Abstract: A combination of materials and processing parameters have been developed for hermetic seals for electrical feedthroughs in high performance applications. A glass-ceramic forms a hermetic seal between a stainless steel shell and a platinum-nickel-based (Pt—Ni) pin alloy for electrical feedthroughs. The glass-ceramic is processed to develop a coefficient of thermal expansion (CTE) slightly higher than the pin alloy but lower than the stainless steel. The seal system employing the new processing conditions and Pt—Ni-based pin alloy alleviates several problems encountered in previous seal systems and improves the hermetic connector performance.

Abstract: A combination of materials and processing parameters have been developed for hermetic seals for electrical feedthroughs in high performance applications. A glass-ceramic forms a hermetic seal between a stainless steel shell and a platinum-nickel-based (Pt—Ni) pin alloy for electrical feedthroughs. The glass-ceramic is processed to develop a coefficient of thermal expansion (CTE) slightly higher than the pin alloy but lower than the stainless steel. The seal system employing the new processing conditions and Pt—Ni-based pin alloy alleviates several problems encountered in previous seal systems and improves the hermetic connector performance.

Abstract: The present invention relates to structure including an interfacial seal between a glass-ceramic component and a metal component, as well as methods for forming such structures. In particular embodiments, the interfacial seal includes a metal oxide. Such interfacial seals can be beneficial for, e.g., hermetic seals between a glass-ceramic component and a metal component.

Abstract: The present invention relates to structure including an interfacial seal between a glass-ceramic component and a metal component, as well as methods for forming such structures. In particular embodiments, the interfacial seal includes a metal oxide. Such interfacial seals can be beneficial for, e.g., hermetic seals between a glass-ceramic component and a metal component.

Abstract: The present invention relates to structure including an interfacial seal between a glass-ceramic component and a metal component, as well as methods for forming such structures. In particular embodiments, the interfacial seal includes a metal oxide. Such interfacial seals can be beneficial for, e.g., hermetic seals between a glass-ceramic component and a metal component.

Abstract: The present invention relates to glass-ceramic compositions, as well as methods for forming such composition. In particular, the compositions include various polymorphs of silica that provide beneficial thermal expansion characteristics (e.g., a near linear thermal strain). Also described are methods of forming such compositions, as well as connectors including hermetic seals containing such compositions.

Abstract: The present invention relates to glass-ceramic compositions, as well as methods for forming such composition. In particular, the compositions include various polymorphs of silica that provide beneficial thermal expansion characteristics (e.g., a near linear thermal strain). Also described are methods of forming such compositions, as well as connectors including hermetic seals containing such compositions.

Abstract: The present invention relates to glass-ceramic compositions, as well as methods for forming such composition. In particular, the compositions include various polymorphs of silica that provide beneficial thermal expansion characteristics (e.g., a near linear thermal strain). Also described are methods of forming such compositions, as well as connectors including hermetic seals containing such compositions.

Abstract: The present invention is directed to low temperature cofired ceramic modules having localized temperature stability by incorporating temperature coefficient of resonant frequency compensating materials locally into a multilayer LTCC module. Chemical interactions can be minimized and physical compatibility between the compensating materials and the host LTCC dielectrics can be achieved. The invention enables embedded resonators with nearly temperature-independent resonance frequency.

Abstract: A user friendly display structure (100) for an electronic device (102), such as a touch screen hand held communications device, is provided with piezoelectric elements (126) bonded or otherwise secured directly to the back of a display module (112) generates effective haptics and sound localized to the display area. Actuation of piezoelectric elements (126) in the display structure (100) generates bending motion of the entire display structure (100) which provides haptics feedback to fingers operating on the display structure (100) as well as generates sound by turning part or the entire display into a speaker.

Abstract: A mobile communication terminal (10) is provided. The mobile communication terminal (10) includes a touch sensitive liquid crystal display (LCD) module (12) having a predetermined plurality of touch sensitive areas (20, 22) and a plurality of piezoelectric elements (106, 108, 110, 112) disposed along a periphery of a cover glass of the display module (12) wherein activation of the piezoelectric elements provides tactile feedback to a user of activation of a portion of the touch sensitive LCD module (12) by the user.

Abstract: Touch sensors with one or more piezoelectric elements and devices containing such touch sensors are presented. The touch sensor contains keys that are independently actuated. Contact with a key provides tactile feedback through the piezoelectric element to the user. Each key provides an individual tactile feedback pattern that is dependent on the particular key contacted as well as the function of the key at the time of contact. Actuation of the key provides a different tactile feedback pattern. The piezoelectric element is bonded directly to a printed circuit board, on which electronic components are also mounted.

