Abstract: A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.

Abstract: A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.

Abstract: A structure of a heat dissipation substrate of power LEDs and a device made by using the same overcomes drawbacks such as complex structure of power LEDs, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of the heat dissipation substrate includes a one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other. The through hole is smaller than the blind hole, and both of them share the same direction of axis. The heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit.

Abstract: The present invention provides manufacturing methods for a power LED substrate with a mounting hole and a heat sink and for its power LED product and products thereof. The disclosed fabrication methods for power LED heat-dissipating substrate include the following steps a) selecting substrate material and processing; b) fabricating heat sink; c) assembling substrate and heat sink. The manufacturing methods of power LED products are based upon the manufacturing methods for heat-dissipating substrate, including the following steps: mounting LED die, bonding wire, packaging, post hardening, separating components, testing, classifying, and taping.

Abstract: Provided is an LED light source module, comprising a PCB board with electrically conductive pathways, for example wire lines, and at least one through hole; at least one semiconductor light-emitting device; electronic components forming a driving circuit; a metal housing with a groove; and at least one heat sink; wherein the semiconductor light-emitting device is electrically connected to the PCB board, electronic components are disposed on the PCB board, the PCB board is disposed in the groove of the metal housing, the heat sink is disposed in the through hole and connected to the PCB board, the semiconductor light-emitting device is disposed on the upper surface of the heat sink and the bottom of the heat sink is welded with the metal housing.

Abstract: A structure of heat dissipation substrate of power LED and a device made thereof overcomes drawbacks such as complex structure of power LED, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of heat dissipation substrate includes a one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other, and the through hole is smaller than the blind hole, and both of them share the same direction of axis; the heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit; a plurality of counterbores may be arranged on the circuit board; the circuit board may also comprise a plurality of position lines for cutting and a plurality of slots and/or holes.