Patents by Inventor Xuan Nguyen
Xuan Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11587160Abstract: A method including receiving identification information for a first account holder at a financial institution, authenticating the first account holder via an automated teller machine (ATM) based on the identification information, identifying an event associated with the first account holder, including determining date information for the event, configuring a message relating to the event to be displayed to the first account holder based on the event, storing trigger configuration information comprising a time window including the date information for the event, and displaying the message to the first account holder via the ATM, the message being displayed when the first account holder accesses the ATM at a time occurring within the time window.Type: GrantFiled: February 22, 2021Date of Patent: February 21, 2023Assignee: Wells Fargo Bank, N.A.Inventors: Jonathan Velline, Darren Goetz, Xuan Nguyen, Nahal Agahi
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Publication number: 20220365106Abstract: The present invention relates to methods, devices and systems for associating consumable data with an assay consumable used in a biological assay. Provided are assay systems and associated consumables, wherein the assay system adjusts one or more steps of an assay protocol based on consumable data specific for that consumable. Various types of consumable data are described, as well as methods of using such data in the conduct of an assay by an assay system. The present invention also relates to consumables (e.g., kits and reagent containers), software, data deployable bundles, computer-readable media, loading carts, instruments, systems, and methods, for performing automated biological assays.Type: ApplicationFiled: February 24, 2022Publication date: November 17, 2022Inventors: Manish KOCHAR, Peter J. BOSCO, Ian D. CHAMBERLIN, Bandele JEFFREY-COKER, Eric M. JONES, Gary I. KRIVOY, Don E. KRUEGER, Aaron H. LEIMKUEHLER, Pei-Ming WU, Kim-Xuan NGUYEN, Pankaj OBEROI, Louis W. PANG, Jennifer PARKER, Victor PELLICIER, Nicholas SAMMONS, George SIGAL, Jacob N. WOHLSTADTER, Michael L. VOCK, Stanley T. SMITH, Carl C. STEVENS, Rodger D. OSBORNE, Kenneth E. PAGE, Michael T. WADE, Jon WILLOUGHBY, Lei WANG
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SUBSTITUTED BENZOFURAN, BENZOPYRROLE, BENZOTHIOPHENE, AND STRUCTURALLY RELATED COMPLEMENT INHIBITORS
Publication number: 20220356166Abstract: Disclosed are compounds of formulae I and II, and pharmaceutically acceptable salts and prodrugs thereof, which are inhibitors of the complement system. Also provided are pharmaceutical compositions comprising such a compound, and methods of using the compounds and compositions in the treatment or prevention of a disease or condition characterized by aberrant complement system activity.Type: ApplicationFiled: February 5, 2021Publication date: November 10, 2022Inventors: Pravin L. Kotian, Yarlagadda S. Babu, Weihe Zhang, Peng-Cheng Lu, Minwan Wu, Wei Lv, Trung Xuan Nguyen, Zhao Dang, Venkat R. Chintareddy, V. Satish Kumar, Krishnan Raman -
Publication number: 20220319950Abstract: An electronic device includes a multilevel package substrate, a die, a lid, and a package structure that encloses the die, a portion of the lid, and a portion of the multilevel package substrate, where the package structure fills a gap between a side of another portion of the lid and a side of the die. A method includes attaching a die to a multilevel package substrate with a first side of the die facing the multilevel package substrate and a second side facing away from the multilevel package substrate; positioning a lid on the multilevel package substrate with a first portion of the lid spaced apart from the second side of the die; and forming a package structure that encloses the die and a portion of the multilevel package substrate and fills a gap between the first portion of the lid and the second side of the die.Type: ApplicationFiled: October 26, 2021Publication date: October 6, 2022Applicant: Texas Instruments IncorporatedInventors: Hiep Xuan Nguyen, Jaimal Mallory Wiliamson, Arvin Nono Verdeflor, Snehamay Sinha
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Patent number: 11460596Abstract: Systems and methods for interpreting and visualizing multi-Z horizons from seismic data are disclosed. A two-dimensional (2D) representation of seismic data is displayed via a graphical user interface (GUI). User input is received via the GUI for interpreting a multi-Z horizon within a portion of the displayed 2D representation. The user's input is tracked relative to displayed 2D representation within the GUI. Based on the tracking, each of a plurality of surfaces for the multi-Z horizon is determined. At least one intersection point between the multi-Z horizon surfaces is identified. A depth position for each surface relative to other surfaces is determined. The 2D representation of the seismic data is dynamically updated to include visual indications for the plurality of surfaces and the intersection point(s), based on the depth position of each surface, where the visual indications use different visualization styles to represent the surfaces and intersection point(s).Type: GrantFiled: November 6, 2017Date of Patent: October 4, 2022Assignee: Landmark Graphics CorporationInventors: Nam Xuan Nguyen, Xuewei Tan
