Abstract: Absorbent articles (30) have bonded materials and bond patterns. One of the absorbent articles (30) has a bond pattern (150a-150d) comprising bonds (151,153,155,155a-155d). The bond pattern (150a-150d) comprises a longitudinally extending series of bonds (151,153), which comprises a first bond (151) and a second bond (153) disposed longitudinally adjacent to the first bond (151). The first bond (151) has an inboard lateral edge (158), an outboard lateral edge (156), a top edge (152), and a bottom edge (154) having a recess portion (164). The second bond (153) has an inboard lateral edge (158) and an outboard lateral edge (156), a top edge (152) having a recess portion (164), and a bottom edge (154).

Abstract: Provided are a display panel, a method for manufacturing the same, and a display device. The display panel includes: flexible substrate; multiple thin film transistor structures arranged in an array and on the flexible substrate; and an organic layer located on the multiple thin film transistor structures. Through holes are arranged between adjacent thin film transistor structures, each through hole penetrates the organic layer and the flexible substrate, and the organic layer covers a first surface of at least one thin film transistor structure far away from the flexible substrate, and side surfaces of the at least one thin film transistor structure proximate to the corresponding through holes.

Abstract: The embodiments of the present disclosure provide a method and apparatus for simulating a flexible panel. The method comprises: establishing a geometric model of the flexible panel; cutting a layer adjacent to a layer where a wiring region is located in the geometric model of the flexible panel; partitioning the following regions or layers in the cut geometric model into grid cells: the wiring region, layers other than the layer where the wiring region located and the layer adjacent to the layer where the wiring region is located, and regions obtained by cutting the layer adjacent to the layer where the wiring region is located; and simulating the flexible panel based on the partition.

Abstract: A film layer structure, a display substrate and a display device are provided. The film layer structure includes a film base, which has a curved side for adjusting stress distribution of the film layer structure.

Abstract: The utility model discloses a film layer structure, an array substrate and a display device, relating to the technical field of display, in order to improve the bending resistance of the film layer structure, thereby reducing the possibility of cracking or even breaking of the film layer structure during the stress process of the display device. The film layer structure comprises a film layer substrate, and the edge of the film layer substrate is provided with a curved edge for adjusting the stress distribution of the film layer structure. The array substrate comprises the film layer structure proposed by the technical scheme. The film layer structure, array substrate and display device provided by the utility model are used in display.

Abstract: Provided are a display panel, a method for manufacturing the same, and a display device. The display panel includes: flexible substrate; multiple thin film transistor structures arranged in an array and on the flexible substrate; and an organic layer located on the multiple thin film transistor structures. Through holes are arranged between adjacent thin film transistor structures, each through hole penetrates the organic layer and the flexible substrate, and the organic layer covers a first surface of at least one thin film transistor structure far away from the flexible substrate, and side surfaces of the at least one thin film transistor structure proximate to the corresponding through holes.

Abstract: The embodiments of the present disclosure provide a method and apparatus for simulating a flexible panel. The method comprises: establishing a geometric model of the flexible panel; cutting a layer adjacent to a layer where a wiring region is located in the geometric model of the flexible panel; partitioning the following regions or layers in the cut geometric model into grid cells: the wiring region, layers other than the layer where the wiring region located and the layer adjacent to the layer where the wiring region is located, and regions obtained by cutting the layer adjacent to the layer where the wiring region is located; and simulating the flexible panel based on the partition.