Patents by Inventor Ya-Chen Lin

Ya-Chen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120121889
    Abstract: The composite film contains a carrier layer, a release layer dispersed with a number of particles, a hardening layer, an ink layer, and an adhesive layer, stacked in this sequential order. The diameters of at least a portion of the particles are larger than the thickness of the release layer. A manufacturing method of the composite file is provided as well.
    Type: Application
    Filed: November 17, 2010
    Publication date: May 17, 2012
    Inventors: Ting-Chu Hsu, Shun-Cheng Wang, Wan-Sen Lu, Heng-Yueh Su, Ya-Chen Lin