Patents by Inventor Xuemei CUI

Xuemei CUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12069891
    Abstract: A display substrate includes a backplane, first light-emitting devices capable of emitting first color light, second light-emitting devices capable of emitting second color light that are all disposed on the backplane, a low-refractive-index intercalation layer disposed at a side, away from the backplane, of the first light-emitting devices and the second light-emitting devices, and an encapsulation layer. The encapsulation layer includes a first inorganic barrier layer, a first organic barrier layer and a second inorganic barrier layer that are sequentially stacked on a side of the low-refractive-index intercalation layer away from the backplane. A refractive index of the low-refractive-index intercalation layer is less than a refractive index of the first inorganic barrier layer.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: August 20, 2024
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Cheng Zeng, Jaeho Lee, Myoungsoo Lee, Xuemei Cui, Ruitao Li, Shiqi Li, Zhen Sun, Lulin Ma
  • Publication number: 20230112711
    Abstract: A method of curing polyimide, polyimide copolymers, polyimide composites or combinations is provided. The method involves preparing a reaction system comprising poly(amic acid) and at least one other compound selected from the group consisting of copolymers, solvents, fillers and nanofillers. Then, a combined overall microwave absorptivity of the reaction system is determined. A temperature ramp rate is calculated for a microwave power level and time using the combined overall microwave absorptivity. The reaction system is then exposed to microwave radiation according to the calculated temperature ramp rate, producing a cured product.
    Type: Application
    Filed: September 15, 2022
    Publication date: April 13, 2023
    Applicant: University of Cincinnati
    Inventors: Jude Onwuegbu Iroh, Shengdong Xiao, Ruchinda Seth Gooneratne, Xuemei Cui
  • Publication number: 20230110450
    Abstract: A method of making a three-dimensional object comprising one or more polyimide copolymers, polyimide composites or combinations thereof is provided. The method involves 3D printing a solution comprising polyamic acid (PAA), tetraethyl orthosilicate (TEOS), and a silane selected from the group consisting of aminopropyl trimethoxysilane (APTMS), aminopropyl triethoxysilane (APTES), N-[3-(trimethoxysilyl)propyl]-ethylene diamine (ETDA), and glycidoxypropyl trimethoxysilane (GPTMS) to produce a three-dimensional form, and thermosetting the three-dimensional form.
    Type: Application
    Filed: July 26, 2022
    Publication date: April 13, 2023
    Applicant: University of Cincinnati
    Inventors: Jude Onwuegbu Iroh, Xuemei Cui, Shengdong Xiao, Ruchinda S. Gooneratne
  • Publication number: 20230067641
    Abstract: A display substrate includes a backplane, first light-emitting devices capable of emitting first color light, second light-emitting devices capable of emitting second color light that are all disposed on the backplane, a low-refractive-index intercalation layer disposed at a side, away from the backplane, of the first light-emitting devices and the second light-emitting devices, and an encapsulation layer. The encapsulation layer includes a first inorganic barrier layer, a first organic barrier layer and a second inorganic barrier layer that are sequentially stacked on a side of the low-refractive-index intercalation layer away from the backplane. A refractive index of the low-refractive-index intercalation layer is less than a refractive index of the first inorganic barrier layer.
    Type: Application
    Filed: November 24, 2020
    Publication date: March 2, 2023
    Applicants: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Cheng ZENG, Jaeho LEE, Myoungsoo LEE, Xuemei CUI, Ruitao LI, Shiqi LI, Zhen SUN, Lulin MA