Abstract: The present disclosure provides a vehicle battery humidity control device, a corresponding vehicle battery pack and a humidity control device. The disclosed vehicle battery humidity control device comprises: a shell installed on a vehicle battery pack and formed with a receiving cavity, the receiving cavity and an internal space of the battery pack being communicated fluidly through a ventilation opening on the shell; and a humidity control core arranged in the receiving cavity and including a humidity control structure and a waterproof and breathable film located between the humidity control structure and the ventilation opening. The humidity control device proposed by the present disclosure has a more simplified overall structure, lower manufacturing and installation costs, long service life, and more convenient maintenance, achieving humidity control inside the vehicle battery pack, thereby improving user satisfaction.

Abstract: A vent valve includes a breathable membrane. The vent valve can be in a battery assembly of a vehicle. The vent valve comprises a base defining a central channel and a valve core movably connected with the base and including at least one first gas channel. The valve core is configured to move from a first position to a second position relative to the base under a gas pressure. When the valve core is in the second position, the first gas channel is at least partially opened to allow some airflow to bypass the breathable membrane.

Abstract: A method for preparing a wafer in a cleaning module is described. In this method, slurry is dispensed onto a surface of a wafer. Next, a chemical mechanical planarization (CMP) operation is conducted in the cleaning module by contacting a surface of a brush with the surface of the wafer. Subsequently, a cleaning operation is conducted in the cleaning module. A CMP pad and a CMP system also are described.

Abstract: A semiconductor processing system, such as a system for buffing or scrubbing both sides of a wafer at the same time, that includes a processing box for use with chemical solutions, a positioning device to position a semiconductor substrate, or other similar semiconductor material or device, and a placement device to place a buffing pad or scrubbing brush.

Abstract: A cleaning method and apparatus using very dilute hydrofluoric acid (BF) for cleaning silicon wafers and semiconductor substrates. The HF is delivered to the core of a brush where the solution is absorbed by the brush and then applied by the brush onto the substrate. This delivery system applies the chemical solutions uniformly to the semiconductor substrate and reduces the volumes of chemical solutions used in a scrubbing process. The process of the present invention uses very dilute HF and allows a thin oxide to be etched but not completely removed so as to maintain a hydrophilic surface state. Thus, this invention presents a chemical mechanical cleaning process with in-situ etching with the use of PVA brushes on a brush scrubber. Very accurate control of etch rate is obtained and, therefore, makes this process suitable to multiple cleaning applications of silicon wafers and semiconductor substrates.

Abstract: A cleaning method and apparatus using very dilute hydrofluoric acid (HF) for cleaning silicon wafers and semiconductor substrates. The HF is delivered to the core of a brush where the solution is absorbed by the brush and then applied by the brush onto the substrate. This delivery system applies the chemical solutions uniformly to the semiconductor substrate and reduces the volumes of chemical solutions used in a scrubbing process. The process of the present invention uses very dilute HF and allows a thin oxide to be etched but not completely removed so as to maintain a hydrophilic surface state. Thus, this invention presents a chemical mechanical cleaning process with in-situ etching with the use of PVA brushes on a brush scrubber. Very accurate control of etch rate is obtained and, therefore, makes this process suitable to multiple cleaning applications of silicon wafers and semiconductor substrates.