Abstract: A calibration tool for calibrating the leveling and tilting of a wafer transporting blade and a method for using such tool are provided. The calibration tool is constructed by a body portion and a leg portion each having a surface that are provided with a multiplicity of calibration lines facing each other such that a two-dimensional calibration can be performed on a blade simultaneously by positioning the blade between the body portion and the leg portion. The capability of measuring a plane, i.e., leveling and tilting, simultaneously is a great benefit made possible by the present invention method and apparatus.

Abstract: In accordance with the present invention, a wet bench processing apparatus equipped with a rapid drain and rinse system is provided. The system stores reserved liquids and air pressure during normal operation for use during a situation where a power or mechanical failure may occur. When such a failure occurs, a controller unit, which is connected to an uninterrupted power supply or other types of energy storage devices, provides an electrical control signal to a solenoid actuated valve. The solenoid actuated valve receives a pneumatic input that is received from a pressurized air reservoir. When the electrical signal is received by the solenoid actuated valve, the reserved pneumatic pressure is released to operate one or more valves. A reservoir of rinse fluid is provided such that when one of the valves is activated by the solenoid actuated valve, gravity forces rinse fluid through the valve and into the tank to remove the chemicals from the wafers.