Abstract: A display substrate includes a driving backplane, and a light-emitting device layer located on a side of the driving backplane. The light-emitting device layer includes a plurality of light-emitting units; a plurality of transparent electrodes which are located on surfaces of the plurality of light-emitting units away from the driving backplane and electrically connected to the light-emitting units; and a first bonding pattern which is at least located between the plurality of transparent electrodes. The first bonding pattern is electrically connected to at least one transparent electrode.

Abstract: A chip structure is provided. The chip structure includes a chip wafer unit and a color conversion layer substrate unit arranged on a light-exit side of the chip wafer unit. The chip wafer unit includes a plurality of sub-pixel light-emitting functional layers. The color conversion layer substrate unit includes a color conversion layer arranged on the light-exit side of the chip wafer unit. The chip wafer unit further includes a first bonding layer, arranged between the sub-pixel light-emitting functional layers and the color conversion layer, and configured to bond the chip wafer unit and the color conversion layer substrate unit.

Abstract: A light-emitting substrate is provided, including first and second substrates opposite to each other, and a bonding wire structure including a bonding wire. The first substrate includes: a first base substrate and a first conductive pad. The second substrate includes a second base substrate and a second conductive pad. The first conductive pad is on a surface of the first substrate away from the second substrate, the second conductive pad is on a surface of the second substrate away from the first substrate. The bonding wire is soldered to the first conductive pad at a first solder joint and to the second conductive pad at a second solder joint. The bonding wire includes, at each of the first solder joint and the second solder joint, a portion having an angle with a plane where the first base substrate is located and/or having a curved arc.

Abstract: Provided in the disclosure are a light-emitting chip and a preparation method thereof, a light-emitting substrate, and a display device. The light-emitting chip includes: a silicon-based substrate including a plurality of sub-pixel openings; a plurality of light-emitting devices formed on one side of the silicon-based substrate; wherein the light-emitting devices are in one-to-one correspondence to the sub-pixel openings, and orthographic projections of the light-emitting devices on the silicon-based substrate overlap with the sub-pixel openings; and a plurality of photoluminescent color films located in at least part of the sub-pixel openings.

Abstract: An optical sensor and a display apparatus. The optical sensor includes: a base substrate (1); a detection circuit (2) on the base substrate (1); a plurality of photosensitive devices (3) on a side of the detection circuit (2) facing away from the base substrate (1); a plurality of light converged elements (4) on a side of the photosensitive devices (3) facing away from the base substrate (1); where an orthographic projection of one light converged element (4) on the base substrate (1) covers orthographic projections of at least two photosensitive devices (3) on the base substrate (1); and a light constrained structure (5) between the photosensitive devices (3) and the light converged elements (4).

Abstract: The present application provides a light-emitting device, a display apparatus, the light-emitting device including: a substrate; at least two light-emitting units, in a direction perpendicular to the plane where the substrate is located, orthographic projections of two adjacent light-emitting units on the substrate overlap; at least one patterned bonding layer, located between two adjacent light-emitting units, including a plurality of spaced bonding portions, the bonding portions are configured to be fixed and electrically connected to the two adjacent light-emitting units; the orthographic projection of the bonding portion on the substrate is within the orthographic projection of the light-emitting unit on the substrate, and the sum of the orthographic projection areas of all bonding portions on the substrate is less than the area of the orthographic projection of the light-emitting device on the substrate.

Abstract: An optical path structure, an optical path system, and a transfer method. The optical path structure includes a beam adjustment module configured to adjust a diameter of a laser beam and output a first beam; a beam shaping module configured to perform energy homogenization on the first beam to obtain a second beam; and a beam focusing module configured to focus the second beam and output a target light spot; the target light spot is used for irradiating a device substrate, so that a bonding material in the device substrate changes after being irradiated by the target light spot, and a target device is separated from a carrier substrate; where the bonding material is disposed between the target device and the carrier substrate.

Abstract: A light-emitting substrate, a method of manufacturing a light-emitting substrate, and a display device are provided. The light-emitting substrate includes: a first substrate, wherein the first substrate includes a first base substrate, a light-emitting diode arranged on the first base substrate, and a first conductive pad arranged on the first base substrate; a second substrate arranged opposite to the first substrate, wherein the second substrate includes a second base substrate, and a second conductive pad arranged on the second base substrate; and a bonding wire structure including a bonding wire, wherein the first conductive pad is located on a surface of the first substrate away from the second substrate, the second conductive pad is located on a surface of the second substrate away from the first substrate, and the bonding wire is configured to electrically connect the first conductive pad and the second conductive pad.

Abstract: A light emitting device and a light emitting apparatus are provided. The light emitting device includes at least two epitaxial structures provided in a first direction and connected in series, wherein two current diffusion layers and a transparent adhesive layer are provided between two adjacent epitaxial structures, a current diffusion layer is provided at one side of each of the two adjacent epitaxial structures, the transparent adhesive layer is provided between the two current diffusion layers, and metal nanoparticles are provided in the transparent adhesive layer.

Abstract: A texture recognition apparatus and an electronic apparatus are provided. The texture recognition apparatus has a touch side surface, and includes a light source array, an image sensor array and a light shielding matrix, the light source array includes a plurality of light sources; the image sensor array includes a plurality of image sensors, the plurality of image sensors are configured to receive light emitted from the plurality of light sources and reflected by a texture to the plurality of image sensors; the light shielding matrix includes a plurality of light shielding patterns arranged in an array, each of the plurality of image sensors includes a photosensitive element; the plurality of light sources do not overlap with the plurality of light shielding patterns, a photosensitive element of each of the plurality of image sensors at least partially overlaps with at least one or the plurality of light shielding patterns.

