Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.

Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.

Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.

Abstract: Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include thiol terminal aliphatic compounds having carboxyl or sulfonic groups which enable deposition of silver rich binary silver-bismuth alloys having deposits which are matte to semi-bright, uniform and have a low coefficient of friction.

Abstract: Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include 5-membered heterocyclic nitrogen compounds with a thiol functionality which enable deposition of the silver rich binary silver-bismuth alloys. The silver rich silver-bismuth deposits are matte to semi-bright, uniform and have a low coefficient of friction.

Abstract: Silver-nickel alloy electroplating compositions and methods enable electroplating silver rich silver-nickel deposits which are bright, uniform and have a relatively low coefficient of friction. The binary silver-nickel alloy is deposited from an aqueous acid silver-nickel alloy electroplating composition. The aqueous acid silver-nickel alloy electroplating composition includes thiol compounds which shift the reduction potential of silver ions toward the reduction potential of nickel ions such that a silver rich binary silver-nickel layer is deposited on a substrate.

Abstract: Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include 5-membered heterocyclic nitrogen compounds with a thiol functionality which enable deposition of the silver rich binary silver-bismuth alloys. The silver rich silver-bismuth deposits are matte to semi-bright, uniform and have a low coefficient of friction.

Abstract: Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include thiol terminal aliphatic compounds having carboxyl or sulfonic groups which enable deposition of silver rich binary silver-bismuth alloys having deposits which are matte to semi-bright, uniform and have a low coefficient of friction.

Abstract: Silver-nickel alloy electroplating compositions and methods enable electroplating silver rich silver-nickel deposits which are bright, uniform and have a relatively low coefficient of friction. The binary silver-nickel alloy is deposited from an aqueous acid silver-nickel alloy electroplating composition. The aqueous acid silver-nickel alloy electroplating composition includes thiol compounds which shift the reduction potential of silver ions toward the reduction potential of nickel ions such that a silver rich binary silver-nickel layer is deposited on a substrate.

Abstract: A clock and data recovery (CDR) circuit includes an edge detector, an edge selector, and a phase selector. The edge detector is arranged to detect edges of serial input data and to provide an edge detection result. The serial input data is oversampled utilizing multiple clock phases. The edge selector for selecting one of the multiple clock phases for a recovered clock is arranged to provide an edge selection result, to receive the last edge selection result as a first input, and to receive the edge detection result as a second input. The phase selector is arranged to provide the recovered clock and recovered data.

Abstract: A plunger (22), used in a standard mold, has a movable piston (23) and spring (24) that reduce the cull space when piston (23) is pressed downward into the cull mold compound.

Abstract: A tie arrangement for securing the CRT board onto the CRT neck, includes a belt for tying to the CRT neck, at least two bridge members each having one end coupled to the belt and the other end passed through the corresponding holes on the CRT board and engaged with the corresponding stop buckles on the other side of the hole. Each stop buckle is provided with a hole for the bridge member to pass through and a tongue is formed in the hole for detachably engaging with the bridge member.

Abstract: An electric power cord with double-output terminal, comprising a casing formed of two symmetrical shells connected by bolts and retaining holes thereof, said symmetrical shells each having two arch-shaped vertical side walls symmetrically curving outwards at two opposite locations with a power input port therebetween and fastened with a first cable for connecting to a socket power and a straight vertical side wall at a right angle relative to said two arch-shaped vertical side walls and defined therewith two output ports fastened with a second cable and a third cable respectively for connecting said socket power to two separate electric appliances.

Abstract: A finger ring is provided with ringlets mounted in a multiple tier arrangement. The ringlets are rotatably mounted about a removable axle. Each ringlet is coupled to the axle by a ball bearing assembly which is secured to the inside diameter of each ringlet. According to this rotary mounting arrangement, the center of gravity of each ringlet is offset with respect to its axis of rotation about the axle. Momentum imparted to each ringlet causes the ringlets to undergo separate and independent rotary movements, with the relative rates of rotation depending upon relative mass differences of the respective ringlets.

Abstract: An illumination control system has a plurality of infrared detection systems located in a plurality of adjacent scanning areas. Each of the detection systems controls the activation of light sources located in two or more scanning areas. Each of the detection systems is equipped with an infrared radiation sensor, an ambient light resistor, a timing circuit, a light source driving circuit, and a blinking condition prevention circuit.

Abstract: A timer controlled fire and burglar alarm system using an economical circuit design and battery for prolonged and effective functioning and includes a thermo-electric infrared sensor, a filter and an amplifier to detect signal, a plurality of time priority circuits, a time-delay circuit, a timer controlled alarm setting circuit and timers with time display for setting and disarming of an alert condition and/or driving peripheral devices so as to function as a fire alarm, a burglar alarm and a visitor detection system.

Abstract: Mechanical methods for reducing drastically the energy consumption of high pressure liquid pumping.The basic method is to utilize high pressure vapor at the suction side of the pump to reduce the required pumping pressure head. The energy content of the high pressure vapor is returned or utilized. Disclosed high efficiency heat exchangers and expansion absorbing vessels are provided to reduce energy requirement for transferring liquid to a vapor generator, a high pressure apparatus and a extended pipe line.

Abstract: Mechanical methods for reducing drastically the energy consumption of high pressure liquid pumping and for eliminating the use of expensive multi-tube heat exchangers.The basic method is to utilize high pressure vapor at the suction side of the pump to reduce the required pumping pressure head. The energy content of the high pressure vapor is returned or utilized. Additional methods are provided to reduce energy requirement for transferring liquid to vapor generator, apparatus located at high elevation and apparatus having high pressure resistance.

Abstract: A mechanical arrangement to reduce drastically the energy consumption for pumping condensate to feed high pressure vapor generators for power generation, industrial processing, and heating systems. Involved is a method to pump the condensate into one condensate receiver located at the sucton side of the condensate feed pump, and to bleed high pressure vapor from the vapor generator into the condensate receiver for imposing a pressure head upon the condensate therein to be approximately the same as that in the generator, and thus the pressure difference between the suction side and the discharge side of the pump is also drastically reduced while pumping the condensate into the generator, with the result that the energy consumption of the pump is also drastically reduced. The receiver is full of high pressure vapor while the condensate therein is drained by the pump, and the high pressure vapor means energy.