Abstract: Some embodiments of the present application provide a photomask and its manufacturing method. The photomask includes: a substrate and a light shielding layer located on the substrate, an opening for exposing a surface of the substrate being formed in the light shielding layer; a barrier layer, the barrier layer covering a side wall of the opening and having its bottom contacted with the substrate.

Abstract: A method and a device for correcting a placement error of a photomask are provided. The method includes: acquiring an exposure offset during a wafer exposure after photomask manufacture is completed, wherein the wafer exposure is a process of forming a circuit pattern on a wafer surface by exposure; and determining a compensation offset for subsequent photomask manufacture according to the exposure offset, to correct a placement error of a photomask, wherein the compensation offset and the exposure offset are vector values that are equal in value and opposite in direction. The method and device for correcting the placement error of the photomask provided in the embodiments of the present disclosure can reduce an overlay error existing in a photolithography process of a semiconductor device by correcting a placement error of a photomask.

Abstract: Some embodiments of the present application provide a photomask and its manufacturing method. The photomask includes: a substrate and a light shielding layer located on the substrate, an opening for exposing a surface of the substrate being formed in the light shielding layer; a barrier layer, the barrier layer covering a side wall of the opening and having its bottom contacted with the substrate.