Patents by Inventor Xiuting ZHENG

Xiuting ZHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for preparing high performance polymer-based conductive composites by space-limited micro-nano precision assembly method
    Patent number: 11104037
    Abstract: The present invention relates to a method for preparing high performance polymer-based conductive composites by space-limited micro-nano precision assembly method, which belongs to the technical field of composite material preparation; including the following steps: (1) through blending the conductive filler and the polymer matrix which are added to the blending equipment, homogeneous polymer/conductive filler material system is obtained; (2) add the homogeneous material system to the mold composed of two flat plates, and let the homogeneous blend gets plane limited compression by means of mechanical compression; (3) making use of the micro-nano structure array set on the compression template to further compact the filler on the network and conducting “array anchorage”, to realize the micro-nano precision assembly of network and obtain the composite material with excellent performance, which has a continuous and tight conductive network, and has excellent tensile properties, flexibility and thermal stability.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: August 31, 2021
    Inventors: Darning Wu, Xiaolong Gao, Ying Liu, Xiuting Zheng, Yao Huang, Hong Xu, Jingyao Sun, Zhongli Zhao
  • A METHOD FOR PREPARING HIGH PERFORMANCE POLYMER-BASED CONDUCTIVE COMPOSITES BY SPACE-LIMITED MICRO-NANO PRECISION ASSEMBLY METHOD
    Publication number: 20190389093
    Abstract: The present invention relates to a method for preparing high performance polymer-based conductive composites by space-limited micro-nano precision assembly method, which belongs to the technical field of composite material preparation; including the following steps: (1) through blending the conductive filler and the polymer matrix which are added to the blending equipment, homogeneous polymer/conductive filler material system is obtained; (2) add the homogeneous material system to the mold composed of two flat plates, and let the homogeneous blend gets plane limited compression by means of mechanical compression; (3) making use of the micro-nano structure array set on the compression template to further compact the filler on the network and conducting “array anchorage”, to realize the micro-nano precision assembly of network and obtain the composite material with excellent performance, which has a continuous and tight conductive network, and has excellent tensile properties, flexibility and thermal stability.
    Type: Application
    Filed: May 26, 2017
    Publication date: December 26, 2019
    Inventors: Daming WU, Xiaolong GAO, Ying LIU, Xiuting ZHENG, Yao HUANG, Hong XU, Jingyao SUN, Zhongli ZHAO