Abstract: The present disclosure provides a display panel, including a substrate, and touch lines and touch electrodes located at one side of the substrate. One touch electrode is electrically connected to at least one touch line; each touch electrode includes at least one hollow extending along a first direction; each touch electrode is isolated by the at least one hollow in a second direction; the second direction intersects with the first direction; each touch electrode includes electrode portions respectively located at two sides of the hollow; in a region of the touch electrode, at least a part of a first touch line is in contact and electrical connection with the touch electrode; along a direction perpendicular to a plane of the substrate, a second touch line overlaps with one hollow; and electrode portions at least located at two sides of the second touch line are electrically connected through a bridging portion.

Abstract: A display panel and a display device are provided. The display panel includes: a display region, a non-display region, and multiple drive signal lines. A fanout region and a connection terminal region are disposed in the non-display region. Multiple fanout wires are arranged in the fanout region. Multiple connection terminals are arranged in the connection terminal region. The fanout wires include a first fanout wire and a second fanout wire. The first fanout wire includes a first wire segment. The first wire segment has a width different from the width of the second fanout wire. The length of the first wire segment is equal to at least a portion of the length of the first fanout wire.

Abstract: A liquid crystal antenna is described. The liquid crystal antenna includes liquid crystal phase shifter units arranged in an array; a first feeding network line corresponding to an ith scanning line and extending along a first direction, and/or, a second feeding network line corresponding to an jth data line and extending along a second direction. The first feeding network line is provided between the ith scanning line and an (i+1)th scanning line, and a scanning line protrusion protrudes toward a side facing away from the first feeding network line corresponding to the ith scanning line. The second feeding network line is provided between the jth data line and a (j+1)th data line, and a data line protrusion protrudes toward a side facing away from the second feeding network line corresponding to the jth data line.

Abstract: Provided are a display panel and a display apparatus. The display panel includes a first electrode layer including display electrodes and touch electrodes, light-emitting elements, touch signal lines electrically connected to the touch electrodes, and first power supply voltage signal lines electrically connected to the display electrodes. The display electrodes are arranged in a same layer as the touch electrodes and insulated from the touch electrodes. The first power supply voltage signal lines and the touch signal lines are formed in a same layer. Each light-emitting element includes a driving electrode, a light-emitting material and a display electrode of the display electrodes. The driving electrode, the light-emitting material and the display electrode are stacked on one another. The display electrode is located on a side of the light-emitting material facing a light-exiting surface of the display panel.

Abstract: The present disclosure provides chip package structure, packaging method, camera module and electronic equipment. The package structure includes chip package module, which includes light-transmitting substrate, wiring layer located on side of light-transmitting substrate and including first metal wire, conductor located on side of wiring layer facing away from light-transmitting substrate, photosensitive chip located on side of wiring layer facing away from the light-transmitting substrate, active chip located on side of wiring layer facing away from light-transmitting substrate, and plastic encapsulation layer encapsulating photosensitive chip and active chip. The conductor includes first end electrically connected to first metal wire, and second end. The photosensitive chip includes pin electrically connected to first metal wire and has photosensitive surface facing towards light-transmitting substrate. The photosensitive surface includes photosensitive region that is not overlapping first metal wire.

Abstract: A display panel, a drive method for a display panel, and a display device. The display panel includes: display subregions; touch subregions, where one touch subregion overlaps at least one display subregion; and control units, where one control unit is electrically connected to touch electrodes of at least one touch subregion. A drive cycle includes alternating display stages and touch stages. In the display stage, data voltages are written into the pixel electrodes in a corresponding display subregion, a portion of the control units operate to transmit a common voltage to touch electrodes in a portion of the touch subregions, and the touch subregion into which the common voltage is written overlaps the display subregion into which the data voltages are written. In the effective touch time period, none of the control units operate, and each touch electrode senses and transmits a touch signal to the touch signal line.

