Patents by Inventor Xuan HONG

Xuan HONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190354836
    Abstract: Techniques for determining temporal dependencies and inter-time series dependencies in multi-variate time series data are provided. For example, embodiments described herein can comprise a system, which can comprise a memory that can store computer executable components. The system can also comprise a processor that can execute the computer executable components stored in the memory. The computer executable components can include: a computing component that encodes recurrent neural networks (RNNs) with time series data and determines decoded RNNs based on temporal context vectors, to determine temporal dependencies in time series data; a combining component that combines the decoded RNNs and determines an inter-time series dependence context vector and an RNN dependence decoder; and an analysis component that determines inter-time series dependencies in the time series data and forecast values for the time series data based on the inter-time series dependence context vector and the RNN dependence decoder.
    Type: Application
    Filed: May 17, 2018
    Publication date: November 21, 2019
    Inventors: Syed Yousaf Shah, Xuan-Hong Dang, Petros Zerfos
  • Publication number: 20190206805
    Abstract: Provided herein are conductive formulations wherein graphene has been added into the metal system, thereby reducing curing shrinkage and improving flexibility, without significantly affecting the EMI shielding performance thereof. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. In certain aspects of the present invention, there are also provided articles prepared using invention formulations and methods.
    Type: Application
    Filed: March 8, 2019
    Publication date: July 4, 2019
    Inventors: Xuan HONG, Juliet G. SANCHEZ, Xinpei CAO, Qizhuo ZHUO
  • Publication number: 20190138415
    Abstract: A method and a system for diagnosing remaining lifetime of storages in a data center are disclosed. The method includes the steps of: a) sequentially and periodically collecting operating attributes of failed storages along with time-to-fail records of the failed storages in a data center; b) grouping the operating attributes collected at the same time or fallen in a continuous period of time so that each group has the same number of operating attributes; c) sequentially marking a time tag for the groups of operating attributes; d) generating a trend model of remaining lifetime of the storages from the operating attributes and time-to-fail records by ML and/or DL algorithm(s) with the groups of operating attributes and time-to-fail records fed according to the order of the time tags; and e) inputting a set of operating attributes of a currently operating storage into the trend model to calculate a remaining lifetime therefor.
    Type: Application
    Filed: November 20, 2017
    Publication date: May 9, 2019
    Inventors: Wen Shyen CHEN, Wen-Chieh HSIEH, Chong Xuan HONG
  • Publication number: 20190096822
    Abstract: Provided herein are conductive formulations which are useful for applying conductive material to a suitable substrate; the resulting coated articles have improved EMI shielding performance relative to articles coated with prior art formulations employing prior art methods. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. Specifically, invention methods utilize capillary flow to substantially fill any gaps in the coating on the surface of an electronic package. Effective EMI shielding has been demonstrated with very thin coating thickness.
    Type: Application
    Filed: November 13, 2018
    Publication date: March 28, 2019
    Inventors: Xuan Hong, Xinpei Cao, Derek Wyatt, Qizhuo Zhuo, Elizabeth Hoang
  • Publication number: 20180222964
    Abstract: The present invention relates to methods of selecting, screening, engineering, making and modifying antibodies that have improved bioavailability upon subcutaneous administration to a human. Antibodies and variant antibodies with improved bioavailability upon subcutaneous administration to a human are also described.
    Type: Application
    Filed: July 29, 2016
    Publication date: August 9, 2018
    Inventors: Valeriu DAMIAN, Austin Keith DOYLE, Laura Maria HALO, Emma R. HARDING, Xuan HONG, Alan Peter LEWIS, Mark UDEN
  • Publication number: 20160132956
    Abstract: An electronic commerce platform is communicatively connected to a plurality of electronic devices each of which including a carrier. The electronic commerce platform includes a commodity managing module and a server. The commodity managing module is configured to receive at least a commodity information having a commodity characteristic and to transmit the commodity information to the server. The server includes a shopping interface producer and a match module. The shopping interface producer is configured to produce a shopping interface based on the commodity information. The match module is configured to transmit the commodity information to a matched carrier. The electronic device is configured to be communicatively connected to the shopping interface when a user clicks the commodity information shown on the carrier.
