Abstract: An active matrix organic light emitting diode shadow mask assembly includes a shadow mask frame, longitudinal supporting bars, transverse spacer plates, shadow mask plates. The longitudinal supporting bars are disposed on the shadow mask frame at intervals. The transverse spacer plates are disposed on circular rod portions of the longitudinal supporting bars, are supported by the longitudinal supporting bars, are arranged at intervals. The shadow mask plates are disposed on the transverse spacer plates, are supported by the longitudinal supporting bars, parallel the transverse spacer plates. Each transverse spacer plate is located under a gap between adjacent shadow mask plates, contacts the shadow mask plates, covers the gap. The transverse spacer plates directly contacting the shadow mask plates effectively cover the gaps between the shadow mask plates, effectively prevent organic material in a later process from leaking through the shadow mask plates, dropping on to a lower glass substrate.

Abstract: An active matrix organic light emitting diode shadow mask assembly includes a shadow mask frame, longitudinal supporting bars, transverse spacer plates, shadow mask plates. The longitudinal supporting bars are disposed on the shadow mask frame at intervals. The transverse spacer plates are disposed on circular rod portions of the longitudinal supporting bars, are supported by the longitudinal supporting bars, are arranged at intervals. The shadow mask plates are disposed on the transverse spacer plates, are supported by the longitudinal supporting bars, parallel the transverse spacer plates. Each transverse spacer plate is located under a gap between adjacent shadow mask plates, contacts the shadow mask plates, covers the gap. The transverse spacer plates directly contacting the shadow mask plates effectively cover the gaps between the shadow mask plates, effectively prevent organic material in a later process from leaking through the shadow mask plates, dropping on to a lower glass substrate.

Abstract: A thin-film encapsulation structure of an active-matrix organic light-emitting, diode (AMOLED) is provided, and a touch electrode layer is disposed thereon. The thin-film encapsulation structure includes a first ceramic layer, an organic layer, and a second ceramic layer. The second ceramic layer has a first film layer and a second film layer; a side end of the second film layer is contracted inward so that a recessed first step portion is defined at the side end of the second film layer and a side end of the first film layer. The second ceramic layer is changed into a design of a multi-layer stacked structure, and a recessed step portion is formed at the side ends of the upper and lower layers. Therefore, the traces can be placed in a larger space and resistant to line breakage, thereby ensuring the yield and product performance.

Abstract: A thin-film encapsulation structure of an active-matrix organic light-emitting, diode (AMOLED) is provided, and a touch electrode layer is disposed thereon. The thin-film encapsulation structure includes a first ceramic layer, an organic layer, and a second ceramic layer. The second ceramic layer has a first film layer and a second film layer; a side end of the second film layer is contracted inward so that a recessed first step portion is defined at the side end of the second film layer and a side end of the first film layer. The second ceramic layer is changed into a design of a multi-layer stacked structure, and a recessed step portion is formed at the side ends of the upper and lower layers. Therefore, the traces can be placed in a larger space and resistant to line breakage, thereby ensuring the yield and product performance.

Abstract: The present invention provides an organic light-emitting diode display panel including a substrate, a thin film transistor arranged on the substrate, a planarization layer arranged on the substrate, a first touch electrode arranged on a surface of the planarization layer, an electrode insulation layer arranged on the surface of the planarization layer, a metal anode arranged on a surface of the electrode insulation layer and electrically connected to the source electrode or the drain electrode of the thin film transistor, and, a second touch electrode arranged on the surface of the electrode insulation layer and electrically connected to the first touch electrode.

Abstract: An inkjet printing device is provided. The second liquid storage tank is connected to a second buffer tank and the second buffer tank is pressurized so that the pressure at one side of the spray head near the second liquid storage tank is greater than the pressure at another side near the first liquid storage tank. As a result, the chemical solution in the spray head flows back into the first liquid storage tank or the liquid supply tank. Consequently, there is no residual chemical solution at the spray head so that the problem of the blocked spray head is not induced. Furthermore, by pressurizing the second buffer tank, the boiling point of the chemical solution can be reduced. The volatilization and solidification of the chemical solvent is reduced even further. Therefore, the problem of the blocked spray head is further mitigated. The quality of the chemical solution is ensured for a long time.

Abstract: Provided is a paint spreading device, comprising a moving stage for bearing a substrate, a mask having a hollow pattern, an alignment system and a paint nozzle, wherein the mask is above the moving stage and has a gap with the substrate, an orthographic projection of the mask on the moving stage completely covers the substrate, the alignment system is above the moving stage at one side of the mask, the paint nozzle is right above the mask to spread paint on the mask.

