Abstract: A photographing control method and apparatus, a computer device and a storage medium are provided. The method includes determining a first ratio, wherein the first ratio is a ratio of the current optical zoom ratio of a target photographic device to a maximum optical zoom ratio of the target photographic device; determining a second ratio, wherein the second ratio is a proportion of the area of a person face region currently captured by the target photographic device in a whole captured picture; determining whether the first ratio is less than or equal to a first ratio threshold and the second ratio is less than or equal to a second ratio threshold; and if yes, controlling the target photographic device to perform optical zoom, and if no, controlling the target photographic device to perform digital zoom.

Abstract: Disclosed are a method and system for evaluating sonar self-noise at a ship design stage. The method includes: building a ship structure full-scale geometric simulation model; acquiring loss factors and sonar transducer space outfitting acoustic absorption coefficient material parameters; acquiring mechanical excitation, hydrodynamic excitation, and propeller excitation; inputting the loss factors and the sonar transducer space outfitting acoustic absorption coefficient material parameters into an established statistical energy evaluation model, and applying a mechanical excitation to a face plate of foundation of the built ship structure full-scale geometric simulation model, applying a hydrodynamic excitation to the surface of a ship hull, and applying a propeller excitation to a stern shaft to perform calculation of sonar self-noise of a ship to obtain total spectral density level of the sonar self-noise; and evaluating spectral density level calculation results by index requirements.

Abstract: Disclosed are a method and system for evaluating sonar self-noise at a ship design stage. The method includes: building a ship structure full-scale geometric simulation model; acquiring loss factors and sonar transducer space outfitting acoustic absorption coefficient material parameters; acquiring mechanical excitation, hydrodynamic excitation, and propeller excitation; inputting the loss factors and the sonar transducer space outfitting acoustic absorption coefficient material parameters into an established statistical energy evaluation model, and applying a mechanical excitation to a face plate of foundation of the built ship structure full-scale geometric simulation model, applying a hydrodynamic excitation to the surface of a ship hull, and applying a propeller excitation to a stern shaft to perform calculation of sonar self-noise of a ship to obtain total spectral density level of the sonar self-noise; and evaluating spectral density level calculation results by index requirements.

Abstract: The present disclosure provides a packaging method and a semiconductor device, the packaging method comprising: depositing a first sacrificial layer on a substrate to cover a semiconductor element formed on the substrate; covering a first dielectric layer on an upper surface and a side wall of the first sacrificial layer, the first dielectric layer has a first groove exposing part of the first sacrificial layer; covering a second sacrificial layer on surface of the exposed first sacrificial layer; covering a second dielectric layer on the second sacrificial layer and the exposed surface of the first dielectric layer, the second dielectric layer having a releasing hole exposing the second sacrificial layer and a second groove; depositing a filling layer to fill the second groove; by the releasing hole, removing the second sacrificial layer and the first sacrificial layer to form a cavity; depositing a third dielectric layer which covers the exposed surface of the second dielectric layer, and filling the releas

Abstract: A portable electronic device includes a display panel disposed on a front side of the portable electronic device and a back-side keyboard disposed on a rear side of the portable electronic device. The back-side keyboard includes an icon layer and a touch sensing layer. The icon layer provides a plurality of icons. The touch sensing layer is utilized to sense the exact positions of fingers at the rear side of the portable electronic device. Each of the icons is triggered to realize an input operation of the icon when the icon is pressed by a finger from the rear side towards the front side of the portable electronic device. A user is allowed to use their longer fingers to perform an input operation from the rear side of the portable electronic device, for avoiding the drawback of using the thumbs to input and increasing the user experiences for input operation.

Abstract: A portable electronic device includes a display panel disposed on a front side of the portable electronic device and a back-side keyboard disposed on a rear side of the portable electronic device. The back-side keyboard includes an icon layer and a touch sensing layer. The icon layer provides a plurality of icons. The touch sensing layer is utilized to sense the exact positions of fingers at the rear side of the portable electronic device. Each of the icons is triggered to realize an input operation of the icon when the icon is pressed by a finger from the rear side towards the front side of the portable electronic device. A user is allowed to use their longer fingers to perform an input operation from the rear side of the portable electronic device, for avoiding the drawback of using the thumbs to input and increasing the user experiences for input operation.

Abstract: The present disclosure provides a packaging method and a semiconductor device, the packaging method comprising: depositing a first sacrificial layer on a substrate to cover a semiconductor element formed on the substrate; covering a first dielectric layer on an upper surface and a side wall of the first sacrificial layer, the first dielectric layer has a first groove exposing part of the first sacrificial layer; covering a second sacrificial layer on surface of the exposed first sacrificial layer; covering a second dielectric layer on the second sacrificial layer and the exposed surface of the first dielectric layer, the second dielectric layer having a releasing hole exposing the second sacrificial layer and a second groove; depositing a filling layer to fill the second groove; by the releasing hole, removing the second sacrificial layer and the first sacrificial layer to form a cavity; depositing a third dielectric layer which covers the exposed surface of the second dielectric layer, and filling the releas