Patents by Inventor Xuchu JIANG

Xuchu JIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10400091
    Abstract: Provided is a thermoplastic composite, a method for preparing a thermoplastic composite, and an injection-molded product. The thermoplastic composite comprises 35-75% by weight of a thermoplastic resin, 5-45% by weight of a non-cellulosic organic fiber, and 5-20%) by weight of hollow glass microspheres, based on 100% by weight of the total weight of the thermoplastic composite.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: September 3, 2019
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Jingqiang Hou, Baris Yalcin, Pu Ren, Yinjie Zhou, Xuchu Jiang, Xuetao Yu
  • Publication number: 20170321038
    Abstract: Provided is a thermoplastic composite, a method for preparing a thermoplastic composite, and an injection-molded product. The thermoplastic composite comprises 35-75% by weight of a thermoplastic resin, 5-45% by weight of a non-cellulosic organic fiber, and 5-20%) by weight of hollow glass microspheres, based on 100% by weight of the total weight of the thermoplastic composite.
    Type: Application
    Filed: October 31, 2014
    Publication date: November 9, 2017
    Inventors: Jingqiang Hou, Baris Yalcin, Pu Ren, Yinjie Zhou, Xuchu Jiang, Xuetao Yu
  • Patent number: 9760025
    Abstract: A reticle shape regulation device includes: an adsorption device having an upper surface and a lower surface; and a limit mechanism having a limit surface. The adsorption device is movable relative to the limit mechanism at least in a vertical direction. The upper surface of the adsorption device faces toward and is engagable with the limit surface. The lower surface of the adsorption device defines a vacuum chamber that is configured for communication with a negative-pressure source so as to adsorb the reticle by a negative pressure. The lower surface of the adsorption device further defines at least one positive-pressure outlet that is in communication with a positive-pressure source and is configured to supply a continuous positive-pressure air flow between the lower surface of the adsorption device and the reticle during the adsorption of the reticle.
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: September 12, 2017
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Xinxin Wang, Xuchu Jiang, Wenjing Zhu, Xiaogang Wang
  • Publication number: 20160147163
    Abstract: A reticle shape regulation device includes: an adsorption device having an upper surface and a lower surface; and a limit mechanism having a limit surface. The adsorption device is movable relative to the limit mechanism at least in a vertical direction. The upper surface of the adsorption device faces toward and is engagable with the limit surface. The lower surface of the adsorption device defines a vacuum chamber that is configured for communication with a negative-pressure source so as to adsorb the reticle by a negative pressure. The lower surface of the adsorption device further defines at least one positive-pressure outlet that is in communication with a positive-pressure source and is configured to supply a continuous positive-pressure air flow between the lower surface of the adsorption device and the reticle during the adsorption of the reticle.
    Type: Application
    Filed: June 10, 2014
    Publication date: May 26, 2016
    Applicant: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD.
    Inventors: Xinxin WANG, Xuchu JIANG, Wenjing ZHU, Xiaogang WANG
  • Publication number: 20150357217
    Abstract: An apparatus and method for adsorbing a wafer are disclosed. The apparatus includes a chuck (100) for vacuum adsorption of the wafer and at least three suction head assemblies (200). The chuck (100) has at least three openings (101) corresponding to the suction head assemblies (200). The suction head assembly (200) includes: a pneumatic cylinder (230) in fixed connection with the chuck (100); and a nozzle (230) in movable connection to the pneumatic cylinder (210). The nozzles (230) are completely located within the respective openings (101) or at least partially above a surface of the chuck (100). Through increasing at least three suction head assemblies (200) in the chuck (100), the wafer (300) can be adsorbed and stretched by the suction head assembly (200) until the lower surface of the wafer (300) is attached to the upper surface of the chuck 100, thereby achieving the adsorption of the wafer (300).
    Type: Application
    Filed: December 26, 2013
    Publication date: December 10, 2015
    Applicant: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO,, LTD
    Inventors: Xinxin WANG, Xuchu JIANG, Tao XU, Wenjing ZHU, Fangxiong SUN, Jun SUN