Abstract: Provided is a gene for efficiently expressing hyaluronic acid hydrolase. A nucleotide sequence of the gene is represented by SEQ ID NO: 4. By truncating a segment of a signal peptide sequence at the N-terminus of a full-length hyaluronic acid hydrolase gene, the Pichia pastoris engineering strain of high level expression genetic engineering hyaluronic acid hydrolase is constructed. The enzyme activity of the hyaluronic acid hydrolase in a fermentation broth obtained by high-density fermentation using the constructed Pichia pastoris engineering strain is up to 4.7×105 U/mL.

Abstract: This application provides an electronic device and a chip packaging method. The electronic device includes a housing. A substrate is arranged in the housing. A first crystal device and an adapter board are arranged in parallel on a side surface of the substrate. The adapter board includes a first ground pad. The first ground pad is arranged on a surface of the adapter board facing the substrate, and the adapter board is electrically connected to the substrate by the first ground pad, so that the adapter board is grounded. A first part of a first plastic packaging layer is arranged on a surface of the first crystal device, and a second part of the first plastic packaging layer is arranged between the adapter board and the substrate. The first part and the second part are integrally formed. A first shielding metal covers a surface of the first part and is electrically connected to the first ground pad, so that the first shielding metal is grounded.

Abstract: A heparin skeleton synthase originates from Neisseria animaloris, with an amino acid sequence as shown in SEQ ID NO.2 and a nucleotide sequence of the coding gene as shown in SEQ ID NO.1. Its recombinant expression level is 6.8 times that of the existing heparin skeleton synthase KfiA from Escherichia coli K5, and total enzyme activity per fermentation liquor is 5.22 times that of the heparin skeleton synthase KfiA. The heparin skeleton synthase mutants obtained through site-directed mutagenesis of the sites No. 16, No. 25, No. 30, No. 111, No. 165, and No. 172 in the amino acid sequence of the said heparin skeleton synthase all have high expression levels.

Abstract: Disclosed are a hyaluronic acid composition having permeation-promoting effects, a preparation method thereof and the use thereof. Provided is a hyaluronic acid composition, comprising: hyaluronic acid or a salt thereof, an acetylated hyaluronic acid or a salt thereof, and a hydrolyzed hyaluronic acid or a salt thereof. The hyaluronic acid composition of the present application has a small addition amount, can effectively facilitate the absorption of other active ingredients in a formula to achieve synergistic effects, has a small particle size, is uniform, has a fast dissolution rate, has an excellent absorption speed in a product, and is superior to hyaluronic acid treated by means of simple mixing in improving skin hydration. Compared with traditional penetration promoters, the hyaluronic acid composition of the present application causes no damage to the skin and is safe.

Abstract: The present application provides a use of a hyaluronic acid or a salt thereof and/or trehalose in stabilizing ergothioneine, an additive for stabilizing ergothioneine, the additive containing the hyaluronic acid or the salt thereof and/or trehalose, and a composition, the composition containing ergothioneine, the hyaluronic acid or the salt thereof, and trehalose. Compared with other auxiliary materials, the hyaluronic acid or the salt thereof and trehalose provided by the present invention can obviously mitigate the damage of a high temperature to ergothioneine, thereby increasing the yield of an ergothioneine powder product. The composition obtained by the present invention has good antioxidant and anti-apoptotic effects.

Abstract: This application provides a package body, including: a substrate; a plurality of electronic components, arranged on the substrate; a package material layer, located on the substrate and packaging the plurality of electronic components; a low frequency shielding conductive structure, embedded in the package material layer, where the low frequency shielding conductive structure is located on a side of the package material layer away from the substrate and is spaced apart from the plurality of electronic components, the low frequency shielding conductive structure is provided with a plurality of through holes, an area of an opening of each of at least some through holes is less than 1 mm*1 mm, and a thickness of the low frequency shielding conductive structure is not less than 10 ?m. This application further provides a terminal and an electronic device to which the package body is applied and a preparation method of the package body.

Abstract: The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.

Abstract: A heparin skeleton synthase originates from Neisseria animaloris, with an amino acid sequence as shown in SEQ ID NO.2 and a nucleotide sequence of the coding gene as shown in SEQ ID NO.1. Its recombinant expression level is 6.8 times that of the existing heparin skeleton synthase KfiA from Escherichia coli K5, and total enzyme activity per fermentation liquor is 5.22 times that of the heparin skeleton synthase KfiA. The heparin skeleton synthase mutants obtained through site-directed mutagenesis of the sites No. 16, No. 25, No. 30, No. 111, No. 165, and No. 172 in the amino acid sequence of the said heparin skeleton synthase all have high expression levels.

Abstract: An embedded package structure, a preparation method therefor and a terminal are described. The embedded package structure includes a first dielectric layer. The first dielectric layer includes a first surface and a second surface. The embedded package structure includes a first device embedded in the first dielectric layer. A thermal conductive layer is attached to a surface of the first device that is exposed on the first surface of the first dielectric layer. A first circuit layer is connected to a surface of the first device that is exposed on the second surface. A second dielectric layer and a third dielectric layer are symmetrically disposed on two sides of the first dielectric layer.

Abstract: The present invention belongs to the field of microbial technology, and specifically relates to a strain of Hericium erinaceus HT-3, with a deposit number of CCTCC No: M 2018567. The present invention also relates to a screening method for Hericium erinaceus HT-3. The screening method comprises the steps of purifying the strain of Hericium erinaceus from a tissue block, fermenting and culturing the strain, soak extracting ergothioneine from the mycelium cells in the fermentation broth, detecting the ergothioine content in the fermentation broth. The Hericium erinaceus strain screened according to the present invention has high ergothioneine yield, and the screening method is simple in process, easy to be operated, and low in production cost.

