Patents by Inventor Xiuhong Jin

Xiuhong Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface planarization method of thin film and preparing method of array substrate
    Patent number: 9293340
    Abstract: A surface planarization method of thin film and a preparing method of an array substrate relate to a display field, and can solve the technical problem that the conventional dry etching severely damages the surface flatness of other film layers below the one being etched, thereby improving the display properties of the LCD. The preparing method of the array substrate comprises patterning a non-metallic layer (4) by a dry etching. And following the step of patterning a non-metallic layer (4) by the dry etching, the method further comprises performing surface planarization on a first film layer (3) to recover the first film layer (3) with a rough surface caused by the dry etching to be planar. The first film layer (3) is located below the non-metallic layer (4).
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: March 22, 2016
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lei Chen, Ziqi Xia, Wukun Dai, Jiapeng Li, Xiuhong Jin, Fengguo Wang, Lei Zhang, Miao Qiu
  • SURFACE PLANARIZATION METHOD OF THIN FILM AND PREPARING METHOD OF ARRAY SUBSTRATE
    Publication number: 20150064927
    Abstract: A surface planarization method of thin film and a preparing method of an array substrate relate to a display field, and can solve the technical problem that the conventional dry etching severely damages the surface flatness of other film layers below the one being etched, thereby improving the display properties of the LCD. The preparing method of the array substrate comprises patterning a non-metallic layer (4) by a dry etching. And following the step of patterning a non-metallic layer (4) by the dry etching, the method further comprises performing surface planarization on a first film layer (3) to recover the first film layer (3) with a rough surface caused by the dry etching to be planar. The first film layer (3) is located below the non-metallic layer (4).
    Type: Application
    Filed: June 5, 2013
    Publication date: March 5, 2015
    Applicants: BEIJING BOE OPOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lei Chen, Ziqi Xia, Wukun Dai, Jiapeng Li, Xiuhong Jin, Fengguo Wang, Lei Zhang, Miao Qiu