Abstract: An interconnect is provided for a multidimensional transducer array. An adaptor provides a 90-degrees or other non-zero angle transition of conductors from connection with the elements to connection with a printed circuit board. The adaptor is formed as a component that may surface mount on the printed circuit board and may provide a pitch change from the element pitch to a different pitch, such as a pitch of conductors of an integrated circuit also mounted to the printed circuit board. The adaptor allows stacking of modules where each module uses standardized or regular printed circuit board connections.

Abstract: Volume scanning along different planes is provided using angling of the elements. Rather than orthogonal dicing of the slab, kerfs are formed at non-parallel and non-perpendicular angles to the azimuth axis of the array or longitudinal axis of the slab. Apertures formed from selected groups of the angled elements and/or parts of angled elements may be used to steer along planes that extend at an angle of 5 degrees or more away from the azimuth or longitudinal axis. By walking the aperture, different parallel planes are scanned with a one-dimensional array of elements.

Abstract: An interconnect is provided for a multidimensional transducer array. An adaptor provides a 90-degrees or other non-zero angle transition of conductors from connection with the elements to connection with a printed circuit board. The adaptor is formed as a component that may surface mount on the printed circuit board and may provide a pitch change from the element pitch to a different pitch, such as a pitch of conductors of an integrated circuit also mounted to the printed circuit board. The adaptor allows stacking of modules where each module uses standardized or regular printed circuit board connections.

Abstract: Volume scanning along different planes is provided using angling of the elements. Rather than orthogonal dicing of the slab, kerfs are formed at non-parallel and non-perpendicular angles to the azimuth axis of the array or longitudinal axis of the slab. Apertures formed from selected groups of the angled elements and/or parts of angled elements may be used to steer along planes that extend at an angle of 5 degrees or more away from the azimuth or longitudinal axis. By walking the aperture, different parallel planes are scanned with a one-dimensional array of elements.

Abstract: A transducer for multiple purposes is provided. Different backings are used for different elements of a same array. The different backings optimize the respective elements for the desired use. A soft backing (e.g., Z=3 Mrayl) is used behind some elements for ultrasound imaging. A hard backing (e.g., Z=100 MRayl) is used behind other elements for lower frequency operation.

Abstract: A transducer array includes two or more sub-arrays that move relative to each other. Position sensors on each of the sub-arrays provide spatial coordination for beamforming and/or image forming to yield extended field of view and high image resolution. The adaptable transducer array, such as mounted on a flexible transducer housing, allows the array to better conform to the patient during internal or external use.

Abstract: By using larger segments for transmit than receive in ultrasound imaging, the number of transmit beamformer channels relative to receive beamformer channels is reduced. The space and power requirements of the transmit beamformer channels are reduced, assisting in placement within a transducer probe. The larger segments for transmit are obtained by interconnecting electrodes used for transmit on different elements. Each element includes two or more layers of transducer material and a corresponding three or more electrodes. One of the electrodes is a transmit electrode. The transmit electrodes of two or more elements are connected together, such as sharing a via connection to a transmit beamformer channel. Receive electrodes for each element are isolated from each other and connect to receive beamformer channels. The multi-layer structure of the elements provides for transmit grouping of elements and separate reception without grouping or with different grouping.

Abstract: In k31 mode, a vibration is along an axis or orthogonal to the poling or electric field orientation. The direction of vibration is toward a face of an ultrasound transducer array. For each element of the array, electrodes are formed perpendicular to the face of the array, such as along the sides of the elements. Piezoelectric material is poled along a dimension parallel with the face of the transducer and perpendicular to the direction of acoustic energy propagation. Using elements designed for k31 resonant mode operation may provide for a better electrical impedance match, such as where small elements sizes are provided for a multi-dimensional transducer arrays. For additional impedance matching, the elements may be made from multiple layers of piezoelectric ceramic. Since the elements operate from a k31 mode, the layers are stacked along the poling direction or perpendicular to a face of the transducer array for transmitting or receiving acoustical energy.

Abstract: A transducer array includes two or more sub-arrays that move relative to each other. Position sensors on each of the sub-arrays provide spatial coordination for beamforming and/or image forming to yield extended field of view and high image resolution. The adaptable transducer array, such as mounted on a flexible transducer housing, allows the array to better conform to the patient during internal or external use.

Abstract: Multiple transducer layers are provided for one or more elements of a transducer array. One layer is used for imaging, and another layer is used for generating acoustic energy for other purposes. Since the two layers of an element are used for different purposes, separate cables are provided for transmitting different electrical signals. Alternatively, a switch or other mechanism is provided for sequentially routing different signals to the different layers. In another transducer, elements distributed along an azimuth dimension of the transducer array have different numbers of transducer layers. Elements associated with a fewer number of layers are used for higher frequency signals, and elements with a greater number of layers are used for lower frequency signals.

Abstract: In k31 mode, a vibration is along an axis or orthogonal to the poling or electric field orientation. The direction of vibration is toward a face of an ultrasound transducer array. For each element of the array, electrodes are formed perpendicular to the face of the array, such as along the sides of the elements. Piezoelectric material is poled along a dimension parallel with the face of the transducer and perpendicular to the direction of acoustic energy propagation. Using elements designed for k31 resonant mode operation may provide for a better electrical impedance match, such as where small elements sizes are provided for a multi-dimensional transducer arrays. For additional impedance matching, the elements may be made from multiple layers of piezoelectric ceramic. Since the elements operate from a k31 mode, the layers are stacked along the poling direction or perpendicular to a face of the transducer array for transmitting or receiving acoustical energy.

Abstract: An ultrasound transducer employs a silicon acoustic matching layer closest to the piezoelectric layer in order to achieve improved resolution. A silicon wafer, ground to an appropriate thickness, is included in the acoustic stack with other matching layer materials during transducer construction. The exact thickness is determined by the details of the design, but is nominally a quarter wavelength in the silicon.

Abstract: An ultrasound transducer employs a silicon acoustic matching layer closest to the piezoelectric layer in order to achieve improved resolution. A silicon wafer, ground to an appropriate thickness, is included in the acoustic stack with other matching layer materials during transducer construction. The exact thickness is determined by the details of the design, but is nominally a quarter wavelength in the silicon.