Abstract: A wafer-level assembly method for a micro hemispherical resonator gyroscope includes: after independently manufactured glass substrates are softened and deformed at a high temperature, forming a micro hemispherical resonator on the glass substrate; forming glass substrate alignment holes at both ends of the glass substrate by laser ablation; aligning and fixing a plurality of identical micro hemispherical resonators on a wafer fixture by using the alignment holes as a reference, and then performing operations by using the wafer fixture as a unit to implement subsequent processes that include: releasing the micro hemispherical resonators, metallizing the surface, fixing to the planar electrode substrates, separating the wafer fixture and cleaning to obtain a micro hemispherical resonator gyroscope driven by a bottom planar electrode substrate.

Abstract: An elastically supported electrode substrate for detecting unbalanced mass of a resonant gyroscope includes an outer frame and an inner structure. A connection part configured to be connected to an anchor of a resonator is arranged at the center of the inner structure, and electrodes are distributed on the inner structure. The inner structure is connected inside the outer frame through elastic beams, and the inner structure has torsional and/or translational resonant modes inside the outer frame. The resonant frequency of the inner structure approaches resonant frequency of an operating mode of the resonator. Since the resonant frequency of the elastically supported electrode substrate approaches the resonant frequency of the operating mode of the resonator, the vibration displacement induced by the unbalanced mass of the elastically supported electrode substrate can be significantly magnified to improve the detection sensitivity.

Abstract: An elastically supported electrode substrate for detecting unbalanced mass of a resonant gyroscope includes an outer frame and an inner structure. A connection part configured to be connected to an anchor of a resonator is arranged at the center of the inner structure, and electrodes are distributed on the inner structure. The inner structure is connected inside the outer frame through elastic beams, and the inner structure has torsional and/or translational resonant modes inside the outer frame. The resonant frequency of the inner structure approaches resonant frequency of an operating mode of the resonator. Since the resonant frequency of the elastically supported electrode substrate approaches the resonant frequency of the operating mode of the resonator, the vibration displacement induced by the unbalanced mass of the elastically supported electrode substrate can be significantly magnified to improve the detection sensitivity.

Abstract: An online trimming device and method for a micro-shell resonator gyroscope is provided. A micro-shell resonator gyroscope fixing fixture and a mode test circuit in the device are placed in a vacuum test cavity provided with a circuit interface. The mode test circuit and a host computer are connected through a circuit interface on the vacuum test cavity. The gyroscope fixing fixture is provided with a signal interface, and the electrodes on the gyroscope substrate are connected to the signal interface. The signal interface on the fixture is connected to the mode test circuit. The laser etching module is located at the top of the device. An opening is formed in the gyroscope fixing fixture. The vacuum test cavity is provided with a transparent trimming window. The laser acts on the edge of the resonant structure of the gyroscope through the trimming window and the through hole of the fixture.

Abstract: A wafer-level assembly method for a micro hemispherical resonator gyroscope includes: after independently manufactured glass substrates are softened and deformed at a high temperature, forming a micro hemispherical resonator on the glass substrate; forming glass substrate alignment holes at both ends of the glass substrate by laser ablation; aligning and fixing a plurality of identical micro hemispherical resonators on a wafer fixture by using the alignment holes as a reference, and then performing operations by using the wafer fixture as a unit to implement subsequent processes that include: releasing the micro hemispherical resonators, metallizing the surface, fixing to the planar electrode substrates, separating the wafer fixture and cleaning to obtain a micro hemispherical resonator gyroscope driven by a bottom planar electrode substrate.

Abstract: Input device configurations are described. In implementations, an input device includes a sensor substrate having a capacitive sensor to detect proximity of an object that contacts the input device. The input device also includes a flexible contact layer spaced apart from the sensor substrate, where the flexible contact layer is implemented to flex and contact the sensor substrate responsive to pressure applied by the object to initiate an input to a computing device. The flexible contact layer can include a force concentrator pad that is designed to cause pressure to be channeled through the force concentrator pad to cause the flexible contact layer to contact the sensor substrate to initiate the input.

Abstract: Input device backlighting techniques are described. In one or more implementations, an input device includes a light guide configured to transmit light, a sensor assembly having a plurality of sensors that are configured to detect proximity of an object as a corresponding one or more inputs, a connection portion configured to form a communicative coupling to a computing device to communicate the one or more inputs received by the sensor assembly to the computing device, and an outer layer. The outer layer has a plurality of indications of inputs formed using openings in the outer layer such that light from the light guide is configured to pass through the openings to function as a backlight. The outer layer also has a plurality of sub-layers arranged to have increasing levels of resistance to transmission of the light from the light guide, one to another.

