Patents by Inventor Xuyan YANG

Xuyan YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11975198
    Abstract: A nerve stimulator and a manufacturing method thereof. The nerve stimulator includes a glass substrate, and a plurality of metal pins provided on the substrate, wherein the metal pins form stimulation portions on one side of the substrate, and the density of the metal pins is greater than 15 Pin/mm2. The stimulation portions in the present nerve stimulator have a high density and a good stimulation effect. The processing method thereof is to cut out a high-density metal pin array first by using a metal underlayer, then the manufacturing method overcomes the deficiency in the prior art that it is rather difficult to manufacture a high density of nerve stimulation electrodes by using other substrates such as ceramics and the like.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: May 7, 2024
    Assignee: HANGZHOU NANOCHAP ELECTRONICS CO., LTD.
    Inventors: Jiawei Yang, Nhan Tran, Xuyan Yang
  • Patent number: 11478654
    Abstract: The present invention relates to the field of medical devices, and specifically to a packaging structure and a packaging method for a retinal prosthesis implanted chip, including a high-density stimulation electrode component processed by a glass substrate, wherein the stimulation electrode component comprises the glass substrate, and a plurality of stimulation electrodes and a pad structure provided on the glass substrate; the stimulation electrodes are formed through cutting out metal pins on the metal and then pouring with glass; the stimulation electrode component is connected to an ASIC chip; a glass packaging cover is covered on the ASIC chip, the glass packaging cover is provided with a metal feedthrough structure for communicating with the stimulation chip; and the packaging cover covers and encapsulates the pad structure.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: October 25, 2022
    Assignee: HANGZHOU NANOCHAP ELECTRONICS CO., LTD.
    Inventors: Jiawei Yang, Nhan Tran, Xuyan Yang
  • Publication number: 20200353259
    Abstract: A nerve stimulator and a manufacturing method thereof. The nerve stimulator includes a glass substrate, and a plurality of metal pins provided on the substrate, wherein the metal pins form stimulation portions on one side of the substrate, and the density of the metal pins is greater than 15 Pin/mm2. The stimulation portions in the present nerve stimulator have a high density and a good stimulation effect. The processing method thereof is to cut out a high-density metal pin array first by using a metal underlayer, then the manufacturing method overcomes the deficiency in the prior art that it is rather difficult to manufacture a high density of nerve stimulation electrodes by using other substrates such as ceramics and the like.
    Type: Application
    Filed: May 16, 2018
    Publication date: November 12, 2020
    Inventors: Jiawei YANG, Nhan TRAN, Xuyan YANG
  • Publication number: 20200353268
    Abstract: The present invention relates to the field of medical devices, and specifically to a packaging structure and a packaging method for a retinal prosthesis implanted chip, including a high-density stimulation electrode component processed by a glass substrate, wherein the stimulation electrode component comprises the glass substrate, and a plurality of stimulation electrodes and a pad structure provided on the glass substrate; the stimulation electrodes are formed through cutting out metal pins on the metal and then pouring with glass; the stimulation electrode component is connected to an ASIC chip; a glass packaging cover is covered on the ASIC chip, the glass packaging cover is provided with a metal feedthrough structure for communicating with the stimulation chip; and the packaging cover covers and encapsulates the pad structure.
    Type: Application
    Filed: May 16, 2018
    Publication date: November 12, 2020
    Inventors: Jiawei YANG, Nhan TRAN, Xuyan YANG