Abstract: A pair of optical components is used in an isolator that enables electric isolation. Each of the optical components includes: first lens portions arranged on different optical paths and transmitting light in a first direction; second lens portions arranged on different optical paths and transmitting light in the second direction orthogonal to the first direction; and a reflection portion reflecting, in the second direction, the light in the first direction transmitted through the first lens portion and guiding the light to the second lens portion, or reflecting, in the first direction, the light in the second direction transmitted through the second lens portion and guiding the light to the first lens portion The second lens portion included in one of the pair of optical components and the second lens portion included in the other optical component are spaced apart from each other and face each other.

Abstract: A pair of optical components is used in an isolator that enables electric isolation. Each of the optical components includes: first lens portions arranged on different optical paths and transmitting light in a first direction; second lens portions arranged on different optical paths and transmitting light in the second direction orthogonal to the first direction; and a reflection portion reflecting, in the second direction, the light in the first direction transmitted through the first lens portion and guiding the light to the second lens portion, or reflecting, in the first direction, the light in the second direction transmitted through the second lens portion and guiding the light to the first lens portion The second lens portion included in one of the pair of optical components and the second lens portion included in the other optical component are spaced apart from each other and face each other.

Abstract: The present invention provides a submount which includes a semiconductor element and which can be easily connected to an IC on a main substrate. The submount in one embodiment of the present invention includes: a substrate; electrodes; the semiconductor element; Au wires; and gold bumps. The electrodes, the semiconductor element, the Au wires, and the gold bumps, are encapsulated on the substrate by a resin. The gold bumps are formed on the electrodes and the Au wires by ball bonding and are cut by dicing such that side surfaces of the gold bumps are exposed. The exposed surfaces function as side surface electrodes of the submount.

Abstract: In manufacturing a submount, a first electrode layer (12) is formed as a layer on the surface of a submount substrate (11); a side surface (122) of the first electrode layer (12) is formed on substantially the same plane as a side surface (112) of the submount substrate (11); and the side surface (122) of the first electrode layer (12) is a connection surface for creating an electrical connection with the first electrode layer (12). By making the first electrode layer (12) sufficiently thick, the surface area of the side surface (122) can be made sufficiently large to allow, for example, wire bonding using the side surface (122). Further, components such as an optical element (14) can be protected by a sealing material (16).

Abstract: The present invention provides a submount which includes a semiconductor element and which can be easily connected to an IC on a main substrate. The submount in one embodiment of the present invention includes: a substrate; electrodes; the semiconductor element; Au wires; and gold bumps. The electrodes, the semiconductor element, the Au wires, and the gold bumps are encapsulated on the substrate by a resin. The gold bumps are formed on the electrodes and the Au wires by ball bonding and are cut by dicing such that side surfaces of the gold bumps are exposed. The exposed surfaces function as side surface electrodes of the submount.

Abstract: In manufacturing a submount, a first electrode layer (12) is formed as a layer on the surface of a submount substrate (11); a side surface (122) of the first electrode layer (12) is formed on substantially the same plane as a side surface (112) of the submount substrate (11); and the side surface (122) of the first electrode layer (12) is a connection surface for creating an electrical connection with the first electrode layer (12). By making the first electrode layer (12) sufficiently thick, the surface area of the side surface (122) can be made sufficiently large to allow, for example, wire bonding using the side surface (122). Further, components such as an optical element (14) can be protected by a sealing material (16).

Abstract: In order to simplify submount manufacture, and increase the manufacturing efficiency thereof, a first electrode layer (12) is formed as a layer on the surface of a submount substrate (11); a side surface (122) of the first electrode layer (12) is formed on substantially the same plane as a side surface (112) of the submount substrate (11); and the side surface (122) of the first electrode layer (12) is a connection surface for creating an electrical connection with the first electrode layer (12). By making the first electrode layer (12) sufficiently thick, the surface area of the side surface (122) can be made sufficiently large. This allows, for example, wire bonding using this side surface (122). Further, components such as an optical element (14) can be protected by a sealing material (16).

Abstract: There are provided a signal transmission device capable of improving a production efficiency and reducing a production cost, and a manufacturing method thereof. A spacer 4 is interposed between peripheral surface portions 101a of optical waveguides 101 exposed by an optical waveguide exposure section 5 and a rear surface 115 of an optical module substrate 105. A height of the spacer 4 alone allows an optical element 103 of the optical module substrate 105 to be positioned so high that this optical element 103 can actually face optical waveguide end surfaces 109. Therefore, it is not required that the spacer be individually manufactured per signal transmission device. Further, there can be avoided individual length measurements of distances such as a distance L2 between a surface 2a of a base platform 2 and the peripheral surface portions 101a of the optical waveguides 101, or the like.

Abstract: The present invention provides technology for mounting components with simple processing and with comparatively high dimensional precision. Welding sections (21) and non-welding sections (31) are formed on a surface of a substrate (1) by transferring a mask pattern. Next, fusing material (4) is arranged on the welding sections (21), and the fusing material (4) is fused to the welding sections (21). The fusing material (4) is positioned with comparatively high dimensional precision using the non-welding sections (31). Next, a component (5) is mounted on the substrate (1) with the fusing material (4) that has been fused to the welding sections (21) as positioning guides. In this way, it is possible to mount the component (5) on the substrate (1) with high dimensional precision.

Abstract: A signal transmission device includes a base plate and a photoelectric converter-sealed member. The base plate is structured to have an optical waveguide formed internally, an opening formed to expose the optical waveguide, and a mounting surface provided to allow an electronic part to be mounted thereon. The photoelectric converter-sealed member is placed in the opening of the base plate to include a photoelectric conversion module for making conversion between an electric signal and a light signal and provided by sealing at least the photoelectric conversion module with a predetermined material to expose at least part of a wiring from the photoelectric conversion module on a substantially identical plane with an opening end face of the opening of the base plate. The opening is either a recess or a through hole. This arrangement desirably ensures the higher-speed transmission of electric signals between the photoelectric conversion module and the LSI package.

Abstract: Photoelectric converter-sealed members 40 and 60 with photoelectric conversion modules 42 and 62 sealed therein are respectively placed in recesses 32a and 32b formed in the direction of depth of a base plate 30 from its mounting surface. The base plate 30 has internally formed optical waveguides 34. Wirings 44 and 64 from the photoelectric conversion modules 42 and 62 are exposed on a substantially identical plane with respective opening end faces of the recesses 32a and 32b. The exposure of the wirings 44 and 64 on the substantially identical plane with the opening end faces of the recesses 32a and 32b effectively shortens the wiring lengths of the wirings 44 and 64 from the photoelectric conversion modules 42 and 62 to LSI packages 10a and 10b mounted on the mounting surface of the base plate 30, compared with the conventional structure with wirings from photoelectric conversion modules internally laid in a base plate.