Abstract: Input device configurations are described. In implementations, an input device includes a sensor substrate having a capacitive sensor to detect proximity of an object that contacts the input device. The input device also includes a flexible contact layer spaced apart from the sensor substrate, where the flexible contact layer is implemented to flex and contact the sensor substrate responsive to pressure applied by the object to initiate an input to a computing device. The flexible contact layer can include a force concentrator pad that is designed to cause pressure to be channeled through the force concentrator pad to cause the flexible contact layer to contact the sensor substrate to initiate the input.

Abstract: Input device backlighting techniques are described. In one or more implementations, an input device includes a light guide configured to transmit light, a sensor assembly having a plurality of sensors that are configured to detect proximity of an object as a corresponding one or more inputs, a connection portion configured to form a communicative coupling to a computing device to communicate the one or more inputs received by the sensor assembly to the computing device, and an outer layer. The outer layer has a plurality of indications of inputs formed using openings in the outer layer such that light from the light guide is configured to pass through the openings to function as a backlight. The outer layer also has a plurality of sub-layers arranged to have increasing levels of resistance to transmission of the light from the light guide, one to another.

Abstract: Input device configurations are described. In one or more implementations, an input device includes a sensor substrate having one or more conductors and a flexible contact layer spaced apart from the sensor substrate. The flexible contact layer is configured to flex to contact the sensor substrate to initiate an input of a computing device. The flexible contact layer includes a force concentrator pad that is configured to cause pressure to be channeled through the force concentrator pad to cause the flexible contact layer to contact the sensor substrate to initiate the input.

Abstract: Input device backlighting techniques are described. In one or more implementations, an input device includes a light guide configured to transmit light, a sensor assembly having a plurality of sensors that are configured to detect proximity of an object as a corresponding one or more inputs, a connection portion configured to form a communicative coupling to a computing device to communicate the one or more inputs received by the sensor assembly to the computing device, and an outer layer. The outer layer has a plurality of indications of inputs formed using openings in the outer layer such that light from the light guide is configured to pass through the openings to function as a backlight. The outer layer also has a plurality of sub-layers arranged to have increasing levels of resistance to transmission of the light from the light guide, one to another.

Abstract: Input device backlighting techniques are described. In one or more implementations, an input device includes a light guide configured to transmit light, a sensor assembly having a plurality of sensors that are configured to detect proximity of an object as a corresponding one or more inputs, a connection portion configured to form a communicative coupling to a computing device to communicate the one or more inputs received by the sensor assembly to the computing device, and an outer layer. The outer layer has a plurality of indications of inputs formed using openings in the outer layer such that light from the light guide is configured to pass through the openings to function as a backlight. The outer layer also has a plurality of sub-layers arranged to have increasing levels of resistance to transmission of the light from the light guide, one to another.

Abstract: A flat type vibration motor with increased vibration amount comprises a vibrator (1), a hard circuit board (2), a rotor (3), a shaft (5), a lower case (9), a magnet (8), a flexible circuit board (11), a brush (10) and winding coils (a, b). The rotor (3) is formed by injection-molding the vibrator (1). The winding coils (a, b) and the hard circuit board (2) are both mounted on the vibrator (1), thus the outer edge of the vibrator (1) can be extended to the position beyond the winding coils (a, b) and the hard circuit board (2).

Abstract: The present invention involves a type of flat, motor-driven vibrator that does not increase the outer physical dimensions of the vibrator while increasing the amount of vibration by changing the mass and balance of the eccentric rotor. The base structure of the eccentric rotor is made of high-density alloy. Two or more coils are installed over the protuberances of the alloy oscillator and a circuit board is installed into the other end of the oscillator. A self-lubricating and wear-resistant, low-density plastic material is injected into the gap between the coils, the oscillator, and the circuit board to mold them together. A cylindrical bore in the middle of the molded plastic is used as a rotor bearing.

Abstract: A flat type vibration motor with increased vibration amount comprises a vibrator (1), a hard circuit board (2), a rotor (3), a shaft (5), a lower case (9), a magnet (8), a flexible circuit board (11), a brush (10) and winding coils (a, b). The rotor (3) is formed by injection-molding the vibrator (1). The winding coils (a, b) and the hard circuit board (2) are both mounted on the vibrator (1), thus the outer edge of the vibrator (1) can be extended to the position beyond the winding coils (a, b) and the hard circuit board (2).

Abstract: The present invention involves a type of flat, motor-driven vibrator that does not increase the outer physical dimensions of the vibrator while increasing the amount of vibration by changing the mass and balance of the eccentric rotor. The base structure of the eccentric rotor is made of high-density alloy. Two or more coils are installed over the protuberances of the alloy oscillator and a circuit board is installed into the other end of the oscillator. A self-lubricating and wear-resistant, low-density plastic material is injected into the gap between the coils, the oscillator, and the circuit board to mold them together. A cylindrical bore in the middle of the molded plastic is used as a rotor bearing.