Patents by Inventor Xue-Xian Wu

Xue-Xian Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for adhering a flexible film to a ventilated platen without air entrapment
    Patent number: 6733623
    Abstract: An apparatus and a method for adhering a flexible film to a ventilated platen without air entrapment problems are described. In the apparatus, a tool body and a tool lid are connected together by a hinge means in a clam-shell configuration. The tool body has a cavity formed such that a ventilated platen can be tightly positioned therein with a top surface of the platen exposed. A flexible film is mounted to an inner surface of the tool lid facing the tool body and pushed down onto the ventilated platen while air is being withdrawn from the ventilated platen. The adhesion process for the flexible film to the platen can be completed without any air entrapment problem existing between the film and the platen.
    Type: Grant
    Filed: July 18, 2001
    Date of Patent: May 11, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Xue-Xian Wu, Ming-Guo Yu
  • Apparatus and method for adhering a flexible film to a ventilated platen without air entrapment
    Publication number: 20030015276
    Abstract: An apparatus and a method for adhering a flexible film to a ventilated platen without air entrapment problems are described. In the apparatus, a tool body and a tool lid are connected together by a hinge means in a clam-shell configuration. The tool body has a cavity formed such that a ventilated platen can be tightly positioned therein with a top surface of the platen exposed. A flexible film is mounted to an inner surface of the tool lid facing the tool body and pushed down onto the ventilated platen while air is being withdrawn from the ventilated platen. The adhesion process for the flexible film to the platen can be completed without any air entrapment problem existing between the film and the platen.
    Type: Application
    Filed: July 18, 2001
    Publication date: January 23, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Xue-Xian Wu, Ming-Guo Yu