Patents by Inventor Xuan Feng

Xuan Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120087326
    Abstract: A method and apparatus for allocating and processing sequences in a communication system is disclosed. The method includes: dividing sequences in a sequence group into multiple sub-groups, each sub-group corresponding to its own mode of occupying time frequency resources; selecting sequences from a candidate sequence collection corresponding to each sub-group to form the sequences in the sub-group by: the sequences in a sub-group i in a sequence group k being composed of n sequences in the candidate sequence collection, the n sequences making a |ri/Ni?ck/Np1| or |(ri/Ni?ck/Np1) modu mk,i| function value the smallest, second smallest, till the nth sm allest respectively; allocating the sequence group to cells, users or channels. It prevents the sequences highly correlated with the sequences of a specific length from appearing in other sequence groups, thus reducing interference, avoiding the trouble of storing the lists of massive sequence groups.
    Type: Application
    Filed: December 19, 2011
    Publication date: April 12, 2012
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Bingyu Qu, Yujuan He, Xuan Feng
  • Patent number: 7648902
    Abstract: A method of manufacturing a redistribution circuit structure is provided. First, a substrate is provided. The substrate has a plurality of pads and a passivation layer. The passivation layer has a plurality of first openings exposing a portion of each of the pads, respectively. A first patterned photoresist layer is formed on the passivation layer. The first patterned photoresist layer has a plurality of second openings exposing a portion of each of the pads. A plurality of first bumps is formed in the second openings, respectively. An under ball metal (UBM) material layer is formed over the substrate to cover the first patterned photoresist layer and the first bumps. A plurality of conductive lines is formed on the UBM material layer. The UBM material layer is patterned to form a plurality of UBM layers using the conductive lines as a mask.
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: January 19, 2010
    Assignee: ChipMOS Technologies (Bermuda) Ltd.
    Inventor: Xuan-Feng Lu
  • Publication number: 20090303960
    Abstract: A method and apparatus for allocating and processing sequences in a communication system is disclosed. The method includes: dividing sequences in a sequence group into multiple sub-groups, each sub-group corresponding to its own mode of occupying time frequency resources; selecting sequences from a candidate sequence collection corresponding to each sub-group to form the sequences in the sub-group by: the sequences in a sub-group i in a sequence group k being composed of n sequences in the candidate sequence collection, the n sequences making a |ri/Ni?ck/Np1| or |(ri/Ni?ck/Np1) modu mk,i| function value the smallest, second smallest, till the nth smallest respectively; allocating the sequence group to cells, users or channels. It prevents the sequences highly correlated with the sequences of a specific length from appearing in other sequence groups, thus reducing interference, avoiding the trouble of storing the lists of massive sequence groups.
    Type: Application
    Filed: June 29, 2009
    Publication date: December 10, 2009
    Inventors: Bingyu Qu, Yujuan He, Xuan Feng
  • Publication number: 20090213876
    Abstract: A method for sending control signaling, including: a transmitter using different states of one field in the control signaling to indicate the payload size or RV; and sends the control signaling indicative of the payload size or RV in the field. It is appropriate that some states of one field indicate different payload sizes, and the remaining states of the field indicate different RVs. An apparatus for sending control signaling is disclosed. The apparatus may be integrated in a base station, and may include a control signaling generating unit and a control signaling sending unit.
    Type: Application
    Filed: April 30, 2009
    Publication date: August 27, 2009
    Inventors: Xianghua WANG, Xuan FENG
  • Publication number: 20090130839
    Abstract: A method of manufacturing a redistribution circuit structure is provided. First, a substrate is provided. The substrate has a plurality of pads and a passivation layer. The passivation layer has a plurality of first openings exposing a portion of each of the pads, respectively. A first patterned photoresist layer is formed on the passivation layer. The first patterned photoresist layer has a plurality of second openings exposing a portion of each of the pads. A plurality of first bumps is formed in the second openings, respectively. An under ball metal (UBM) material layer is formed over the substrate to cover the first patterned photoresist layer and the first bumps. A plurality of conductive lines is formed on the UBM material layer. The UBM material layer is patterned to form a plurality of UBM layers using the conductive lines as a mask.
    Type: Application
    Filed: January 12, 2009
    Publication date: May 21, 2009
    Applicant: CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
    Inventor: Xuan-Feng Lu
  • Patent number: 7498251
    Abstract: A method of manufacturing a redistribution circuit structure is provided. First, a substrate is provided. The substrate has a plurality of pads and a passivation layer. The passivation layer has a plurality of first openings exposing a portion of each of the pads, respectively. A first patterned photoresist layer is formed on the passivation layer. The first patterned photoresist layer has a plurality of second openings exposing a portion of each of the pads. A plurality of first bumps is formed in the second openings, respectively. An under ball metal (UBM) material layer is formed over the substrate to cover the first patterned photoresist layer and the first bumps. A plurality of conductive lines is formed on the UBM material layer. The UBM material layer is patterned to form a plurality of UBM layers using the conductive lines as a mask.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: March 3, 2009
    Assignee: ChipMOS Technologies (Bermuda) Ltd.
    Inventor: Xuan-Feng Lu
  • Publication number: 20080169558
    Abstract: A method of manufacturing a redistribution circuit structure is provided. First, a substrate is provided. The substrate has a plurality of pads and a passivation layer. The passivation layer has a plurality of first openings exposing a portion of each of the pads, respectively. A first patterned photoresist layer is formed on the passivation layer. The first patterned photoresist layer has a plurality of second openings exposing a portion of each of the pads. A plurality of first bumps is formed in the second openings, respectively. An under ball metal (UBM) material layer is formed over the substrate to cover the first patterned photoresist layer and the first bumps. A plurality of conductive lines is formed on the UBM material layer. The UBM material layer is patterned to form a plurality of UBM layers using the conductive lines as a mask.
    Type: Application
    Filed: March 30, 2007
    Publication date: July 17, 2008
    Applicant: CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
    Inventor: Xuan-Feng Lu