Abstract: The instant disclosure relates to (among other things) compounds that are derivatives of 6-(2,3-dichlorophenyl)-1,2,4-triazin-5-amine. The compounds provided possess unique effects and differences over other phenyltriazines known in the art.

Abstract: The instant disclosure relates to (among other things) compounds that are derivatives of 6-(2,3-dichlorophenyl)-1,2,4-triazin-5-amine. The compounds provided possess unique effects and differences over other phenyltriazines known in the art.

Abstract: The instant disclosure relates to (among other things) compounds that are derivatives of 6-(2,3-dichlorophenyl)-1,2,4-triazin-5-amine. The compounds provided possess unique effects and differences over other phenyltriazines known in the art.

Abstract: The instant disclosure relates to (among other things) compounds that are derivatives of 6-(2,3-dichlorophenyl)-1,2,4-triazin-5-amine. The compounds provided possess unique effects and differences over other phenyltriazines known in the art.

Abstract: The present invention relates to conjugates of small-interfering nucleic acids (siNA). Compositions of siNA suited for administration to a patient are described. Methods for delivering the compositions are also described.

Abstract: The present invention relates to conjugates of small-interfering nucleic acids (siNA). Compositions of siNA suited for administration to a patient are described. Methods for delivering the compositions are also described.

Abstract: An apparatus and method for reducing a number of matched entries to more relevant matched entries. In routers, a destination Internet Protocol address of an incoming packet is matched to a router table of Internet Protocol address prefixes, yielding multiple matching entries in the router table. Less relevant matching entries that contain shorter Internet Protocol address prefixes are automatically removed, leaving only the entry including a longest matching prefix.

Abstract: The present invention relates to a method and apparatus for a reconfigurable multi-chip module. The reconfigurable multi-chip module includes a processor; a memory module connected to the processor; and a memory control component for controlling whether the processor uses the memory module. The method of producing multi-chip modules includes assembling a processor and a memory module on the multi-chip module; testing the memory module; and selectively configuring the processor to use the memory module based on the testing of the memory module.

Abstract: In one aspect of the present invention, a method provides a connecting path diversion through an upper layer of an integrated circuit by alteration of a connecting path through a lower layer of the integrated circuit. This method enables a circuit path in an integrated circuit to be modified in an accessible layer for testing before the modified circuit path is incorporated in a redesigned integrated circuit design. In another aspect of the present invention, a modified multi-layer integrated circuit chip includes a connecting path formed in a lower layer and a substitute connecting path that is etched in the lower layer. Subsequently, the connecting path formed in the lower layer may be severed.

Abstract: The present invention relates to a method and apparatus for a reconfigurable multi-chip module. The reconfigurable multi-chip module includes a processor; a memory module connected to the processor; and a memory control component for controlling whether the processor uses the memory module. The method of producing multi-chip modules includes assembling a processor and a memory module on the multi-chip module; testing the memory module; and selectively configuring the processor to use the memory module based on the testing of the memory module.

Abstract: In one aspect of the present invention, a method provides a connecting path diversion through an upper layer of an integrated circuit by alteration of a connecting path through a lower layer of the integrated circuit. This method enables a circuit path in an integrated circuit to be modified in an accessible layer for testing before the modified circuit path is incorporated in a redesigned integrated circuit design.

Abstract: In one aspect of the present invention, a method provides a connecting path diversion through an upper layer of an integrated circuit by alteration of a connecting path through a lower layer of the integrated circuit. This method enables a circuit path in an integrated circuit to be modified in an accessible layer for testing before the modified circuit path is incorporated in a redesigned integrated circuit design. In another aspect of the present invention, a modified multi-layer integrated circuit chip includes a connecting path formed in a lower layer and a substitute connecting path that is etched in the lower layer. Subsequently, the connecting path formed in the lower layer may be severed.