Patents by Inventor Yüksel TEMIZ

Yüksel TEMIZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POST-CMOS PROCESSING AND 3D INTEGRATION BASED ON DRY-FILM LITHOGRAPHY
    Publication number: 20150371978
    Abstract: A method for performing a post processing pattern on a diced chip having a foot-print, comprises the steps of providing a support wafer; applying a first dry film photoresist to the support wafer; positioning a mask corresponding to the footprint of the diced chip on the first dry film photoresist; expose the mask and the first dry film photoresist to UV radiation; remove the mask; photoresist develop the exposed first dry film photoresist to obtain a cavity corresponding to the diced chip; positioning the diced chip inside the cavity; applying a second dry film photoresist to the first film photoresist and the diced chip; and expose and develop the second dry film photoresist applied to the diced chip in accordance with the post processing pattern.
    Type: Application
    Filed: July 19, 2013
    Publication date: December 24, 2015
    Applicant: ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
    Inventors: Carlotta GUIDUCCI, Yusuf LEBLEBICI, Yüksel TEMIZ