Abstract: A texture recognition apparatus and an electronic apparatus are provided. The texture recognition apparatus has a touch side surface, and includes a light source array, an image sensor array, and a light shielding layer. The light source array includes a plurality of light sources; the image sensor array includes a plurality of image sensors, each image sensor includes a photosensitive element; the light shielding layer is on a light incident side of the image sensor array, the light shielding layer includes a plurality of light-transmitting holes; the plurality of light-transmitting holes are configured to collimate light emitted by the plurality of light sources and reflected by the texture to a direction perpendicular to the touch side surface; and in the direction perpendicular to the touch side surface, a photosensitive element in each image sensor at least partially overlaps with at least one of the plurality of light-transmitting holes.

Abstract: The organic light-emitting display panel includes: a base substrate having sub-pixel regions and non-sub-pixel regions; fingerprint identification devices in the non-sub-pixel regions; anodes in the sub-pixel regions and on sides, facing away from the base substrate, of the fingerprint identification devices; and a collimation structure in the non-sub-pixel regions.

Abstract: A display panel includes a base substrate; light-emitting devices on the base substrate; photosensitive devices between a layer where the light-emitting devices are located and the base substrate, the photosensitive devices being configured to collect light emitted by the light emitting devices and reflected by a fingerprint, and orthographic projections of the photosensitive devices on the base substrate being located in gaps between orthographic projections of the light-emitting devices on the base substrate; and a light-shielding portion on a light-incident side of the photosensitive devices, an orthographic projection of the light-shielding portion on the base substrate overlapping with edge regions of the orthographic projections of the photosensitive devices, the light-shielding portion being provided with first openings, and the orthographic projections of the first openings on the base substrate overlapping with middle regions of the orthographic projections of the photosensitive devices.

Abstract: The present disclosure provides a display apparatus including: a display module with a plurality of color filters and a black matrix with a plurality of first openings and a plurality of second openings, and the plurality of color filters are arranged in the plurality of first openings in a one-to-one correspondence; a fingerprint recognition circuit, on a side of the display module away from a display surface of the display module and including a plurality of fingerprint recognition elements; and a collimating structure, on an incident side of the fingerprint recognition circuit and including at least two light shading layers, wherein each of the light shading layers has a plurality of light transmitting holes, and one of the light shading layers is multiplexed as the black matrix.

Abstract: A light-emitting diode substrate, a manufacturing method thereof, and a display device are disclosed. The manufacturing method of the light-emitting diode substrate includes: forming an epitaxial layer group of M light-emitting diode chips on a substrate; transferring N epitaxial layer groups on N substrates onto a transition carrier substrate, the N epitaxial layer groups on the N substrates being densely arranged on the transition carrier substrate; and transferring at least part of N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto a driving substrate, an area of the transition carrier substrate is greater than or equal to a sum of areas of the N substrates, M is a positive integer greater than or equal to 2, and N is a positive integer greater than or equal to 2.

Abstract: A texture recognition apparatus and an electronic apparatus are provided. The texture recognition apparatus has a touch side surface, and includes a light source array, an image sensor array, and a light shielding layer. The light source array includes a plurality of light sources; the image sensor array includes a plurality of image sensors, each image sensors includes a photosensitive element; the light shielding laver is on a light incident side of the image sensor array, the light shielding layer includes a plurality of light-transmitting holes; the plurality of light-reflected by the texture to a direction perpendicular to the touch side surface; and in the direction perpendicular to the touch side surface, a photosensitive element in each image sensor at least partially overlaps with at least one of the plurality of light-transmitting holes.

Abstract: A texture recognition apparatus and an electronic apparatus are provided. The texture recognition apparatus has a touch side surface, and includes a light source array, an image sensor array and a light shielding matrix, the light source array includes a plurality of light sources; the image sensor array includes a plurality of image sensors, the plurality of Image sensors are configured to receive light emitted from the plurality of light sources and reflected by a texture to the plurality of image sensors; the light shielding matrix includes a plurality of light shielding element; the plurality of light sources do not overlap with the plurality of light shielding patterns, a photosensitive element of each of the plurality of image sensors at least partially overlaps with at least one of the plurality of light shielding patterns.

Abstract: The present disclosure provides a line recognition module, a fabricating method thereof and a display device. A better collimating effect may be achieved only by fabricating an optical sensing structure on a substrate in the line recognition module and then directly fabricating at least two light shading layers and a light transmitting layer with relatively simple structures, and the device structure is light and thin, which can reduce the difficulty of processing the device. The problem that the yield is affected due to blistering caused by attaching a collimating structure to the line recognition module with use of an optically clear adhesive (OCA) is avoided. Moreover, since film layers are fabricated directly on the optical sensing structure to form the collimating structure, fabrication of the collimating structure may be accomplished by using a generic device for fabrication of the film layers on an array substrate without adding new fabrication equipment.

Abstract: A light-emitting substrate, a method of manufacturing a light-emitting substrate, and a display device are provided. The light-emitting substrate includes: a first substrate, wherein the first substrate includes a first base substrate, a light-emitting diode arranged on the first base substrate, and a first conductive pad arranged on the first base substrate; a second substrate arranged opposite to the first substrate, wherein the second substrate includes a second base substrate, and a second conductive pad arranged on the second base substrate; and a bonding wire structure including a bonding wire, wherein the first conductive pad is located on a surface of the first substrate away from the second substrate, the second conductive pad is located on a surface of the second substrate away from the first substrate, and the bonding wire is configured to electrically connect the first conductive pad and the second conductive pad.

Abstract: The organic light-emitting display panel includes: a base substrate having sub-pixel regions and non-sub-pixel regions; fingerprint identification devices in the non-sub-pixel regions; anodes in the sub-pixel regions and on sides, facing away from the base substrate, of the fingerprint identification devices; and a collimation structure in the non-sub-pixel regions.