Patents by Inventor Xuefei Wan

Xuefei Wan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package that includes lamination layer
    Patent number: 10985080
    Abstract: An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: April 20, 2021
    Assignee: Intel Corporation
    Inventors: Pramod Malatkar, Kyle Yazzie, Naga Sivakumar Yagnamurthy, Richard J. Harries, Dilan Seneviratne, Praneeth Akkinepally, Xuefei Wan, Yonggang Li, Robert L. Sankman
  • ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER
    Publication number: 20180350709
    Abstract: An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.
    Type: Application
    Filed: November 24, 2015
    Publication date: December 6, 2018
    Inventors: Pramod Malatkar, Kyle Yazzie, Naga Sivakumar Yagnamurthy, Richard J. Harries, Dilan Seneviratne, Praneeth Akkinepally, Xuefei Wan, Yonggang Li, Robert L. Sankman