Abstract: A bonding device for attaching a curved cover plate with an irregular shape to a flexible screen includes: a first attaching half having a first abutting wall, a second half, and a driving component. The first abutting wall includes a first curved wall and a first flat wall. The first curved wall matches with an inner surface of the arc hook area, and the first flat wall is smoothly connected to the first curved wall. The second attaching half has a second abutting wall. The second abutting wall includes a second curved wall and a second flat wall. The second curved wall matches with an inner surface of the arc hook area. The second flat wall is smoothly connected to the second curved wall. The driving component drives the first attaching half and the second attaching half to move relative to each other.

Abstract: A bonding device and a bonding method for attaching a curved cover plate with an irregular shape to a flexible screen are disclosed. The bonding device includes a first bonding body, a second bonding body, and a pressing body for pressing a center portion of the flat area of the curved cover plate with the irregular shape, and a driving mechanism for driving the first bonding body and the second bonding body to move. The first bonding body includes a first pressing wall on a periphery thereof, the first pressing wall includes a first pressing flat wall and a first pressing curved wall. The second bonding body includes a second pressing wall on a periphery thereof. The second pressing wall includes a second pressing flat wall and a second pressing curved wall. The pressing body has a third pressing flat wall formed on a periphery thereof.

Abstract: A driver circuit carrier, a display panel, and a manufacturing method are provided. The driver circuit carrier includes a substrate, and a number of first pins arranged on at least one surface of the substrate. The first pins are arranged along a first reference line. An imaginary extending line of at least one of the first pins intersects with a second reference line perpendicular to the first reference line.

Abstract: A bonding structure for a flexible screen and a manufacturing method are provided a flexible screen and a chip mounted on a surface of the flexible screen are arranged on the bonding structure for the flexible screen, and a bonding area for bonding the chip is arranged on the flexible screen, and a flexible protective layer is coated in the bonding area, and the flexible protective layer surrounds around the chip. Compared with the prior art, by forming the flexible protective layer with different hardness around the chip, the stress generated around the chip during the peeling-off are greatly dispersed, a stress gradient is formed, the stress concentration at the position closely adjacent to the periphery of the chip is avoided, the risk of the circuits around the chip being pulled broken can be reduced, and the peeling-off yield of the flexible screen can be finally increased.