Abstract: A wafer-level assembly method for a micro hemispherical resonator gyroscope includes: after independently manufactured glass substrates are softened and deformed at a high temperature, forming a micro hemispherical resonator on the glass substrate; forming glass substrate alignment holes at both ends of the glass substrate by laser ablation; aligning and fixing a plurality of identical micro hemispherical resonators on a wafer fixture by using the alignment holes as a reference, and then performing operations by using the wafer fixture as a unit to implement subsequent processes that include: releasing the micro hemispherical resonators, metallizing the surface, fixing to the planar electrode substrates, separating the wafer fixture and cleaning to obtain a micro hemispherical resonator gyroscope driven by a bottom planar electrode substrate.

Abstract: A machining method of a shredding cutter includes providing a cutter shaft and a plurality of blades; arranging the plurality of blades on the cutter shaft in a predetermined spacing; and rolling or extruding intervals of the cutter shaft between the blades to shift some materials thereof from middle toward both sides and squeeze the materials onto flanks of the blades to form embossed parts so that the blades are embedded in the embossed parts and clamped by the embossed parts, thereby fixing the blades onto the cutter shaft. The shredding cutter has a strong unitary structure, high precision, high yield, which is beneficial to reduce the processing cost and the cost of materials.

Abstract: A machining method of a shredding cutter includes providing a cutter shaft and a plurality of blades; arranging the plurality of blades on the cutter shaft in a predetermined spacing; and rolling or extruding intervals of the cutter shaft between the blades to shift some materials thereof from middle toward both sides and squeeze the materials onto flanks of the blades to form embossed parts so that the blades are embedded in the embossed parts and clamped by the embossed parts, thereby fixing the blades onto the cutter shaft. The shredding cutter has a strong unitary structure, high precision, high yield, which is beneficial to reduce the processing cost and the cost of materials.

Abstract: A machining method of a shredding cutter includes steps of (a) assembling blades on a cutter shaft to be machined, and pre-locating the blades on the cutter shaft by a clamp; (b) rolling or extruding the cutter shaft at positions between the blades by a rolling cutter, so that the cutter shaft between the adjacent blades is formed with embossed parts on two flanks of each of the blades; and (c) withdrawing the rolling cutter, and each of the blades being fixed on the cutter shaft by the embossed parts on the two flanks thereof. A shredding cutter machined by the machining method mentioned above includes a cutter shaft and a plurality of blades, the blades are arranged on the cutter shaft with a predetermined spacing, embossed parts are formed on the cutter shaft between the adjacent blades, and the blades are fixed between the embossed parts. The present invention has a strong unitary structure, high precision, high yield, which is beneficial to reduce the processing cost and the cost of materials.