Abstract: A display panel, a splicing screen, and a display apparatus. The display panel comprises an array base plate comprising a substrate as well as a plurality of transistors and a plurality of connection electrodes located on one side of the substrate; the plurality of transistors comprise a first transistor, and the plurality of connection electrodes comprise a first connection electrode; the array base plate has at least one first edge; the first transistor is adjacent to the first edge, and the first connection electrode is adjacent to the first edge, a distance between the first transistor and the first edge is greater than a distance between the first connection electrode and the first edge. The present invention can reduce the risk of failure of the transistors near the cutting edge due to laser cutting in the laser cutting process, and can improve the production yield of narrow-bezel or bezel-free products.

Abstract: Provided are a display panel and a preparation method thereof and a display device. The display panel includes an array substrate, where the array substrate includes a first base, a first signal wire layer located on a side of the first base and an anti-reflection layer located between the first signal wire layer and the first base. The display panel further includes a display region and a non-display region; the first signal wire layer includes a first signal wire located in the display region, and the anti-reflection layer includes a first anti-reflection structure located in the display region and a second anti-reflection structure located in the non-display region. An orthographic projection of the first anti-reflection structure on a plane where the first base is located covers at least part of an orthographic projection of the first signal wire on the plane where the first base is located.

Abstract: A display module and a display apparatus are described. The display module includes display panel, backplane, and printed circuit board electrically connected to display panel. The backplane includes body and tongue protruding from body. The printed circuit board is fixed to tongue and includes first grounding region and second grounding region. The first grounding region is located on a side of the printed circuit board adjacent to the tongue. The tongue includes a first surface and a second surface opposite to the first surface. The first surface faces a side of the printed circuit board, and the first grounding region is electrically connected to the first surface of the tongue. The second grounding region is electrically connected to the second surface of the tongue and/or the body of the backplane. The printed circuit board is better fixed. A grounding impedance of the printed circuit board is reduced and meets requirements.

Abstract: An array substrate, a method for manufacturing an array substrate, a display panel and a display device are provided. The array substrate includes a substrate; an insulating layer arranged at a side of the substrate, where the insulating layer is provided with an opening, the insulating layer includes a first area and a second area, a thickness of the first area is less than a thickness of the second area, and the first area is arranged around at least a part of the opening; and a first conductive part arranged at a side of the insulating layer away from the substrate, where an orthographic projection of the first conductive part on the substrate and an orthographic projection of the first area on the substrate are at least partially overlapped.

Abstract: A semiconductor package includes a semiconductor element, a wiring structure, an encapsulation structure, and a solder ball. The semiconductor element includes a plurality of pins. A side of the wiring structure is electrically connected to the plurality of pins of the semiconductor element. The wiring structure includes at least two first wiring layers. A first insulating layer is disposed between adjacent two first wiring layers of the at least two first wiring layers. The first insulating layer includes a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The encapsulation structure at least partially surrounds the semiconductor element. The solder ball is located on a side of the wiring structure away from the semiconductor element. The solder ball is electrically connected to the at least two first wiring layers.

Abstract: A chip package structure, manufacturing method thereof, and module are described. In an embodiment, the chip package structure includes: a substrate, a wiring layer, a chip, and a second conductive bump, wherein, in an embodiment, the substrate includes a first region and a second region surrounding the first region, and the wiring layer is located on side of the substrate and includes metal wire, wherein at least part of a metal wire is in contact with the substrate in direction perpendicular to the substrate, and the metal wire overlaps with the second region, wherein the chip is located on side of the wiring layer facing away from the substrate, and the chip corresponds to the first region. In an embodiment, a first conductive bump is provided on side of the chip facing away from the substrate and is electrically connected to the metal wire.

Abstract: Provided are a manufacturing method of a display panel and a detection and bonding apparatus for a micro element. The manufacturing method of a display panel includes providing a first transfer substrate and performing a detection and bonding process. The first transfer substrate includes a first temporary carrier plate and a plurality of micro elements disposed on the first temporary carrier plate. The step of performing a detection and bonding process includes placing the first transfer substrate and an array substrate opposite to each other so that the drive electrode of the micro element is in contact with a connection electrode on the array substrate; supplying power to the array substrate to conduct the plurality of micro elements; and acquiring a first pattern formed by each illuminated micro element, and bonding a drive electrode of the each illuminated micro element with the connection electrode.

