Patents by Inventor Xuepeng GAO

Xuepeng GAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11859493
    Abstract: A device includes a pressure measuring segment, a connecting rod, a hydraulic pump, a pressure gauge, a high-pressure oil pipe, a pressure control valve, a tray, a push rod and a connection casing. The pressure measuring segment is on the connecting rod, a front end of the push rod is connected with the connecting rod, the tray is at a rear end of the push rod, the connection casing is connected with the tray. The pressure measuring segment includes a main pipe, a hydraulic bladder, a fixing ring, a barrier sheet, an outer pillow housing and a connection sleeve. Both ends of the hydraulic bladder are sleeved on the main pipe, an oil inlet is in communication with the hydraulic bladder, the outer pillow housing is sleeved on the main pipe, the connection sleeve is wrapped around the outer pillow housing.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: January 2, 2024
    Assignee: SHANDONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Fenghai Yu, Kai Zhou, Yunliang Tan, Xuepeng Gao, Wei Zhao
  • Patent number: 11332471
    Abstract: Disclosed are a leveling agent, a metal plating composition containing same, and a preparation method therefor and the use thereof. The raw materials of the metal electroplating composition comprise a metal plating solution and a leveling agent; the metal plating solution comprises a copper salt, an acidic electrolyte, a source of halide ions and water; and the leveling agent is a compound of formula I. The metal plating composition can be used in the processes of printed circuit board electroplating and integrated circuit copper interconnection electroplating, can achieve the effects of no voids or defects, low purity in the plating layer, good plating homogeneity, a dense structure and small surface roughness, and has better industrial application value.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: May 17, 2022
    Assignee: SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD.
    Inventors: Su Wang, Liqi Shi, Xuepeng Gao
  • Publication number: 20210332701
    Abstract: A device includes a pressure measuring segment, a connecting rod, a hydraulic pump, a pressure gauge, a high-pressure oil pipe, a pressure control valve, a tray, a push rod and a connection casing. The pressure measuring segment is on the connecting rod, a front end of the push rod is connected with the connecting rod, the tray is at a rear end of the push rod, the connection casing is connected with the tray. The pressure measuring segment includes a main pipe, a hydraulic bladder, a fixing ring, a barrier sheet, an outer pillow housing and a connection sleeve. Both ends of the hydraulic bladder are sleeved on the main pipe, an oil inlet is in communication with the hydraulic bladder, the outer pillow housing is sleeved on the main pipe, the connection sleeve is wrapped around the outer pillow housing.
    Type: Application
    Filed: May 14, 2019
    Publication date: October 28, 2021
    Inventors: Fenghai YU, Kai ZHOU, Yunliang TAN, Xuepeng GAO, Wei ZHAO
  • Publication number: 20190367522
    Abstract: Disclosed are a leveling agent, a metal plating composition containing same, and a preparation method therefor and the use thereof. The raw materials of the metal electroplating composition comprise a metal plating solution and a leveling agent; the metal plating solution comprises a copper salt, an acidic electrolyte, a source of halide ions and water; and the leveling agent is a compound of formula I. The metal plating composition can be used in the processes of printed circuit board electroplating and integrated circuit copper interconnection electroplating, can achieve the effects of no voids or defects, low purity in the plating layer, good plating homogeneity, a dense structure and small surface roughness, and has better industrial application value.
    Type: Application
    Filed: December 15, 2017
    Publication date: December 5, 2019
    Inventors: Su WANG, Liqi SHI, Xuepeng GAO