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Publication number: 20220285293Abstract: A system in a package (SIP) includes carrier layer regions that have a dielectric material with a metal post therethrough, where adjacent carrier layer regions define a gap. A driver IC die is positioned in the gap having nodes connected to bond pads exposed by openings in a top side of a first passivation layer, with the bond pads facing up. A dielectric layer is on the first passivation layer and carrier layer region that includes filled through vias coupled to the bond pads and to the metal post. A light blocking layer is on sidewalls and a bottom of the substrate. A first device includes a light emitter that has first bondable features. The light blocking layer can block at least 90% of incident light. The first bondable features are flipchip mounted to a first portion of the bond pads.Type: ApplicationFiled: May 24, 2022Publication date: September 8, 2022Inventors: Vivek Swaminathan Sridharan, Yiqi Tang, Christopher Daniel Manack, Rajen Manicon Murugan, Liang Wan, Hiep Xuan Nguyen
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Patent number: 11404360Abstract: In some examples, an electronic device comprises a first magnetic member, a first adhesive layer abutting the first magnetic member, a second magnetic member, a second adhesive layer abutting the second magnetic member, and a laminate member between the first and second adhesive layers. The laminate member comprises first and second transformer coils, an electromagnetic interference (EMI) shield coil, and a set of thermally conductive members coupled to the EMI shield coil and extending in three dimensions. At least some of the thermally conductive members extend vertically through a thickness of the laminate member so as to be exposed to top and bottom surfaces of the laminate member. The electronic device includes a thermally conductive component coupled to at least one thermally conductive member in the set of thermally conductive members.Type: GrantFiled: December 31, 2020Date of Patent: August 2, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Zhemin Zhang, Yi Yan, Hiep Xuan Nguyen
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Publication number: 20220208662Abstract: In some examples, an electronic device comprises a first magnetic member, a first adhesive layer abutting the first magnetic member, a second magnetic member, a second adhesive layer abutting the second magnetic member, and a laminate member between the first and second adhesive layers. The laminate member comprises first and second transformer coils, an electromagnetic interference (EMI) shield coil, and a set of thermally conductive members coupled to the EMI shield coil and extending in three dimensions. At least some of the thermally conductive members extend vertically through a thickness of the laminate member so as to be exposed to top and bottom surfaces of the laminate member. The electronic device includes a thermally conductive component coupled to at least one thermally conductive member in the set of thermally conductive members.Type: ApplicationFiled: December 31, 2020Publication date: June 30, 2022Inventors: Zhemin ZHANG, Yi YAN, Hiep Xuan NGUYEN
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Substituted benzofuran, benzopyrrole, benzothiophene, and structurally related complement inhibitors
Patent number: 11370774Abstract: Disclosed are compounds of formulae I and II, and pharmaceutically acceptable salts and prodrugs thereof, which are inhibitors of the complement system. Also provided are pharmaceutical compositions comprising such a compound, and methods of using the compounds and compositions in the treatment or prevention of a disease or condition characterized by aberrant complement system activity.Type: GrantFiled: March 16, 2021Date of Patent: June 28, 2022Assignee: BioCryst Pharmaceuticals, Inc.Inventors: Pravin L. Kotian, Yarlagadda S. Babu, Weihe Zhang, Peng-Cheng Lu, Minwan Wu, Wei Lv, Trung Xuan Nguyen, Zhao Dang, Venkat R. Chintareddy, V. Satish Kumar, Krishnan Raman -
Patent number: 11362047Abstract: A system in a package (SIP) includes carrier layer regions that have a dielectric material with a metal post therethrough, where adjacent carrier layer regions define a gap. A driver IC die is positioned in the gap having nodes connected to bond pads exposed by openings in a top side of a first passivation layer, with the bond pads facing up. A dielectric layer is on the first passivation layer and carrier layer region that includes filled through vias coupled to the bond pads and to the metal post. A light blocking layer is on sidewalls and a bottom of the substrate. A first device includes a light emitter that has first bondable features. The light blocking layer can block at least 90% of incident light. The first bondable features are flipchip mounted to a first portion of the bond pads.Type: GrantFiled: April 16, 2020Date of Patent: June 14, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Vivek Swaminathan Sridharan, Yiqi Tang, Christopher Daniel Manack, Rajen Manicon Murugan, Liang Wan, Hiep Xuan Nguyen
