Abstract: A photovoltaic assembly includes a cell unit layer, a backplate and a reflective layer. The backplate is provided on a back side of the cell unit layer, and one side of the backplate away from the cell unit layer is provided with at least one junction box. The reflective layer is disposed between the cell unit layer and the backplate. The reflective layer includes a plurality of reflective longitudinal strips. Each of the plurality of reflective longitudinal strips covers edges of cell chips within at least one cell string. At least one of the plurality of reflective longitudinal strips is broken at a location adjacent to a cell chip covered by the junction box so as to form at least one opening.

Abstract: The present invention relates to an anisotropic conductive film and a method for manufacturing same, and a bonding structure and an ultrasonic biometric identification apparatus. The anisotropic conductive film comprises first conductive particles and second conductive particles, wherein the particle size of the first conductive particles is less than the particle size of the second conductive particles, and the ratio of the number of the first conductive particles to the number of the second conductive particles is (3-8):1. The anisotropic conductive film is applicable to pins made of different materials, and is particularly applicable to a bonding structure where a pin made of a relatively hard material and a pin made of a relatively loose material exist at the same time, thereby ensuring that the anisotropic conductive film has a relatively low conduction impedance and excellent conduction stability on both of the two materials.

Abstract: An ultrasonic fingerprint module and a manufacturing method thereof, and an electronic device are provided. The ultrasonic fingerprint module includes an ultrasonic detecting layer and an ink layer, the ultrasonic detecting layer has an ultrasonic receiving surface, the ink layer is disposed on a surface of the ultrasonic detecting layer away from the ultrasonic receiving surface, the ink layer is configured to reflect ultrasonic waves emitted from the ultrasonic detecting layer, the ink layer includes a resin material and carbon powder particles, and the carbon powder particles have an average particle size of 0.5 micrometer (?m) to 5 ?m and have a mass ratio of 2.5% to 15%.

Abstract: An ultrasonic fingerprint recognition assembly is provided. The ultrasonic fingerprint recognition assembly includes a cover plate, a display panel, and an ultrasonic sensor disposed between the cover plate and the display panel. The ultrasonic sensor includes a thin film transistor (TFT) substrate which is close to the display panel, and a piezoelectric layer and a conductive layer which are disposed on the TFT substrate sequentially. The piezoelectric layer is obtained by mixing a piezoelectric material with an organic solvent, coating a mixture of the piezoelectric material and the organic solvent on a substrate, and conducting crystallization and polarization treatment. The organic solvent includes at least one of: butanone, propylene glycol monomethyl ether acetate, and dimethylacetamide.

Abstract: The disclosure discloses a flexible circuit board, an ultrasonic fingerprint module and an electronic device. The flexible circuit board includes a substrate, one first pin and a plurality of second pins. The substrate includes a first connection area and a second connection area connected with the first connection area. The first pin is disposed in the first connection area and the plurality of second pins are disposed in the second connection area. The first pin has a first connection surface away from the substrate. The first pin defines an accommodation space. The accommodation space has an opening on the first connection surface.