Abstract: A driver circuit carrier, a display panel, and a manufacturing method are provided. The driver circuit carrier includes a substrate, and a number of first pins arranged on at least one surface of the substrate. The first pins are arranged along a first reference line. An imaginary extending line of at least one of the first pins intersects with a second reference line perpendicular to the first reference line.

Abstract: A bonding structure for a flexible screen and a manufacturing method are provided a flexible screen and a chip mounted on a surface of the flexible screen are arranged on the bonding structure for the flexible screen, and a bonding area for bonding the chip is arranged on the flexible screen, and a flexible protective layer is coated in the bonding area, and the flexible protective layer surrounds around the chip. Compared with the prior art, by forming the flexible protective layer with different hardness around the chip, the stress generated around the chip during the peeling-off are greatly dispersed, a stress gradient is formed, the stress concentration at the position closely adjacent to the periphery of the chip is avoided, the risk of the circuits around the chip being pulled broken can be reduced, and the peeling-off yield of the flexible screen can be finally increased.