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Patent number: 11340369Abstract: Systems and methods for editing multi-Z horizons interpreted from seismic data are provided. A multi-Z horizon having a plurality of surfaces is visualized within a two-dimensional (2D) representation of seismic data displayed via a graphical user interface (GUI) of an application executable at a computing device of a user. Input is received via the GUI from the user for editing one or more of the plurality of surfaces of the multi-Z horizon within a current view of the displayed 2D representation of the seismic data. A location of the received input relative to each of the plurality of surfaces within the current view is determined. The one or more surfaces of the multi-Z horizon are modified based on the location of the received input within the current view. The visualization of the multi-Z horizon within the GUI is updated, based on the modified one or more surfaces.Type: GrantFiled: November 6, 2017Date of Patent: May 24, 2022Assignee: Landmark Graphics CorporationInventors: Nam Xuan Nguyen, Xuewei Tan
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Publication number: 20220122936Abstract: In examples, a semiconductor package comprises a semiconductor die having a first surface on which circuitry is formed and a second surface opposite the first surface. The semiconductor package includes a mold compound, the second surface facing the mold compound. The mold compound covers the semiconductor die; a set of conductive vias exposed to a top surface of the mold compound and coupled to a metal layer in the package; a set of first conductive members vertically aligned with the semiconductor die and exposed to the top surface of the mold compound; and a set of second conductive members coupling at least some of the set of conductive vias to at least some of the set of first conductive members. The set of second conductive members is exposed to the top surface of the mold compound.Type: ApplicationFiled: March 31, 2021Publication date: April 21, 2022Inventors: Jaimal Mallory WILLIAMSON, Hiep Xuan NGUYEN
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Patent number: 11294085Abstract: Systems and methods for automatically tracking multi-Z horizons within seismic volumes are provided. Seed data for each of a plurality of surfaces of a multi-Z horizon within a seismic volume are obtained. A data hull for each surface is generated based on the obtained seed data. A tracking region within the seismic volume is determined, based on the generated data hull. Each surface of the multi-Z horizon is automatically tracked through the tracking region. Upon determining that one or more of the plurality of surfaces violate at least one geological boundary rule associated with the plurality of surfaces, truncating the one or more surfaces such that each surface of the multi-Z horizon honors the geological boundary rule within the seismic volume.Type: GrantFiled: October 20, 2017Date of Patent: April 5, 2022Assignee: Landmark Graphics CorporationInventors: Nam Xuan Nguyen, Kainan Wang, Xuewei Tan
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Patent number: 11295170Abstract: A system including one or more computers and one or more storage devices storing instructions that, when executed by the one or more computers, cause the one or more computers to implement a group-equivariant convolutional neural network configured to process a network input including a set of 3D points to generate an output tensor representing transformed features of the network input is described. The group-equivariant convolutional neural network includes a grouping layer, a switching layer, a pre-processing layer, a group-equivariant layer, a first subnetwork, an average pooling layer, a second subnetwork, an output subnetwork, and a final output layer.Type: GrantFiled: August 17, 2021Date of Patent: April 5, 2022Assignee: FPT USA Corp.Inventors: Thieu Ngoc Vo, Phong Xuan Nguyen, Nghia Trung Huynh, Binh Cong Phan, Tuan Anh Le
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Publication number: 20220075658Abstract: Methods, systems, and computer programs are directed to the implementation of configurable hierarchical schedulers with multiple levels, where each level may use one of several types of queueing mechanisms. A configurable, hierarchical scheduler is designed to handle large scale processing of requests (e.g., transmitting outgoing messages). The hierarchical scheduler distributes the loads to different queues handling different types of messages (e.g., by user ID, by Internet Address (IP), by schedule). The different layers of the hierarchical scheduler are configurable to queue and schedule traffic based on many factors, such as IP address, handling reputation, available downstream bandwidth, fairness, concurrency rates to handle multiple constraints, scheduling per client, time of delivery constrains, rate limits per user, domain scheduling per user, concurrency throttling per outbound channel, and sharing global rate limits across service processors.Type: ApplicationFiled: November 19, 2021Publication date: March 10, 2022Inventors: David Tyler Bischel, Samuel Xuan Nguyen, Timothy Jenkins, Vyacheslav Kim, Eric Yongjun Choi, Isaac Saldana
