Abstract: An electronic component package structure includes at least a substrate having a set attachment area for attaching an electronic component; a conductive lid having a top and a sidewall that extends toward the substrate, where one side of the sidewall close to the substrate has a bonding end, where the bonding end bonds the conductive lid to the substrate by using a non-conductive adhesive, and the conductive lid bonded to the substrate encloses the attachment area and forms a shielding space over the attachment area; and the non-conductive adhesive is located between the substrate and the bonding end.

Abstract: A mask plate, a method for manufacturing a color film substrate and a color film substrate for decreasing the segment difference of the color filter layer are disclosed. The mask plate includes a plurality of first regions, each of the plurality of first regions corresponding to each subpixel unit; and a second region between two adjacent first regions. Each first region is respectively provided with one first subregion for forming a color filter layer pattern within an opening region of a black matrix layer, and two second subregions for forming a color filter layer pattern within a non-opening region of the black matrix layer. The first subregion is between the two second subregions. In each second subregion: along the direction away from the first subregion, the transmittance of the second subregion gradually decreases or increases.

Abstract: The present disclosure provides a method for exposure and development, a system for controlling exposure and a system for exposure and development. The method for exposure and development is configured to expose and develop a substrate when the substrate having a size larger than that of a mask. The method includes: exposing and developing a plurality of different regions of the substrate by means of the mask respectively, wherein the plurality of different regions are pieced to form an entire region which needs to be exposed and developed.

Abstract: An electronic component package structure and an electronic device where the electronic component package structure includes at least a substrate having a set attachment area for attaching an electronic component; a conductive lid having a top and a sidewall that extends toward the substrate, where one side of the sidewall close to the substrate has a bonding end, where the bonding end bonds the conductive lid to the substrate by using a non-conductive adhesive, and the conductive lid bonded to the substrate encloses the attachment area and forms a shielding space over the attachment area; and the non-conductive adhesive is located between the substrate and the bonding end, and has a dielectric constant not less than 7 and a coating thickness not greater than 0.07 millimeters (mm). With the present disclosure, an Electromagnetic Interference (EMI) shielding effect of the shielding space can be improved.

Abstract: An electronic component package structure and an electronic device are provided. The electronic component package structure includes at least: a substrate having a set attachment area for attaching an electronic component; a conductive lid having a top and a sidewall that extends toward the substrate, where one side of the sidewall close to the substrate has a bonding end, where the bonding end bonds the conductive lid to the substrate by using a non-conductive adhesive, and the conductive lid bonded to the substrate encloses the attachment area and forms a shielding space over the attachment area; and the non-conductive adhesive is located between the substrate and the bonding end, and has a dielectric constant not less than 7 and a coating thickness not greater than 0.07 millimeters (mm). With the present invention, an Electromagnetic Interference (EMI) shielding effect of the shielding space can be improved.

Abstract: The invention discloses a clearance adjusting apparatus, a clearance adjusting method and a conveyance device. The clearance adjusting apparatus is used for adjusting a clearance between two opposite rollers and comprises: a driver for driving the roller to move up and down, at least one of the rollers being movable relative to the other; and a controller that stores a predetermined clearance scope being connected with the driver for controlling the driver to drive the movable roller to move up and down, so that the clearance between the two rollers falls into the predetermined clearance scope.

Abstract: An alignment exposure method and a method for fabricating a display substrate are disclosed. The alignment exposure method includes a first alignment exposure process and a second alignment exposure process. Multiple groups of alignment marks are provided at an edge of at least one side of the substrate in the first alignment exposure process. At least one group of mark structures are provided at an edge of at least one side of a mask employed in the second alignment exposure process. In multiple mask alignment processes in the second alignment exposure process, each group of the at least one group of the mark structures of the mask are aligned with groups of the alignment marks at a corresponding side of the substrate group by group. The alignment exposure method is employed to realize alignment exposure of a substrate with a size larger than a size of a mask.

Abstract: The present invention relates to the technical field of display, and particularly relates to a substrate damage inspection apparatus, a production system and an inspection method. The substrate damage inspection apparatus comprises a drive unit, support rods, sensors and a controller, wherein the drive unit is connected with the support rods so as to drive the support rods to ascend or descend below a substrate to be detected; and the sensors are disposed on the support rods and communicatively connect with the controller, so as to emit light beams to the substrate to be detected, receive the light beams reflected by the substrate to be detected, and feed them back to the controller. By means of the drive unit and the support rods with the sensors, the substrate damage inspection apparatus realizes damage inspection for the substrate to be detected in a vertical direction.

