Patents by Inventor Xue-Mei Guo

Xue-Mei Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED assembly and manufacturing method thereof
    Patent number: 8324724
    Abstract: An LED assembly including a heat sink, a surface treatment dielectric layer, an electrically conductive layer, a thermally conductive layer and an LED chip. The surface treatment dielectric layer is disposed on an upper surface of the heat sink and defines at least one first through hole to expose a portion of the upper surface. The electrically conductive layer is formed on the surface treatment dielectric layer, includes a plurality of electrical traces and defines at least one second through hole corresponding to the first through hole. The thermally conductive layer is formed in the first and the second through holes and directly contacted with a portion of the upper surface exposed from the overlapped region of the first through hole and the second through hole. The LED chip includes a plurality of electrodes electrically connected to the electrical traces and is directly contacted with the thermally conductive layer.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: December 4, 2012
    Assignee: Getac Technology Corporation
    Inventors: Cheng-Tao Wu, Fon-Jein Hsieh, Xue-Mei Guo
  • LED ASSEMBLY AND MANUFACTURING METHOD THEREOF
    Publication number: 20120025257
    Abstract: An LED assembly including a heat sink, a surface treatment dielectric layer, an electrically conductive layer, a thermally conductive layer and an LED chip. The surface treatment dielectric layer is disposed on an upper surface of the heat sink and defines at least one first through hole to expose a portion of the upper surface. The electrically conductive layer is formed on the surface treatment dielectric layer, includes a plurality of electrical traces and defines at least one second through hole corresponding to the first through hole. The thermally conductive layer is formed in the first and the second through holes and directly contacted with a portion of the upper surface exposed from the overlapped region of the first through hole and the second through hole. The LED chip includes a plurality of electrodes electrically connected to the electrical traces and is directly contacted with the thermally conductive layer.
    Type: Application
    Filed: February 9, 2011
    Publication date: February 2, 2012
    Applicant: GETAC TECHNOLOGY CORPORATION
    Inventors: Cheng-Tao Wu, Fon-Jein Hsieh, Xue-Mei Guo