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Patent number: 11231515Abstract: Systems and methods for interpreting multi-Z horizons from seismic data are disclosed. Seismic data is displayed via a graphical user interface (GUI) of an application executable at a user's computing device. User input is received via the GUI for picking surfaces of a multi-Z horizon within a current view of the displayed data. The user's input is tracked as it is received via the GUI over a series of input points within the current view of the displayed seismic data. Based on the tracking, each of a plurality of surfaces for the multi-Z horizon and at least one edge point between the picked surfaces within the current view of the seismic data are determined. The current view of the seismic data within the GUI is dynamically updated to include a visual indication of the plurality of surfaces and the at least one edge point for the multi-Z horizon.Type: GrantFiled: November 6, 2017Date of Patent: January 25, 2022Assignee: Landmark Graphics CorporationInventors: Nam Xuan Nguyen, Xuewei Tan
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Patent number: 11214037Abstract: Low porosity fibrous materials, articles formed therefrom and processes for their formation. Multiple plies of high tenacity, multifilament elongate bodies are optionally stitched together and pressed as a set without being laminated, adhered or thermally fused to each other. Pressing spreads the component filaments of the elongate bodies, forcing the filaments to occupy spaces between adjacent fibers and thereby reducing porosity of the complete multi-ply material.Type: GrantFiled: April 15, 2019Date of Patent: January 4, 2022Assignee: HONEYWELL INTERNATIONAL INC.Inventors: Ashok Bhatnagar, Huy Xuan Nguyen, Lori L. Wagner
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Publication number: 20210389338Abstract: The present invention relates to methods, devices and systems for associating consumable data with an assay consumable used in a biological assay. Provided are assay systems and associated consumables, wherein the assay system adjusts one or more steps of an assay protocol based on consumable data specific for that consumable. Various types of consumable data are described, as well as methods of using such data in the conduct of an assay by an assay system. The present invention also relates to consumables (e.g., kits and reagent containers), software, data deployable bundles, computer-readable media, loading carts, instruments, systems, and methods, for performing automated biological assays.Type: ApplicationFiled: August 26, 2021Publication date: December 16, 2021Inventors: Manish KOCHAR, Peter J. BOSCO, Ian D. CHAMBERLIN, Bandele JEFFREY-COKER, Eric M. JONES, Gary I. KRIVOY, Aaron H. LEIMKUEHLER, Pei-Ming WU, Kim-Xuan NGUYEN, Pankaj OBEROI, Louis W. PANG, Jennifer PARKER, Victor PELLICIER, Nicholas SAMMONS, George SIGAL, Jacob N. WOHLSTADTER, Michael L. VOCK, Stanley T. SMITH, Carl C. STEVENS, Rodger D. OSBORNE, Kenneth E. PAGE, Michael T. WADE, Jon WILLOUGHBY, Lei WANG, Don E. KRUEGER
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Patent number: 11195195Abstract: Various applications, systems and methods for using, and enhancing V2V communications for various purposes are described. These systems and methods leverage various aspects of satellite radio broadcasts in combination with V2V communications. In some embodiments, V2V-enabled vehicles can receive advertisements or offers from RSEs, or even other V2V enabled vehicles, in a defined Target Region, which may then be played to a user in-vehicle once a given Trigger Region has been entered. By logging all advertisements or offers played to a user and sending the log to an RSE, for example, and from there to a content provider (e.g., an SDARS service operator), verified delivery of advertisements is achieved, which allows the content provider to obtain significant revenues from advertisers.Type: GrantFiled: July 16, 2019Date of Patent: December 7, 2021Assignee: Sirius XM Radio Inc.Inventors: Stelios Patsiokas, Paul Marko, Craig Wadin, Joan DeLuca, Jeffrey David Hayes, Stuart Cox, Richard Andrew Michalski, Mark Rindsberg, George David Mantel, Joseph Michael Smallcomb, Anh Xuan Nguyen
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Publication number: 20210347860Abstract: The disclosure relates generally to the field of immune binding proteins and method for obtaining immune binding proteins from genomic or other sources. The disclosure also relates to anti-SARS-CoV-2 antibodies that have been obtained from subjects who became immune to this coronavirus, and to methods of using these anti-SARS-CoV-2 antibodies. Methods for neutralizing SARS-CoV-2 are disclosed, as well treatments for SARS-COV-2 using the anti-SARS-CoV-2 antibodies.Type: ApplicationFiled: May 9, 2021Publication date: November 11, 2021Applicant: Augmenta Bioworks, Inc.Inventors: Christopher J. Emig, Rosanna Man Wah Chau, Payam Shahi, Kim-Xuan Nguyen, YuShuan Lai, Robin Emig, John Beaber, Steven Henry, Marco Antonio Mena