Abstract: Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. In some embodiments, the present invention may be directed to an electronic module that includes a pair of printed circuit boards (PCBs) and a capacitor positioned between the PCBs. Each of the PCBs may include a pair of vias configured to provide electrical connections through the PCB, and the capacitor may include a pair of pins. Each pin of the capacitor may be aligned with a via of one of the PCBs and a corresponding via of the other PCB such that each pin is configured to provide electrical connection between the two PCBs. Additionally, the pair of pins may be configured to support the PCBs with respect to each other.

Abstract: An integrated circuit package including a die substrate having a first and second die surfaces, a die high voltage input power connection in the die substrate to receive a high voltage input power and transmit the high voltage input power to a high voltage power trace on the first die surface, a power converter module on the first die surface and electrically connected to the high voltage power trace to convert the high voltage input power to a low voltage output power, a low voltage power trace located on the first die surface and electrically connected to the power converter module to carry the low voltage output power to a circuit die on the first die surface. A method of manufacturing the integrated circuit package and a computer having one or more circuits that include the package is also disclosed.

Abstract: IC package including a substrate having a first surface, a circuit die coupled to the first surface of the substrate, a decoupling capacitor coupled to the first surface of the substrate and a power trace coupled to the first surface of the substrate and connected to the circuit die and to the decoupling capacitor. A method of manufacturing an IC package include providing a substrate providing a substrate having a first surface, forming a power trace on the first surface of the substrate, mounting a circuit die on the first surface, where the circuit die is electrically connected to the power trace and mounting a decoupling capacitor on the first surface of the substrate, where the decoupling capacitor is electrically connected to the power trace and to the circuit die.