Patents by Inventor Yí Li

Yí Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Architecture and processes to enable high capacity memory packages through memory die stacking
    Patent number: 11456281
    Abstract: Embodiments include electronic packages and methods of forming such packages. An electronic package includes a memory module comprising a first memory die. The first memory die includes first interconnects with a first pad pitch and second interconnects with a second pad pitch, where the second pad pitch is less than the first pad pitch. The memory module also includes a redistribution layer below the first memory die, and a second memory die below the redistribution layer, where the second memory die has first interconnects with a first pad pitch and second interconnects with a second pad pitch. The memory module further includes a mold encapsulating the second memory die, where through mold interconnects (TMIs) provide an electrical connection from the redistribution layer to mold layer. The TMIs may be through mold vias. The TMIs may be made through a passive interposer that is encapsulated in the mold.
    Type: Grant
    Filed: September 29, 2018
    Date of Patent: September 27, 2022
    Assignee: Intel Corporation
    Inventors: Yí Li, Zhiguo Qian, Prasad Ramanathan, Saikumar Jayaraman, Kemal Aygun, Hector Amador, Andrew Collins, Jianyong Xie, Shigeki Tomishima