Abstract: An inkjet printing device is provided. The second liquid storage tank is connected to a second buffer tank and the second buffer tank is pressurized so that the pressure at one side of the spray head near the second liquid storage tank is greater than the pressure at another side near the first liquid storage tank. As a result, the chemical solution in the spray head flows back into the first liquid storage tank or the liquid supply tank. Consequently, there is no residual chemical solution at the spray head so that the problem of the blocked spray head is not induced. Furthermore, by pressurizing the second buffer tank, the boiling point of the chemical solution can be reduced. The volatilization and solidification of the chemical solvent is reduced even further. Therefore, the problem of the blocked spray head is further mitigated. The quality of the chemical solution is ensured for a long time.

Abstract: The disclosure provides an encapsulation method and an encapsulating structure of an organic electroluminescent device, and a display apparatus. The encapsulation method of an organic electroluminescent device includes: providing a flexible substrate; forming an electrode layer on the flexible substrate; sequentially forming an inorganic layer on a surface of the electrode layer and an organic layer stacked on a surface of the inorganic layer, and a multilayer structure is formed by the inorganic layer and the organic layer alternately stacked with each other, the inorganic layer is formed by a chemical deposition method, and the organic layer is formed by printing; and dry etching the multilayer structure to form a thin film encapsulation layer. The disclosure has the advantages of low production cost and can solve the problems of high material cost, difficult maintenance, and poor film quality caused by the need of using the mask in the prior art.

Abstract: The present invention provides an organic light-emitting diode display panel including a substrate, a thin film transistor arranged on the substrate, a planarization layer arranged on the substrate, a first touch electrode arranged on a surface of the planarization layer, an electrode insulation layer arranged on the surface of the planarization layer, a metal anode arranged on a surface of the electrode insulation layer and electrically connected to the source electrode or the drain electrode of the thin film transistor, and, a second touch electrode arranged on the surface of the electrode insulation layer and electrically connected to the first touch electrode.

Abstract: A method for manufacturing an OLED display screen integrated with a touch function is provided, which includes steps of providing a glass substrate, forming an insulating layer and a wiring circuit layer, forming an OLED light-emitting layer, forming a first insulating ceramic layer, forming a first insulating organic layer, forming a first touch electrode layer, forming a touch insulating ceramic layer, forming a wire through hole in the wiring region of the glass substrate, forming a second touch electrode layer; and forming a wire in the wiring region of the glass substrate, wherein the wire is to the wiring circuit layer through the wiring through hole.

Abstract: An evaporation source includes a casing, a crucible configured to receive evaporation material, a spray nozzle, a first heating wire, and a lifting mechanism. The casing includes a first end, a second end opposite the first end, and a transmission chamber disposed between the first end and the second end. The evaporation material forms a heating surface on a surface in the crucible when the evaporation material is heated in the crucible. The crucible is disposed in the casing and is positioned at the second end. The crucible is in communication with the transmission chamber. The spray nozzle is disposed at the first end and is in communication with the transmission chamber. The first heating wire is directly fixed in the casing and the first heating wire is positioned between the crucible and the spray nozzle. The lifting mechanism is movably connected to the casing.

Abstract: A method for manufacturing an OLED display screen integrated with a touch function is provided, which includes steps of providing a glass substrate, forming an insulating layer and a wiring circuit layer, forming an OLED light-emitting layer, forming a first insulating ceramic layer, forming a first insulating organic layer, forming a first touch electrode layer, forming a touch insulating ceramic layer, forming a wire through hole in the wiring region of the glass substrate, forming a second touch electrode layer; and forming a wire in the wiring region of the glass substrate, wherein the wire is to the wiring circuit layer through the wiring through hole.

Abstract: The present disclosure relates to a shadow mask assembly including a shadow mask film and a frame. The frame includes an outer wall, an inner wall arranged opposite to the outer wall, and a bonding surface connecting the outer wall and the inner wall, wherein the bonding surface bonds with the shadow mask film. The bonding surface includes a welding area and a tiling area, wherein the welding area and the tiling area are non-coplanar. The welding area is arranged between the tiling area and the outer wall. The frame is fixed on at least one edge of the shadow mask film via at least one solder joint arranged within the welding area. The tiling area is arranged between the welding area and the inner wall, and the tiling area is configured to support the shadow mask film and to maintain the shadow mask film to be a flat surface.