Abstract: An electronic device and corresponding method provide haptic feedback to a user. The electronic device includes a rigid input surface, a piezoelectric element directly attached to the rigid input surface, sensors disposed adjacent to the rigid input surface for sensing when the user selects various portions of the rigid input surface, the sensors providing electrical signals indicative of the selected portions, and a controller that receives the electrical signals from the sensors, and in response thereto causes drive signals to be provided to the piezoelectric element causing deformation of the piezoelectric element and bending of the rigid input surface, wherein the bending of the rigid input surface provides haptic feedback to the user in response to the user selecting of the rigid input surface.

Abstract: An electronic device (100) comprises a housing (112), an input (118, 122) coupled mechanically to the housing for receiving data, an output (114, 118) coupled mechanically to the housing for presenting information to a user of the electronic device in at least one of an audio and visual mode, an electronic circuit (210) coupled mechanically to the housing for providing intelligent operations that receives the data from the input and provides the information to the output, and at least two electromechanical transducers (226), each providing a tactile alert to the user in response to the data, the tactile alerts occurring simultaneously or in succession.

Abstract: An electronic device (100) comprises a housing (112), an input (118, 122) coupled mechanically to the housing for receiving data, an output (114, 118) coupled mechanically to the housing for presenting information to a user of the electronic device in at least one of an audio and visual mode, an electronic circuit (210) coupled mechanically to the housing for providing intelligent operations that receives the data from the input and provides the information to the output, and at least two electromechanical transducers (226), each providing a tactile alert to the user in response to the data, the tactile alerts occurring simultaneously or in succession.

Abstract: An electronic device (100) for performing intelligent operations includes a housing (112), a manually operable input (118, 122) for providing information to the electronic device, and a material (124) positioned between the manually operable input and the housing. An electromechanical transducer (218, 220) has a mechanical connection consisting of to the manually operable input and an electrical connection for receiving power, wherein substantially all of a mechanical output from the electromechanical transducer is provided to the manually operable input, the material preventing the mechanical output from being transmitted from the manually operable input to the housing.

Abstract: An exemplary system and method for manufacturing micropump systems having integrated piezoresistive sensors is disclosed as including inter alia: a substrate, an inlet channel, an outlet channel, a pumping cavity, a first valve for permitting fluid flow from the inlet channel to the pumping cavity and restricting backflow of purged fluid from the pumping cavity to the inlet channel; a second valve for permitting fluid flow from the pumping cavity to an outlet channel and restricting backflow of purged fluid from the outlet channel to the pumping cavity; a pump actuator element; a pressure sensing cavity surface capable of at least partial mechanical deformation; a plurality of piezoresistors disposed within the sensing cavity; a plurality of contact pads; a plurality of conductive pathways connecting the piezoresistors and the contact pads; and a substantially monolithic device package, wherein the sensing cavity is substantially contained within the micropump device package.

Abstract: An exemplary device and method for microfluidic transport is disclosed as providing inter alia a passive check valve (100), a fluid inlet channel (210), a fluid outlet channel (220) and a pumping cavity (240). The fluid inlet channel (210) is generally configured to flow a fluid through the check valve (100). The check valve (100) generally provides substantially passive means for preventing or otherwise decreasing the incidence of purged outlet fluid re-entering either the pumping cavity (240) or the fluid inlet channel (210). Accordingly, the reduction of backflow generally tends to enhance overall pumping performance and efficiency. Disclosed features and specifications may be variously controlled, adapted or otherwise optionally modified to improve micropump operation in any microfluidic application.

Abstract: An exemplary system and method for manufacturing micropump systems having integrated piezoresistive sensors is disclosed as including inter alia: a substrate, an inlet channel, an outlet channel, a pumping cavity, a first valve for permitting fluid flow from the inlet channel to the pumping cavity and restricting backflow of purged fluid from the pumping cavity to the inlet channel; a second valve for permitting fluid flow from the pumping cavity to an outlet channel and restricting backflow of purged fluid from the outlet channel to the pumping cavity; a pump actuator element; a pressure sensing cavity surface capable of at least partial mechanical deformation; a plurality of piezoresistors disposed within the sensing cavity; a plurality of contact pads; a plurality of conductive pathways connecting the piezoresistors and the contact pads; and a substantially monolithic device package, wherein the sensing cavity is substantially contained within the micropump device package.

Abstract: An exemplary system and method for integrated pressure sensing is disclosed as including inter alia: a sensing cavity having a surface capable of mechanical deformation; a plurality of piezoresistors; a plurality of electrical contact pads; a plurality of conductive pathways connecting the piezoresistors and the contact pads; and a monolithic device package. Disclosed features and specifications may be variously controlled, adapted or otherwise optionally modified to improve sensing in any microfluidic application. Exemplary embodiments of the present invention representatively provide for sensing fluid pressures in a microfluidic channel or reservoir. Representatively disclosed embodiments may be readily integrated with existing portable ceramic technologies for the improvement of device package form factors, weights and other manufacturing and/or device performance metrics.