Abstract: The present disclosure provides a method for exposure and development, a system for controlling exposure and a system for exposure and development. The method for exposure and development is configured to expose and develop a substrate when the substrate having a size larger than that of a mask. The method includes: exposing and developing a plurality of different regions of the substrate by means of the mask respectively, wherein the plurality of different regions are pieced to form an entire region which needs to be exposed and developed.

Abstract: The present invention relates to the technical field of display, and particularly relates to a substrate damage inspection apparatus, a production system and an inspection method. The substrate damage inspection apparatus comprises a drive unit, support rods, sensors and a controller, wherein the drive unit is connected with the support rods so as to drive the support rods to ascend or descend below a substrate to be detected; and the sensors are disposed on the support rods and communicatively connect with the controller, so as to emit light beams to the substrate to be detected, receive the light beams reflected by the substrate to be detected, and feed them back to the controller. By means of the drive unit and the support rods with the sensors, the substrate damage inspection apparatus realizes damage inspection for the substrate to be detected in a vertical direction.

Abstract: The invention discloses a clearance adjusting apparatus, a clearance adjusting method and a conveyance device. The clearance adjusting apparatus is used for adjusting a clearance between two opposite rollers and comprises: a driver for driving the roller to move up and down, at least one of the rollers being movable relative to the other; and a controller that stores a predetermined clearance scope being connected with the driver for controlling the driver to drive the movable roller to move up and down, so that the clearance between the two rollers falls into the predetermined clearance scope.

Abstract: An alignment exposure method and a method for fabricating a display substrate are disclosed. The alignment exposure method includes a first alignment exposure process and a second alignment exposure process. Multiple groups of alignment marks are provided at an edge of at least one side of the substrate in the first alignment exposure process. At least one group of mark structures are provided at an edge of at least one side of a mask employed in the second alignment exposure process. In multiple mask alignment processes in the second alignment exposure process, each group of the at least one group of the mark structures of the mask are aligned with groups of the alignment marks at a corresponding side of the substrate group by group. The alignment exposure method is employed to realize alignment exposure of a substrate with a size larger than a size of a mask.

Abstract: A chip package and a packaging method are provided, which relates to the field of communications technologies, and is invented to implement high-frequency electromagnetic interference shielding and effectively improve chip performance. The package includes a package substrate and a metal cap covering the package substrate, where a silicon chip placement area is arranged on an upper surface of the package substrate, multiple first conductive parts are arranged in a peripheral area of the silicon chip placement area, and an edge of the metal cap is in contact with the package substrate and electrically connected to the multiple first conductive parts, where at least a portion of first conductive parts in the multiple first conductive parts are electrically connected to a grounding part by using the metal cap, and the grounding part is arranged on the package substrate, and configured to ground the package substrate.

Abstract: The embodiments of the present invention provide a mask plate, a method for manufacturing a color film substrate and a color film substrate for decreasing the segment difference of the color filter layer, improving the transmittance of the color film substrate, thereby improving the display effect of the display substrate. Wherein the mask plate comprises: a plurality of first regions, each of the plurality of first regions corresponds to each subpixel unit; and a second region between two adjacent first regions; wherein each first region is respectively provided with one first subregion for forming a color filter layer pattern within a opening region of a black matrix layer, and two second subregions for forming a color filter layer pattern within a non-opening region of the black matrix layer; the first subregion is between the two second subregions; and in each second subregion: along the direction away from the first subregion, the transmittance of the second subregion gradually decreases or increases.

Abstract: An electronic component package structure and an electronic device are provided. The electronic component package structure includes at least: a substrate having a set attachment area for attaching an electronic component; a conductive lid having a top and a sidewall that extends toward the substrate, where one side of the sidewall close to the substrate has a bonding end, where the bonding end bonds the conductive lid to the substrate by using a non-conductive adhesive, and the conductive lid bonded to the substrate encloses the attachment area and forms a shielding space over the attachment area; and the non-conductive adhesive is located between the substrate and the bonding end, and has a dielectric constant not less than 7 and a coating thickness not greater than 0.07 millimeters (mm). With the present invention, an Electromagnetic Interference (EMI) shielding effect of the shielding space can be improved.

Abstract: A chip package and a packaging method are provided, which relates to the field of communications technologies, and is invented to implement high-frequency electromagnetic interference shielding and effectively improve chip performance. The package includes a package substrate and a metal cap covering the package substrate, where a silicon chip placement area is arranged on an upper surface of the package substrate, multiple first conductive parts are arranged in a peripheral area of the silicon chip placement area, and an edge of the metal cap is in contact with the package substrate and electrically connected to the multiple first conductive parts, where at least a portion of first conductive parts in the multiple first conductive parts are electrically connected to a grounding part by using the metal cap, and the grounding part is arranged on the package substrate, and configured to ground the package substrate.