. The printed circuit board includes a first heat generating element and a second heat generating element. The airflow guiding duct includes a top wall, a first sidewall, a second sidewall, a first mounting wall, and a second mounting wall. An input opening is surrounded by the top wall and the first and second sidewalls. A first output opening corresponds to the first heat generating element, and is surrounded by the top wall and the first and second mounting walls. A second output opening is defined in the second sidewall corresponding to the second heat generating element. An obtuse angle is defined between the second sidewall and the second mounting wall.
    Type: Application
    Filed: May 30, 2012
    Publication date: April 25, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: XIU-ZHONG YIN, XIU-QUAN HU
  • Publication number: 20130092644
    Abstract: An electronic device enclosure includes a chassis, a receiving tray, and a clipping assembly. The chassis includes a side plate and a blocking pin located on the side plate. The receiving tray includes a bottom panel and a side panel connected to the bottom panel. An opening is defined in the receiving tray and located between the bottom panel and the side panel, and the blocking pin is engaged in the opening. The clipping assembly includes a first pivoting member rotatably attached to the side panel. The first pivoting member extends towards the opening to abut the blocking pin, for prevent the receiving tray from moving out of the chassis, and the first pivoting member is rotatable to disengage from the blocking pin, for allowing the receiving tray from moving out of the chassis.
    Type: Application
    Filed: June 18, 2012
    Publication date: April 18, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    Inventors: XIU-ZHONG YIN, XIU-QUAN HU
  • Publication number: 20130093302
    Abstract: An electronic device enclosure includes a chassis, a bracket received in the chassis, and a mounting assembly. The chassis includes a limiting protrusion and defines a sliding slot. The mounting assembly includes a resisting member, a rotating member and an operating member. The resisting member is secured to the bracket and includes an elastic deformable resisting portion. The rotating member is rotatably attached to the bracket and includes a first blocking portion and a blocking piece. The operating member is rotatably attached to the bracket and includes an installation portion and a second blocking portion. The installation portion is received between the blocking piece and the first blocking portion. The blocking piece is located between the resisting portion and the installation portion. The first and second blocking portions are received in the sliding slot. The limiting protrusion is blocked between the first and second blocking portions.
    Type: Application
    Filed: May 24, 2012
    Publication date: April 18, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: XIU-ZHONG YIN, XIU-QUAN HU
  • Patent number: 8075248
    Abstract: A fan assembly (20) used for dissipating heat from an electronic device. The fan assembly includes a bracket (30) and a fan module (40). The bracket has two parallel retaining walls (31). Each retaining wall defines an opening (311) and two recesses (313) at opposite sides of the opening. The fan module is received in the bracket. The fan module includes a fan (50) and a pair of clamping members (60). The fan has a pair of fan openings in alignment with the openings of the bracket for airflow flowing therethrough. The clamping members are respectively attached to opposite sides of the fan. A pair of resilient arms (67) extends out from each clamping member. Each resilient arm has an engaging portion (671) received in the corresponding recess of one of the retaining walls. The fan module is retained in the bracket via the engaging portions engaging with the recesses and being sandwiched between the retaining walls.
    Type: Grant
    Filed: June 9, 2007
    Date of Patent: December 13, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Xiu-Zhong Yin, Lin Xiao
  • Patent number: 7821793
    Abstract: A mounting device for an electronic component includes a plate, a securing piece, and an electronic component. The plate forms a first fixing hole and an L-shaped hook. The securing piece includes a first end, an opposite second end, and at least one hole. An insert portion extends outwards from the second end, insertable into the first fixing hole of the plate. A resilient arm extends outwards from the first end and forms a second fixing hole. The hook is inserted into the second fixing hole by resilient force of the resilient arm. The electronic component forms at least one positioning block insertable into the at least one hole of the securing piece.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: October 26, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Xiu-Zhong Yin
  • Patent number: 7699692
    Abstract: A fan assembly (20) for dissipating heat from an electronic device includes a bracket (30) and a fan module (40). The bracket has a retaining wall (31). The retaining wall defines an opening (311) and two vertical slots (313) at opposite sides of the opening. The fan module includes a fan (50) and a pair of clamp members (60). The fan has a fan opening corresponding to the opening of the bracket. The clamp members are respectively attached to opposite sides of the fan. An engaging portion (62) is formed on one end of each clamp member for engaging with the corresponding slot of the bracket. Each engaging portion has a wide portion (624) configured for abutting against an outer surface of one retaining walls and a narrow portion (622) for entering to the corresponding slot.
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: April 20, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Xiu-Zhong Yin
  • Patent number: 7697287
    Abstract: A mounting apparatus for fan includes a receiving bracket for receiving the fan, and two securing boards for sandwiching the fan therebetween. The receiving bracket includes a pair of opposite sidewalls. A top flange is perpendicularly bent from a top edge of each sidewall. A slot is defined in the top flange and corresponding sidewall. The securing boards are perpendicular to the pair of sidewalls and mounted therebetween. Two securing tabs protrude laterally from two sides of each securing board and are respectively received in the slots of the receiving bracket. The securing tabs are blocked by the top flanges to prevent the securing boards moving with the fan in directions parallel to the sidewalls.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: April 13, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Xiu-Zhong Yin
  • Patent number: 7688585
    Abstract: A fan mounting apparatus for dissipating heat from an electronic device, the mounting apparatus includes a bracket (50) and a fan module (40). The bracket defines an opening (57), two vertical slots (59) at opposite sides of the opening and two fixing holes (58) under the slots and aligned with the respective slots. The fan module includes a fan (10) and a pair of clamping members (30). The pair of clamping members respectively attached to opposite sides of the fan, an engaging portion (35) formed on each clamping member for engaging with the corresponding slot of the bracket, and each engaging portion has a sliding portion (351) and a clamping portion (353), wherein each sliding portion is capable of being received in the corresponding slot, and the clamping portion engaging with the fixing hole.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: March 30, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Xiu-Zhong Yin