Patents by Inventor Xue Ming Tu

Xue Ming Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical connector with a carrier and terminals located at different distances from side walls
    Patent number: 9577357
    Abstract: An electrical connector for electrically connecting with a chip module includes an insulating body having a bottom wall, multiple rows of terminals located in the bottom wall for electrically connecting the chip module, and a carrier for carrying the chip module to the insulating body. Two first side walls extend from two opposite sides of the bottom wall upward, and two second side walls extend from the other two opposite sides of the bottom wall upward. There are a first gap between the first side wall and a most peripheral terminal corresponding to the first side wall, and a second gap between the second side wall and a most peripheral terminal corresponding to the second side wall. The first gap is greater than the second gap. The carrier has a buckling portion, received in the first gap, and for buckling a bottom surface of the chip module.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: February 21, 2017
    Assignee: LOTES CO., LTD
    Inventor: Xue Ming Tu
  • ELECTRICAL CONNECTOR WITH CARRIER FOR CARRYING A CHIP MODULE
    Publication number: 20160352029
    Abstract: An electrical connector for electrically connecting with a chip module includes an insulating body having a bottom wall, multiple rows of terminals located in the bottom wall for electrically connecting the chip module, and a carrier for carrying the chip module to the insulating body. Two first side walls extend from two opposite sides of the bottom wall upward, and two second side walls extend from the other two opposite sides of the bottom wall upward. There are a first gap between the first side wall and a most peripheral terminal corresponding to the first side wall, and a second gap between the second side wall and a most peripheral terminal corresponding to the second side wall. The first gap is greater than the second gap. The carrier has a buckling portion, received in the first gap, and for buckling a bottom surface of the chip module.
    Type: Application
    Filed: October 22, 2015
    Publication date: December 1, 2016
    Inventor: Xue Ming Tu