Patents by Inventor Y. M. Tsui

Y. M. Tsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming zig-zag bordered openings in semiconductor structures and structures formed
    Patent number: 6316835
    Abstract: The present invention discloses a via plug formed in a zig-zag bordered opening in a semiconductor structure wherein the film stress in a barrier/glue layer TiN can be significantly reduced to eliminate the occurrence of volcano defect in which delamination or peeling of the TiN layer from the contact opening occurs. The via plug can be formed in a process by providing a mask that has a desirable zig-zag pattern during a photomasking step performed on the semiconductor device.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: November 13, 2001
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd
    Inventors: C. H. Chen, Y. C. Chao, Y. M. Tsui, W. R. Chang
  • Method for forming zig-zag bordered openings in semiconductor structures
    Patent number: 5874356
    Abstract: The present invention discloses a method for forming a zig-zag bordered opening in a semiconductor structure such that the film stress in a barrier/glue layer of TiN can be significantly reduced to eliminate the occurrence of volcano defect in which delamination or peeling-off of the TiN layer from the contact opening occurs. The method can be easily carried out by providing a mask that has a desirable zig-zag pattern during a photomasking step performed on the semiconductor device.
    Type: Grant
    Filed: February 28, 1997
    Date of Patent: February 23, 1999
    Assignee: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: C. H. Chen, Y. C. Chao, Y. M. Tsui, W. R. Chang