Abstract: The present disclosure provides a packaging method and a semiconductor device, the packaging method comprising: depositing a first sacrificial layer on a substrate to cover a semiconductor element formed on the substrate; covering a first dielectric layer on an upper surface and a side wall of the first sacrificial layer, the first dielectric layer has a first groove exposing part of the first sacrificial layer; covering a second sacrificial layer on surface of the exposed first sacrificial layer; covering a second dielectric layer on the second sacrificial layer and the exposed surface of the first dielectric layer, the second dielectric layer having a releasing hole exposing the second sacrificial layer and a second groove; depositing a filling layer to fill the second groove; by the releasing hole, removing the second sacrificial layer and the first sacrificial layer to form a cavity; depositing a third dielectric layer which covers the exposed surface of the second dielectric layer, and filling the releas

Abstract: A portable electronic device includes a display panel disposed on a front side of the portable electronic device and a back-side keyboard disposed on a rear side of the portable electronic device. The back-side keyboard includes an icon layer and a touch sensing layer. The icon layer provides a plurality of icons. The touch sensing layer is utilized to sense the exact positions of fingers at the rear side of the portable electronic device. Each of the icons is triggered to realize an input operation of the icon when the icon is pressed by a finger from the rear side towards the front side of the portable electronic device. A user is allowed to use their longer fingers to perform an input operation from the rear side of the portable electronic device, for avoiding the drawback of using the thumbs to input and increasing the user experiences for input operation.

Abstract: A portable electronic device includes a display panel disposed on a front side of the portable electronic device and a back-side keyboard disposed on a rear side of the portable electronic device. The back-side keyboard includes an icon layer and a touch sensing layer. The icon layer provides a plurality of icons. The touch sensing layer is utilized to sense the exact positions of fingers at the rear side of the portable electronic device. Each of the icons is triggered to realize an input operation of the icon when the icon is pressed by a finger from the rear side towards the front side of the portable electronic device. A user is allowed to use their longer fingers to perform an input operation from the rear side of the portable electronic device, for avoiding the drawback of using the thumbs to input and increasing the user experiences for input operation.

Abstract: The present disclosure provides a packaging method and a semiconductor device, the packaging method comprising: depositing a first sacrificial layer on a substrate to cover a semiconductor element formed on the substrate; covering a first dielectric layer on an upper surface and a side wall of the first sacrificial layer, the first dielectric layer has a first groove exposing part of the first sacrificial layer; covering a second sacrificial layer on surface of the exposed first sacrificial layer; covering a second dielectric layer on the second sacrificial layer and the exposed surface of the first dielectric layer, the second dielectric layer having a releasing hole exposing the second sacrificial layer and a second groove; depositing a filling layer to fill the second groove; by the releasing hole, removing the second sacrificial layer and the first sacrificial layer to form a cavity; depositing a third dielectric layer which covers the exposed surface of the second dielectric layer, and filling the releas