Abstract: A communication method and an apparatus are provided. The method includes: a first node receives a resource scheduling message transmitted by an upper-level node. The resource scheduling message carries template identification information indicating a target time slot allocation template to be used. The first node determines a transmission time slot of the first node based on indication information that is included in the target time slot allocation template and that is used for allocating time slots to a plurality of nodes. Because a byte length occupied by the template identification information is far less than a byte length occupied by time slot allocation information corresponding to each node, a length of the resource scheduling message can be greatly shortened, and even if a quantity of nodes in the communication system increases, the length of the resource scheduling message does not increase.

Abstract: This invention provides a preparation, composition, product, and application of a photo-coupled synergistically crosslinked hydrogel material. The preparation includes dissolving Component A including a photosensitive polymer derivative having o-nitrobenzyl phototriggers and Component B including a polymer derivative having amine or alkene (double group) or sulfhydryl group in a biocompatible medium to obtain solution A and solution B, respectively; mixing the solution A and solution B homogeneously to obtain a hydrogel precursor solution; initiating photo-coupled synergistic crosslinking under an irradiation of a UV light to form the hydrogel. The irradiation causes the o-nitrobenzyl phototriggers to generate an aldehyde group/keto group or a nitroso group to initiate photo-coupled synergetic crosslinking. The photo-coupled synergistically crosslinked hydrogel has applications in tissue engineering, regenerative medicine, 3D printing and as a carrier of cell, protein or drug.

Abstract: A pressure sensing device is provided. In the pressure sensing device, the rigid structure includes rigid blocks arranged at intervals, and strain amplification zones are formed between every two adjacent rigid blocks. The force sensors include first sensors and second sensors. The first sensors are arranged on the two installation surfaces of the strain amplification zones and capable of following the deformation of the measured object, the second sensors are arranged on the two installation surfaces of the rigid blocks and located close to corresponding first sensors. At least four force sensors are connected to form a bridge circuit, and the bridge circuit is electrically connected to a signal processing circuit, so as to detect deformation of the rigid structure and obtain a force acted on the measured object. An output signal of each of the second sensors serves as a temperature compensation signal of the corresponding first sensors.

Abstract: A pressure sensing assembly, a pressure sensing method, and a device having the pressure sensing assembly are disclosed. The detection circuit and the signal generating circuit are connected to a signal processing circuit, the detection circuit includes a first bridge circuit constituted by connecting at least four force sensors R1, R2, R3 and R4. During use, the rigid structure is attached on an object to be detected which is deformed under action of an acting force, the detection circuit and the signal generating circuit are cooperated so as to generate different output signals that pass through the signal processing circuit, so that a direction and a magnitude of the acting force is recognized. The pressure sensing assembly has an integrated structure, is prone to be assembled, has a simple circuit configuration, and is low in cost.

Abstract: A device of force sensing, which includes a rigid structure and force sensors. The rigid structure includes rigid blocks spaced apart, and a strain amplification area is formed between two adjacent rigid blocks, every two force sensors in four force sensors are used as a group, and two groups of the force sensors are selectively arranged corresponding to two of the mounting surfaces of the strain amplification area, the four force sensors are connected to form different bridge circuits.

Abstract: The pressure sensing device includes a substrate and a pressure sensor. The pressure sensor used is a thin-film piezoresistive sensor with a certain area, and a power wire, a ground wire, and two differential wires are led out from ends of the pressure sensor respectively, and the pressure sensor is arranged on the substrate. The substrate is simply attached to the object being tested that is to be subjected to pressure, the pressure sensor is connected to a pressure sensing detection circuit, the object being tested deforms under pressure, and the thin-film piezoresistive sensor deforms as the substrate deforms. The deformation of the substrate is detected through detecting the voltage drop between the two differential wires, which is converted to obtain the pressure on the object being tested, thereby realizing a pressure-sensitive touch function. A pressure sensing method and an electronic terminal with the pressure sensing device are also provided.

Abstract: A pressure sensing device is provided. In the pressure sensing device, the rigid structure includes rigid blocks arranged at intervals, and strain amplification zones are formed between every two adjacent rigid blocks. The force sensors include first sensors and second sensors. The first sensors are arranged on the two installation surfaces of the strain amplification zones and capable of following the deformation of the measured object, the second sensors are arranged on the two installation surfaces of the rigid blocks and located close to corresponding first sensors. At least four force sensors are connected to form a bridge circuit, and the bridge circuit is electrically connected to a signal processing circuit, so as to detect deformation of the rigid structure and obtain a force acted on the measured object. An output signal of each of the second sensors serves as a temperature compensation signal of the corresponding first sensors.

Abstract: A device of force sensing, which includes a rigid structure and force sensors. The rigid structure includes rigid blocks spaced apart, and a strain amplification area is formed between two adjacent rigid blocks, every two force sensors in four force sensors are used as a group, and two groups of the force sensors are selectively arranged corresponding to two of the mounting surfaces of the strain amplification area, the four force sensors are connected to form different bridge circuits.

Abstract: A pressure sensing assembly, a pressure sensing method, and a device having the pressure sensing assembly are disclosed. The detection circuit and the signal generating circuit are connected to a signal processing circuit, the detection circuit includes a first bridge circuit constituted by connecting at least four force sensors R1, R2, R3 and R4. During use, the rigid structure is attached on an object to be detected which is deformed under action of an acting force, the detection circuit and the signal generating circuit are cooperated so as to generate different output signals that pass through the signal processing circuit, so that a direction and a magnitude of the acting force is recognized. The pressure sensing assembly has an integrated structure, is prone to be assembled, has a simple circuit configuration, and is low in cost.

Abstract: The pressure sensing device includes a substrate and a pressure sensor. The pressure sensor used is a thin-film piezoresistive sensor with a certain area, and a power wire, a ground wire, and two differential wires are led out from ends of the pressure sensor respectively, and the pressure sensor is arranged on the substrate. The substrate is simply attached to the object being tested that is to be subjected to pressure, the pressure sensor is connected to a pressure sensing detection circuit, the object being tested deforms under pressure, and the thin-film piezoresistive sensor deforms as the substrate deforms. The deformation of the substrate is detected through detecting the voltage drop between the two differential wires, which is converted to obtain the pressure on the object being tested, thereby realizing a pressure-sensitive touch function. A pressure sensing method and an electronic terminal with the pressure sensing device are also provided.