Abstract: The present invention disclosures a critical dimension error analysis method, comprising: S01: performing lithography processes on a wafer, measuring the critical dimension (CD) values of the test points in each of the fields respectively; M and N are integers greater than 1; S02: removing extreme outliers from the critical dimension (CD) values; S03: rebuilding remaining CD values by a reconstruction model fitting method, and obtaining rebuilt critical dimension (CD?) values, according to relative error between CD? and CD, dividing the rebuilt critical dimension (CD?) values into scenes and the number of the scenes is A; S04: calculating components and corresponding residuals of the test points in each of the scenes under a reference system corresponding to a correction model by parameter estimation; S05: modifying machine parameters and masks by the correction model according to above calculation results.

Abstract: A memory and reading, writing and erasing methods thereof. The memory includes: H memory planes arranged in parallel along a first direction, where each memory plane extends in a second direction, and includes M columns of memory strings; each column of memory string extends in a third direction; the first direction, the second direction and the third direction are all different, and H and M are integers greater than zero; each column of memory string includes N rows of memristive memory cells. The memory is also provided with word lines, gating transistors, gating lines, bit lines and a common source line, where memristive memory cells in last rows of all memory strings are connected to the common source line, and the common source line is connected to a reference potential through a reference resistor. Use performance of the memory can be improved.

Abstract: The present invention disclosures a critical dimension error analysis method, comprising: S01: performing lithography processes on a wafer, measuring the critical dimension (CD) values of the test points in each of the fields respectively; M and N are integers greater than 1; S02: removing extreme outliers from the critical dimension (CD) values; S03: rebuilding remaining CD values by a reconstruction model fitting method, and obtaining rebuilt critical dimension (CD?) values, according to relative error between CD? and CD, dividing the rebuilt critical dimension (CD?) values into scenes and the number of the scenes is A; S04: calculating components and corresponding residuals of the test points in each of the scenes under a reference system corresponding to a correction model by parameter estimation; S05: modifying machine parameters and masks by the correction model according to above calculation results.