Abstract: A housing assembly includes a substrate, where the substrate includes a first surface and a second surface that are opposite to each other, the first surface of the substrate is close to an electronic device, and the substrate is formed through hot-pressing after glass fiber cloth is soaked in an epoxy resin adhesive solution; a first decoration layer, disposed on the first surface of the substrate; a light shielding layer, disposed on a surface that is of the first decoration layer and that is away from the substrate; and a second decoration layer, disposed on the second surface of the substrate. Therefore, the substrate uses a glass fiber epoxy resin plate, which is a light and thin material, and is high in strength, modulus, and transparency.

Abstract: The present disclosure provides a side chain liquid crystal epoxy monomer (S-LCEM) and a preparation method thereof, and a side chain liquid crystal epoxy resin (S-LCER) with high intrinsic thermal conductivity, and belongs to the technical field of epoxy resin materials. There are biphenyl mesogenic groups with strong rigidity in a molecular structure of the S-LCEM provided in the present disclosure and there are also flexible connections among chain segments, which promotes the ordered arrangement of S-LCEM molecular chains during a curing process. The highly-ordered arrangement of such mesogenic units is conducive to the formation of a local crystalloid structure, so that a heat flow is transferred along a direction of the ordered molecular chain, which effectively inhibits the scattering of phonons in the S-LCER with high intrinsic thermal conductivity and greatly improves the intrinsic thermal conductivity of the S-LCER with high intrinsic thermal conductivity.

Abstract: The present disclosure provides a side chain liquid crystal epoxy monomer (S-LCEM) and a preparation method thereof, and a side chain liquid crystal epoxy resin (S-LCER) with high intrinsic thermal conductivity, and belongs to the technical field of epoxy resin materials. There are biphenyl mesogenic groups with strong rigidity in a molecular structure of the S-LCEM provided in the present disclosure and there are also flexible connections among chain segments, which promotes the ordered arrangement of S-LCEM molecular chains during a curing process. The highly-ordered arrangement of such mesogenic units is conducive to the formation of a local crystalloid structure, so that a heat flow is transferred along a direction of the ordered molecular chain, which effectively inhibits the scattering of phonons in the S-LCER with high intrinsic thermal conductivity and greatly improves the intrinsic thermal conductivity of the S-LCER with high intrinsic thermal conductivity.