Patents by Inventor Xue-song Xu

Xue-song Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming premolded lead frame
    Patent number: 7723163
    Abstract: A method of forming a pre-molded lead frame having increased stand-offs includes the steps of attaching a first tape to a first side of the lead frame and a second tape to a second side of the lead frame. The taped lead frame is placed in a mold and a first flow of mold compound is initiated. The first flow of the mold compound fills a space between the first tape and an upper mold chase of the mold. A second flow of the mold compound then is initiated. The second flow of the mold compound fills the spaces between a die pad and leads of the lead frame. The first and second tapes then are removed from the lead frame. Improved stand-offs are provided because the first tape was depressed by the first flow of the mold compound.
    Type: Grant
    Filed: May 26, 2008
    Date of Patent: May 25, 2010
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Xue-song Xu, Zhi-gang Bai, Nan Xu, Jin-zhong Yao
  • METHOD OF FORMING PREMOLDED LEAD FRAME
    Publication number: 20090098686
    Abstract: A method of forming a pre-molded lead frame having increased stand-offs includes the steps of attaching a first tape to a first side of the lead frame and a second tape to a second side of the lead frame. The taped lead frame is placed in a mold and a first flow of mold compound is initiated. The first flow of the mold compound fills a space between the first tape and an upper mold chase of the mold. A second flow of the mold compound then is initiated. The second flow of the mold compound fills the spaces between a die pad and leads of the lead frame. The first and second tapes then are removed from the lead frame. Improved stand-offs are provided because the first tape was depressed by the first flow of the mold compound.
    Type: Application
    Filed: May 26, 2008
    Publication date: April 16, 2009
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Xue-song Xu, Zhi-gang Bai, Nan Xu, Jin-zhong Yao