Patents by Inventor Xudong Jing

Xudong Jing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9844903
    Abstract: The present invention discloses a method of manufacturing a housing and an electronic device. The method comprises the following steps: preparing a mold according to a predetermined shape of the housing, wherein the mold comprises at least one moving die and at least one fixed die, a first texture structure is formed on the inner surface of the mold, and the first texture structure comprises a plurality of projections arranged in a first arrangement, and a groove recesses inwardly is formed between any two adjacent projections, and the groove is formed by etching and removing a part of the moving die and/or the fixed die by the laser engraving method; closing the moving die and the fixed die, and heating the mold to a predetermined mold temperature; and injecting a raw material in a melting state into the mold cavity of the mold; retaining a pressure of the raw material in the mold cavity of the mold; cooling the mold; opening the mold to complete the housing.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: December 19, 2017
    Assignee: LENOVO (BEIJING) LIMITED
    Inventors: Yuming Xie, Liang Bo, Xudong Jing, Shurong He, Xiaoqin Han, Lei Ma, Lei Xu, Lan Zhou
  • Publication number: 20150077910
    Abstract: The present invention discloses a method of manufacturing a housing and an electronic device. The method comprises the following steps: preparing a mold according to a predetermined shape of the housing, wherein the mold comprises at least one moving die and at least one fixed die, a first texture structure is formed on the inner surface of the mold, and the first texture structure comprises a plurality of projections arranged in a first arrangement, and a groove recesses inwardly is formed between any two adjacent projections, and the groove is formed by etching and removing a part of the moving die and/or the fixed die by the laser engraving method; closing the moving die and the fixed die, and heating the mold to a predetermined mold temperature; and injecting a raw material in a melting state into the mold cavity of the mold; retaining a pressure of the raw material in the mold cavity of the mold; cooling the mold; opening the mold to complete the housing.
    Type: Application
    Filed: March 31, 2014
    Publication date: March 19, 2015
    Applicant: Lenovo (Beijing) Limited
    Inventors: Yuming Xie, Liang Bo, Xudong Jing, Shurong He, Xiaoqin Han, Lei Ma, Lei Xu, Lan Zhou
  • Patent number: D999183
    Type: Grant
    Filed: September 18, 2021
    Date of Patent: September 19, 2023
    Assignee: Lenovo (Beijing) Co., Ltd.
    Inventors: Wei Liu, Xudong Jing