Abstract: The present invention relates to a reinforced polyamide molding composition, comprising a thermoplastic polyamide and a fibrous reinforcing agent, wherein the fibrous reinforcing agent comprises a mixture of glass fibers made of E-glass and glass fibers made of High Strength-glass. The present invention also relates to a molded part, made of the reinforced polyamide molding composition, as well as to an electrical or electronic device, comprising the molded part.

Abstract: The present invention relates to a thermoconductive polymer composition comprising: a) 10-30 wt. % of glass fibers; b) 40-45 wt. % of talc; c) 20-50 wt. % of a thermoplastic polymer comprising at least one polyamide selected from the group consisting of PA46, PA6, PA66 and mixtures thereof; wherein the sum of a) and b) is at least 50 wt. % and at most 70 wt. % and wherein the weight percentages (wt. %) are relative to the total weight of the composition.