Abstract: The present invention provides a thermally conductive silicone potting composition. In one embodiment the thermally conductive silicone potting composition comprises: a first part comprising: (a) a vinyl organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 ?m and less than 3 ?m, (d) an alumina and/or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 ?m and less than 15 ?m, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 ?m and less than or equal to 100 ?m, (f) a catalyst, and a second part comprising: (b) a hydride organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.

Abstract: The present invention provides a two-part thermal conductive epoxy adhesive composition with high bonding strength and low modulus. The present invention also provides a preparing method and use thereof.

Abstract: The present invention relates to a reactive hot melt adhesive composition, a polyurethane prepolymer composition, and cured reaction product thereof having a high mechanical strength and an excellent bonding strength as well as a better reworkability. In particular, the present invention relates to a reactive hot melt adhesive composition comprising: 10% to 24% by weight of a polyisocyanate, 40% to 73% by weight of a first polyol having a number average molecular weight larger than 1,500 g/mol, 1% to 25% by weight of a (meth)acrylate polymer having a number average molecular weight of 20,000 to 80,000 g/mol, and 1% to 15% by weight of a diluent, in which the weight percentages are based on the total weight of all components of the composition.

Abstract: The present invention provides a thermally conductive silicone potting composition. In one embodiment the thermally conductive silicone potting composition comprises: a first part comprising: (a) a vinyl organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 ?m and less than 3 ?m, (d) an alumina and/or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 ?m and less than 15 ?m, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 ?m and less than or equal to 100 ?m, (f) a catalyst, and a second part comprising: (b) a hydride organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.

Abstract: This invention relates to a thermally conductive potting composition, comprising a first part comprising at least one epoxy resin; at least one thermally conductive filler; and at least one metal complex; and a second part comprising at least one curing agent. The first part of the thermally conductive potting composition exhibits high thixotropic index and therefore the first part is easily stored. After the first part and the second part is mixed, the thermally conductive potting composition exhibits low thixotropic index and the meets the requirement for potting process.

Abstract: This invention relates to a thermal conductive potting composition. In particular, the present invention relates to a thermal conductive potting composition having a low viscosity, a high thermal conductivity, a high toughness and excellent thermal shock performance for new energy vehicles.

Abstract: The present invention relates to a reactive hot melt adhesive composition, a polyurethane prepolymer composition, and cured reaction product thereof having a high mechanical strength and an excellent bonding strength as well as a better reworkability. In particular, the present invention relates to a reactive hot melt adhesive composition comprising: 10% to 24% by weight of a polyisocyanate, 40% to 73% by weight of a first polyol having a number average molecular weight larger than 1,500 g/mol, 1% to 25% by weight of a (meth)acrylate polymer having a number average molecular weight of 20,000 to 80,000 g/mol, and 1% to 15% by weight of a diluent, in which the weight percentages are based on the total weight of all components of the composition.