Abstract: Test structures and methods of testing pixel driver chip donor wafers are described. In an embodiment, a redistribution layer is formed over a pixel driver chip donor wafer and probed to determine known good dies, followed by removal of the RDL. In other embodiments, test routing is formed in the pixel driver chip using a polycide material or doped region in the semiconductor wafer.

Abstract: A spatial light modulator includes a mirror plate comprising a reflective upper surface, a lower surface, and a cavity having an opening on the lower surface; a substrate comprising an upper surface, a hinge support post in connection with the upper surface, and a hinge component supported by the hinge support post and in connection with the mirror plate; and a landing tip having a laterally extended upper portion and a vertically extended lower portion in connection with the substrate and the vertically extended lower portion. The laterally extended upper portion can contact the lower surface of the mirror plate to limit the rotation of the mirror plate. The hinge component extends into the cavity and can facilitate a rotation of the mirror plate.