Abstract: The present invention mainly relates to a 3-D packaging structure based on a flexible substrate and a method for manufacturing the same; the method comprises: providing a bendable continuous flexible substrate, determining the shape of the substrate according to the size, the quantity and the shape of dies, and making surface wiring on the substrate to allow interlayer electrical connection; welding dies that are to be packaged onto the bendable continuous flexible substrate; filling the gaps between the dies and the substrate with an underfill; bending the substrates towards the center to allow the peripheral dies to coincide in parallel with the die situated at the center, and bonding the two layers of parallel dies with a bonding adhesive.

Abstract: A chip embedded package method is provided by an embodiment of the present invention. The method comprises: etching metallic sinks on the thicker metal layer of each organic substrate; part of metallic sinks is used for packaging at least one chip, and other metallic sinks are used for via-holes; mounting the at least one chip into a metallic sink of each organic substrate via adhesive; flipping one organic substrate on another to form a combination; drilling blind-holes on both sides of the combination of the two organic substrates to pass through the adhesive; drilling via-holes to get through the combination of the two organic substrates, wherein the via-holes locates beyond the metallic sinks with chips; filling the blind-holes and via-holes with conductive medium through an electroplating process.

Abstract: The present invention provides a bacillus sp. having a deposit access number of CGMCC NO. 5744 and a hyaluronidase produced by the bacillus and the amino acid sequence of the hyaluronidase is shown in SEQ ID NO: 2. The present invention further relates to a process for preparing oligomeric hyaluronic acid or salts thereof or low-molecular-weight hyaluronic acid or salts thereof by using the bacillus or the hyaluronidase produced thereby. The produced oligomeric hyaluronates or low-molecular-weight hyaluronates have advantages such as good transdermal absorption ability, high purity, no cytotoxicity, potent antioxidant ability. The present invention also provides use of the bacillus having a deposit access number of CGMCC NO. 5744, or the hyaluronidase, oligomeric hyaluronates or salts thereof, low-molecular-weight hyaluronates or salts thereof produced by the bacillus in the fields of osmetics, food products and medicines.

Abstract: The present invention mainly relates to a 3-D packaging structure based on a flexible substrate and a method for manufacturing the same; the method comprises: providing a bendable continuous flexible substrate, determining the shape of the substrate according to the size, the quantity and the shape of dies, and making surface wiring on the substrate to allow interlayer electrical connection; welding dies that are to be packaged onto the bendable continuous flexible substrate; filling the gaps between the dies and the substrate with an underfill; bending the substrates towards the centre to allow the peripheral dies to coincide in parallel with the die situated at the centre, and bonding the two layers of parallel dies with a bonding adhesive.

Abstract: The present invention provides a bacillus sp. having a deposit access number of CGMCC NO. 5744 and a hyaluronidase produced by the bacillus and the amino acid sequence of the hyaluronidase is shown in SEQ ID NO: 2. The present invention further relates to a process for preparing oligomeric hyaluronic acid or salts thereof or low-molecular-weight hyaluronic acid or salts thereof by using the bacillus or the hyaluronidase produced thereby. The produced oligomeric hyaluronates or low-molecular-weight hyaluronates have advantages such as good transdermal absorption ability, high purity, no cytotoxicity, potent antioxidant ability. The present invention also provides use of the bacillus having a deposit access number of CGMCC NO. 5744, or the hyaluronidase, oligomeric hyaluronates or salts thereof, low-molecular-weight hyaluronates or salts thereof produced by the bacillus in the fields of osmetics, food products and medicines.

Abstract: A chip embedded package method is provided by an embodiment of the present invention. The method comprises: etching metallic sinks on the thicker metal layer of each organic substrate; part of metallic sinks is used for packaging at least one chip, and other metallic sinks are used for via-holes; mounting the at least one chip into a metallic sink of each organic substrate via adhesive; flipping one organic substrate on another to form a combination; drilling blind-holes on both sides of the combination of the two organic substrates to pass through the adhesive; drilling via-holes to get through the combination of the two organic substrates, wherein the via-holes locates beyond the metallic sinks with chips; filling the blind-holes and via-holes with conductive medium through an electroplating process.

Abstract: The present invention discloses a bismuth hyaluronate, characterized in that the bismuth content is from 0.5% to 40%, and the glucuronate content is from 20% to 45%, based on dry weight. Also provided is a method for the preparation of said bismuth hyaluronate comprising reaction of a soluble hyaluronate salt with a bismuth salt in a basic aqueous solution, followed by steps of precipitation, filtration, desalting, dehydrating and drying to obtain the product. Further disclosed is the use of the bismuth hyaluronate in the manufacture of a medicament or health foods for preventing and treating gastrointestinal disorders, in particular ulcerous disorders of the GI tract. It has been proven in animal experiments to show a better therapeutic effect than products of the same type.

Abstract: The present invention discloses a bismuth hyaluronate, characterized in that the bismuth content is from 0.5% to 40%, and the glucuronate content is from 20% to 45%, based on dry weight. Also provided is a method for the preparation of said bismuth hyaluronate comprising reaction of a soluble hyaluronate salt with a bismuth salt in a basic aqueous solution, followed by steps of precipitation, filtration, desalting, dehydrating and drying to obtain the product. Further disclosed is the use of the bismuth hyaluronate in the manufacture of a medicament or health foods for preventing and treating gastrointestinal disorders, in particular ulcerous disorders of the GI tract. It has been proven in animal experiments to show a better therapeutic effect than products of the same type.