    Type: Application
    Filed: November 2, 2015
    Publication date: May 12, 2016
    Inventors: Chih Yao Lin, Hsiao-Chuan Pan, Lu-Jen Wang, Guo-Xuan Hong
  • Patent number: 8625265
    Abstract: A flat panel display includes a housing, a support base, a support plate, a connecting plate, and a fixing element. The housing defines a sliding groove and a plurality of holes arranged in a line parallel to the extending direction of the sliding groove. The support plate is fixed at the support base. The connecting plate is rotatably connected with the support base. A protruding part is formed on the connecting plate and is sliably received in the sliding groove. The connecting plate further defines a through hole. The fixing element extends through the through hole and is inserted into one of the holes to fix the position of the connecting plate relative to the housing.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: January 7, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ching-Jou Chen, Wen-Chieh Wang, Chin-Ming Chen, Qi-Xuan Hong
  • Publication number: 20130288505
    Abstract: An electrical connector assembly for electronically connecting a chip to a circuit board includes an electrical connector and a cover. The electrical connector includes a flip cover, a control element, a main body, and a fixing element. The flip cover is rotatably connected to the fixing element through the control element. The main body and the fixing element are located on the circuit board, and the chip is located on the main body. The cover is removably mounted on the flip cover. When the flip cover and the control element are rotated to be opened relative to the main body, the control element is rotated relative to the fixing element and is engaged with the flip cover.
    Type: Application
    Filed: April 1, 2013
    Publication date: October 31, 2013
    Inventors: CHIEN-MIN HUNG, QI-XUAN HONG, CHING-JOU CHEN
  • Publication number: 20130114190
    Abstract: A flat panel display includes a housing, a support base, a support plate, a connecting plate, and a fixing element. The housing defines a sliding groove and a plurality of holes arranged in a line parallel to the extending direction of the sliding groove. The support plate is fixed at the support base. The connecting plate is rotatably connected with the support base. A protruding part is formed on the connecting plate and is sliably received in the sliding groove. The connecting plate further defines a through hole. The fixing element extends through the through hole and is inserted into one of the holes to fix the position of the connecting plate relative to the housing.
    Type: Application
    Filed: March 13, 2012
    Publication date: May 9, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHING-JOU CHEN, WEN-CHIEH WANG, CHIN-MING CHEN, QI-XUAN HONG
  • Patent number: 7157036
    Abstract: The present invention provides a method to reduce adhesion between a conformable region on a substrate and a pattern of a mold, which selectively comes into contact with the conformable region. The method features forming a conformable material on the substrate and contacting the conformable material with the surface. A conditioned layer is formed from the conformable material. The conditioned layer has first and second sub-portions, with the first sub-portion being solidified and the second sub-portion having a first affinity for the surface and a second affinity for the first sub-portion. The first affinity is greater than the second affinity. In this fashion, upon separation of the mold from the conditioned layer, a subset of the second sub-portion maintains contact with the mold, thereby reducing the probability that a pattern formed in the conditioned layer becomes compromised. These and other embodiments are described herein.
    Type: Grant
    Filed: June 17, 2003
    Date of Patent: January 2, 2007
    Assignees: Molecular Imprints, Inc, University of Texas Systems
    Inventors: Byung Jin Choi, Frank Y. Xu, Nicholas A. Stacey, Van Xuan Hong Truskett, Michael P. C. Watts
  • Publication number: 20040168613
    Abstract: The present invention provides a composition and method to form a release layer to reduce adhesion between a polymerizable layer and a substrate surface that selectively comes into contact with the polymerizable layer. The composition consists of di-functional perfluoro silane containing molecules, and mono-functional perfluoro silane containing molecules. The method features disposing a coating upon the surface from a composition having a perfluoro silane containing molecule that includes a mixture of the di-functional and mono-functional perfluoro silane containing molecules. The perfluoro silane containing molecules are connected to bonding regions of the surface to form a layer having contact regions. A sub-set of the mono-functional perfluoro silane containing molecules are attached to bonding regions positioned between bonding regions to which the di-functional perfluoro silane containing molecules are attached.
    Type: Application
    Filed: February 27, 2003
    Publication date: September 2, 2004
    Applicant: MOLECULAR IMPRINTS, INC.
    Inventors: Van Xuan Hong Nguyen, Christopher J. MacKay, B. Jin Choi
  • Publication number: 20040170770
    Abstract: The present invention provides a method to reduce adhesion between a polymerizable layer and a substrate surface that selectively comes into contact with the polymerizable layer. The method features disposing a coating upon the surface from a composition having a perfluoro silane containing molecule. The perfluoro silane molecule is connected to bonding regions on the surface forming covalent bonding groups, as well as contact regions. The contact regions include fluorinated chains of molecules. The covalent bonding groups are positioned between the surface and the contact regions. The perfluoro silane containing molecule may be applied to the surface as a monomolecular layer from a di-functional perfluoro silane molecule. Exemplary molecules that may be employed as the perfluoro silane containing molecule includes molecules sold under the trade-names FLUOROSYL™ FSD 2500 and FLUOROSYL™ FSD 4500.
    Type: Application
    Filed: February 27, 2003
    Publication date: September 2, 2004
    Applicant: MOLECULAR IMPRINTS, INC.
    Inventors: Van Xuan Hong Nguyen, Christopher J. MacKay, B. Jin Choi