Abstract: An array substrate, a display panel and a display device are provided. The array substrate includes a semiconductor pattern, a first gate, a second gate and a first metal part. The semiconductor pattern includes a first channel overlapping with the first gate, a second channel overlapping with the second gate, and a first connection part connecting the first channel with the second channel. The first metal part overlaps with the first connection part and is electrically connected to the first connection part. According to the embodiments of the present disclosure, it is beneficial to improving the uniformity of current distribution of a transistor.

Abstract: Provided are an antenna, a phase shifter, and a communication device. The antenna includes a first metal electrode, a second metal electrode, and a photo-sensitive layer. The first metal electrode and the second metal electrode are respectively located on two opposite sides of the photo-sensitive layer. The first metal electrode includes multiple transmission electrodes. The multiple transmission electrodes are configured to transmit electrical signals. The photo-sensitive layer includes at least one photo-sensitive unit and the at least one photo-sensitive unit overlaps the transmission electrodes. The antenna provides more possibilities for large-scale commercialization.

Abstract: A phase shifter, a fabrication method thereof, and an antenna are provided. The phase shifter includes a first substrate, a second substrate, a ground electrode disposed on a side of the first substrate facing towards the second substrate, a transmission electrode disposed on a side of the second substrate facing towards the first substrate, and liquid crystals filled between the first substrate and the second substrate. In a direction perpendicular to a plane of the second substrate, the transmission electrode overlaps with the ground electrode. The ground electrode is provided with a detection hollow part, and in the direction perpendicular to the plane of the second substrate, at least a part of the detection hollow part does not overlap with the transmission electrode.

Abstract: Provided are a semiconductor package and a method for fabricating the semiconductor package. The method includes the followings steps: a first workpiece is provided, where the first workpiece includes a first substrate and multiple first rewiring structures arranged on the first substrate at intervals, and each first rewiring structure includes at least two first rewiring layers; an encapsulation layer is formed on the first rewiring structures, where the encapsulation layer is provided with multiple first through holes, and the first through holes expose one first rewiring layer; at least two second rewiring layers are disposed on a side of the encapsulation layer facing away from the first rewiring layer; multiple semiconductor elements are provided, where the semiconductor elements are arranged on a side of the first rewiring structures facing away from the encapsulation layer, where the first rewiring layers are electrically connected to pins of the semiconductor elements.

Abstract: Disclosed antenna unit includes first substrate and second substrate opposite to each other, phase shifting units and driver circuit. Region facing the first substrate and the second substrate form phase shifting region. In first direction, the first substrate formed with first step region, and used for connecting radio-frequency signal terminal; in second direction, the second substrate formed with second step region, and included angle between the first direction and the second direction greater than or equal to 0° and smaller than 180°. At least part of the first step region does not overlap at least part of the second step region. Phase shifting units used for radiating radio-frequency signal and distributed in phase shifting region, each phase shifting unit. At least part of the driver circuit disposed in the second step region and the driver circuit electrically connected to each phase shifting unit to adjust radio-frequency signal.

Abstract: A microfluidic device includes: first substrate, microfluidic channel layer, and second substrate; the first substrate includes light source layer including a plurality of light source structures, the light source structure includes first electrode, second electrode, and an electroluminescence module, and when being turned on, emits light passing through the microfluidic channel layer and irradiating the second substrate; the second substrate includes photoelectric detection layer including a plurality of photoelectric detection structures and driving electrode layer including a plurality of driving electrodes and a plurality of driving circuits, the photoelectric detection structure includes third electrode, fourth electrode, and photoelectric conversion module arranged therebetween, and when being turned on, generates an electrical signal according to an incident light signal; the driving circuit is configured to apply a voltage to each driving electrode such that a droplet moves in a microfluidic channel o

Abstract: A semiconductor package includes a semiconductor element, a wiring structure, an encapsulation structure, and a solder ball. The semiconductor element includes a plurality of pins. A side of the wiring structure is electrically connected to the plurality of pins of the semiconductor element. The wiring structure includes at least two first wiring layers. A first insulating layer is disposed between adjacent two first wiring layers of the at least two first wiring layers. The first insulating layer includes a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The encapsulation structure at least partially surrounds the semiconductor element. The solder ball is located on a side of the wiring structure away from the semiconductor element. The solder ball is electrically connected to the at least two first wiring layers.